公开(公告)号：US09468105B2

公开(公告)日：2016-10-11

申请号：US14659178

申请日：2015-03-16

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu Kondo

IPC: H03L1/02 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/18 ,  H05K1/0212 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10515 ,  H05K2201/10553 ,  H05K2201/1056

Abstract: An electronic component includes a pedestal plate that has a first surface made of a metal and a second surface being an opposite surface to the first surface, a heating element arranged on the first surface of the pedestal plate, and a resonator element arranged on the heating element. The pedestal plate overlaps the resonator element in a plan view.

Abstract translation: 一种电子部件，包括具有由金属构成的第一表面和与第一表面相反的表面的第二表面的基座板，布置在基座板的第一表面上的加热元件和布置在加热器上的谐振元件 元件。 基座板在平面图中与谐振器元件重叠。

公开(公告)号：US09360378B2

公开(公告)日：2016-06-07

申请号：US14395467

申请日：2013-04-03

Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S.) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： Sylvain Ballandras ,  Bruno Francois

IPC: H05K7/00 ,  G01K11/26 ,  H05K1/02 ,  B23K1/00 ,  H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K1/05 ,  H05K3/10 ,  H05K3/34

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2101/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical device includes a first electrical component and a second electrical component connected to each other via an electrical connection having an electrically insulating support plate and a weld joint deposited on the support plate. The weld joint has a melting temperature (Ta) significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection are subjected. The electrical device includes cement that completely covers the exposed weld joint. The material of the cement is chosen to maintain its adhesion and its tightness with respect to the weld joint when the Ta is applied.

Abstract translation: 电气设备包括通过电连接彼此连接的第一电气部件和第二电气部件，该电气连接具有电绝缘支撑板和沉积在支撑板上的焊接接头。 焊接接头具有明显低于两个电气部件和电连接中的至少一个所承受的环境工作温度（Ta）的熔化温度（Ta）。 电气设备包括完全覆盖暴露的焊接接头的水泥。 当施加Ta时，选择水泥的材料以保持其粘合性和相对于焊接接头的密封性。

公开(公告)号：US20160021752A1

公开(公告)日：2016-01-21

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro MIYAO ,  Hideki ISHIGAMI ,  Yukihiko SHIOHARA ,  Tetsuya OTSUKI ,  Hidefumi NAKAMURA

IPC: H05K1/18 ,  H05K5/00 ,  C04B41/88

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

Abstract translation: 封装基座包括封装体基体和在封装基体上以平面图形式设置成框状或环形的接合金属层，其中，接合金属层含有含有Ti-Ag-Cu的合金和属于金属的金属 到周期表中的第6组。

公开(公告)号：US20150036304A1

公开(公告)日：2015-02-05

申请号：US14326071

申请日：2014-07-08

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi YAMAUCHI ,  Osamu KAWACHI

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H01L21/561 ,  H01L23/04 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/181 ,  H03H9/02913 ,  H03H9/1007 ,  H03H9/1085 ,  H03H2009/0019 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0305 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10537 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

Abstract translation: 电子设备包括：布线基板; 通过凸块倒装安装在布线基板的上表面上的多个器件芯片具有露出器件芯片与布线基板的上表面之间的凸块的间隙，并且包括至少一个器件芯片， 具有大于所述布线基板的热膨胀系数的热膨胀系数的基板; 连接到所述多个器件芯片的接合衬底，并且具有等于或小于所述至少一个器件芯片中包括的衬底的热膨胀系数的热膨胀系数; 以及覆盖接合基板的密封件，并且密封多个器件芯片。

公开(公告)号：US20130307636A1

公开(公告)日：2013-11-21

申请号：US13759402

申请日：2013-02-05

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kanehisa KIMBARA ,  Osamu KAWACHI

IPC: H03H9/70

CPC classification number: H03H9/46 ,  H03H9/0542 ,  H03H9/70 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10204 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package.

Abstract translation: 复合电子部件包括：电路板; 包括声波滤波器并且位于电路板的顶表面上的封装; 位于电路板的顶表面上的虚拟封装; 以及位于包装和虚拟包装上方的盖子。

公开(公告)号：US07821346B2

公开(公告)日：2010-10-26

申请号：US12229114

申请日：2008-08-20

Applicant: Jeffrey A. McCracken

Inventor： Jeffrey A. McCracken

IPC: H03B1/00 ,  H03B5/32 ,  H03L1/02

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：US07646255B2

公开(公告)日：2010-01-12

申请号：US11985132

申请日：2007-11-14

Applicant: Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

Inventor： Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

IPC: H03B5/12

CPC classification number: H03B5/1847 ,  H03B2200/0008 ,  H03B2200/0034 ,  H03B2200/004 ,  H05K1/0243 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10734

Abstract: A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

Abstract translation: 压控振荡器（VCO）组件和模块结合有球栅阵列谐振器作为压控振荡器的电路的一部分。 VCO模块优选地至少包括振荡器电路，振荡电路和输出缓冲级电路，其全部由包括安装到印刷电路板的球栅阵列谐振器的多个互连的电气/电子部件限定。 在另一个实施例中，振荡器组件还包括至少部分地由安装到印刷电路板的集成电路限定的锁相环电路。

公开(公告)号：US07541883B2

公开(公告)日：2009-06-02

申请号：US11598491

申请日：2006-11-13

Applicant: Thomas A. Knecht ,  Robert Jacobson ,  Glen Reeser

Inventor： Thomas A. Knecht ,  Robert Jacobson ,  Glen Reeser

IPC: H03B5/18 ,  H03L7/099

CPC classification number: H03B5/1805 ,  H03B5/1221 ,  H03B5/1231 ,  H03B5/1243 ,  H03L7/06 ,  H03L7/099 ,  H03L7/16 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10689

Abstract: A synthesizer module/oscillator assembly includes a voltage controlled oscillator with a coaxial resonator. In one embodiment, the module measures 20.3 mm×14.8 mm×3.9 mm and the coaxial resonator is positioned on the circuit board of the module between a phase locked loop integrated circuit and a main section of the voltage controlled oscillator. The phase locked loop circuit includes a loop filter and is adapted to receive the frequency signal generated by the voltage controlled oscillator and generate an adjusted frequency signal.

Abstract translation: 合成器模块/振荡器组件包括具有同轴谐振器的压控振荡器。 在一个实施例中，该模块测量为20.3mm×14.8mm×3.9mm，并且同轴谐振器位于模块的电路板之间的锁相环集成电路和压控振荡器的主要部分之间。 锁相环电路包括环路滤波器，并且适于接收由压控振荡器产生的频率信号并产生经调整的频率信号。

公开(公告)号：US20030095019A1

公开(公告)日：2003-05-22

申请号：US09999068

申请日：2001-11-19

Inventor： Allen M. Hobbs ,  Dennis R. Clark

IPC: H01P007/04

CPC classification number: H01P7/04 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10969

Abstract: A resonator including a resonator body having a longitudinally extending through hole, an electrically conductive coating formed on the inner and outer surfaces of the resonator and an electrical gap formed by cutting a groove around the circumference of the body. The groove divides the resonator body into a short section and a long section, wherein the short section is used as a conductive pad for attachment to a circuit board.

Abstract translation: 包括具有纵向延伸的通孔的谐振器体的谐振器，形成在谐振器的内表面和外表面上的导电涂层以及通过围绕本体的圆周切割凹槽而形成的电隙。 该槽将谐振器体分为短截面和长截面，其中短截面用作连接到电路板的导电垫。

公开(公告)号：US06369335B1

公开(公告)日：2002-04-09

申请号：US09525075

申请日：2000-03-14

Applicant: Masaya Wajima

Inventor： Masaya Wajima

IPC: H01N909

CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  Y10T29/49137 ,  H01L2924/00

Abstract: A method for manufacturing substrate elements includes providing a mother substrate, forming at least one elongated through-hole on the mother substrate such that an entire longitudinal end surface of the first substrate element and a portion of a lateral surface of the second substrate element are exposed, forming an electrode pattern on the inner surface of the at least one elongated through-hole, and cutting the mother substrate along lines extending in the vicinity of the longitudinal ends of the at least one elongated through-hole and in a direction that is substantially perpendicular to the longitudinal axis of the elongated through-hole.

Abstract translation: 一种用于制造衬底元件的方法包括：提供母体衬底，在母体衬底上形成至少一个细长的通孔，使得第一衬底元件的整个纵向端表面和第二衬底元件的侧表面的一部分露出 在所述至少一个细长通孔的内表面上形成电极图案，并且沿着在所述至少一个细长通孔的纵向端部附近延伸的线沿着基本上 垂直于细长通孔的纵向轴线。