Abstract:
A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.
Abstract:
To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.
Abstract:
Ce support de composant, pour fixation dudit composant (100) à un circuit imprimé (8), est réalisé au moyen d'un matériau rendu solidaire dudit composant, dans lequel est noyé un fil de maintien (5) dont les extrémités (6, 7) dépassant dudit matériau peuvent être rabattues pour former deux pattes supplémentaires de maintien et de fixation dudit composant au circuit imprimé.
Abstract:
This invention relates to a right-angle light-emitting diode assembly with snap-in feature wherein an insulating body (12), generally in the shape of a rectangular parallelepiped, no larger than a finger nail, holds a light-emitting diode (14) in the body at right-angles to the surface of a printed wiring board, the body being shaped such that robotic equipment can be used to mount the diode assembly cheaply and efficiently on the board. The body has front and back generally parallel surfaces, top and bottom generally parallel surfaces, and first and second generally parallel side surfaces, the respective surfaces having grooves and protuberances to allow the light-emitting diode (LED) to be fixedly mounted in the body, and the body to be inserted into a printed wiring board which can then be wave soldered without deleterious effects on the LED or supporting body. The bottom of the body has two oppositely faced snap-in protuberances (16) which pass through the hole on a printed wiring board, which deform inwardly slightly while passing through the hole and which resile after extending beyond the hole to fix the diode assembly in the correct position on the board.
Abstract:
The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.
Abstract:
An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.
Abstract:
A rechargeable battery pack includes a plurality of battery cells, a connection tab electrically coupled to one or more terminals of the battery cells, a connection plate electrically coupled to the connection tab, and having an opening for accommodating a protruding portion of the connection tab, and a protective circuit module electrically coupled to the connection plate, and having a combination groove, wherein the connection plate is on a first surface of the protective circuit module to face the combination groove, and wherein the first surface of the protective circuit module faces the connection tab.
Abstract:
A flexible printed circuit board (FPCB) includes at least one signal pad part disposed at each of a top and bottom of a flexible substrate base and configured to include an upper signal pad and a lower signal pad and a through hole formed at a portion corresponding to a signal via, a signal line disposed at the top of the substrate base, and extending from the upper signal pad along a length direction of the substrate base, an upper ground pad disposed at the top of the substrate base to be separated from the upper signal pad and the signal line near the upper signal pad, and a lower ground pad disposed at the bottom of the substrate base to be separated from the lower signal pad near the lower signal pad, and connected to the upper ground pad through a ground via.
Abstract:
A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.