公开(公告)号：EP1983810A2

公开(公告)日：2008-10-22

申请号：EP08153927.2

申请日：2008-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Venkatesan, Sathur ,  Wittmer, Philip W.

IPC: H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

Abstract translation: 一种用于稳定具有主体的电气部件和从主体突出并被接收在限定在基板中的通孔中的电引线的方法，同时避免了在组装电气封装期间分配热熔粘合剂相关的缺点，包括提供 具有用于接收引线电气部件的引线的通孔的电路基板，提供具有主体的电气部件和从主体延伸的引线，将预成型的热熔粘合剂定位在电路基板上或电气部件上， 电子元件，使得引线延伸到通孔中，使得预成型的热熔性粘合剂位于电气部件的主体和基板之间并填充电气部件的主体之间的间隙，并且激活和固化热熔粘合剂， 熔融粘合剂以将电组件的主体牢固地粘附到基底上。

公开(公告)号：EP0924764A3

公开(公告)日：2000-03-08

申请号：EP98121912.4

申请日：1998-11-18

Applicant: Hitachi, Ltd. ,  Hitachi ULSI Systems Co.,Ltd.

Inventor： Azuma, Shuichiro ,  Okinaga, Takayuki ,  Emata, Takashi ,  Kudaishi, Tomoaki ,  Wada, Tamaki ,  Nishi, Kunihiko ,  Masuda, Masachika ,  Sugano, Toshio

IPC: H01L25/065 ,  H01L23/495

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

公开(公告)号：EP0393568B1

公开(公告)日：1993-10-06

申请号：EP90107231.4

申请日：1990-04-17

Applicant: ALCATEL CIT

Inventor： Santurette, Jean-Pierre

IPC: H05K3/30 ,  H05K7/12

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10606

公开(公告)号：EP0393568A1

公开(公告)日：1990-10-24

申请号：EP90107231.4

申请日：1990-04-17

Applicant: ALCATEL CIT

Inventor： Santurette, Jean-Pierre

IPC: H05K3/30 ,  H05K7/12

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10606

Abstract: Ce support de composant, pour fixation dudit composant (100) à un circuit imprimé (8), est réalisé au moyen d'un matériau rendu solidaire dudit composant, dans lequel est noyé un fil de maintien (5) dont les extrémités (6, 7) dépassant dudit matériau peuvent être rabattues pour former deux pattes supplémentaires de maintien et de fixation dudit composant au circuit imprimé.

Abstract translation: 该组件支持，用于紧固所述组件（100）到印刷电路（8）产生的通过的材料制成的装置，它被嵌入一个保留所有其被牢固地附接到所述部件，电线中的所有（5），其端部（6， 7）延伸超过所述材料可以形成用于保持和所述部件固定到所述印刷电路两个附加的固定元件被折叠过来。

公开(公告)号：EP0342961A2

公开(公告)日：1989-11-23

申请号：EP89304997.3

申请日：1989-05-17

Applicant: XEROX CORPORATION

Inventor： Lang, John M.

IPC: H01L33/00 ,  H05K1/18

CPC classification number: H05K3/301 ,  H01L33/483 ,  H01R12/58 ,  H01R12/7064 ,  H01R13/7175 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10606 ,  Y10S362/80

Abstract: This invention relates to a right-angle light-emitting diode assembly with snap-in feature wherein an insulating body (12), generally in the shape of a rectangular parallelepiped, no larger than a finger nail, holds a light-emitting diode (14) in the body at right-angles to the surface of a printed wiring board, the body being shaped such that robotic equipment can be used to mount the diode assembly cheaply and efficiently on the board. The body has front and back generally parallel surfaces, top and bottom generally parallel surfaces, and first and second generally parallel side surfaces, the respective surfaces having grooves and protuberances to allow the light-emitting diode (LED) to be fixedly mounted in the body, and the body to be inserted into a printed wiring board which can then be wave soldered without deleterious effects on the LED or supporting body. The bottom of the body has two oppositely faced snap-in protuberances (16) which pass through the hole on a printed wiring board, which deform inwardly slightly while passing through the hole and which resile after extending beyond the hole to fix the diode assembly in the correct position on the board.

Abstract translation: 本发明涉及一种具有卡扣特征的直角发光二极管组件，其特征在于绝缘体（12）通常为长方体形状，不大于指甲，保持发光二极管（14） ）在主体中与印刷电路板的表面成直角的角度，该主体被成形为使得机器人设备可以用于在二极管组件上廉价且有效地安装二极管组件。 主体具有前后大致平行的表面，顶部和底部大致平行的表面，以及第一和第二大致平行的侧表面，各个表面具有凹槽和凸起，以允许发光二极管（LED）固定地安装在主体 ，以及要插入印刷电路板的主体，然后可以对LED或支撑体进行波浪焊接，而不产生有害影响。 本体的底部具有两个相对面的卡入突起（16），该突出部穿过印刷电路板上的孔，该印刷电路板在穿过该孔之后向内略微变形，并且在延伸超过孔之后将其固定在二极管组件中 在板上的正确位置。

公开(公告)号：US09980384B2

公开(公告)日：2018-05-22

申请号：US14407405

申请日：2013-06-21

Applicant: KYOCERA Corporation

Inventor： Yoshio Ohashi ,  Kunihide Shikata

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/38 ,  C04B37/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

公开(公告)号：US20160344119A1

公开(公告)日：2016-11-24

申请号：US14714916

申请日：2015-05-18

Applicant: Autoliv ASP, Inc.

Inventor： Boris G. Karasik ,  William M. Leach

IPC: H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。

公开(公告)号：US20140205864A1

公开(公告)日：2014-07-24

申请号：US14019486

申请日：2013-09-05

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sang-Il Yi ,  Moon-Gil Kang

IPC: H01M2/34

CPC classification number: H01M2/34 ,  H01M2/105 ,  H01M2/204 ,  H01M10/425 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10916 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: A rechargeable battery pack includes a plurality of battery cells, a connection tab electrically coupled to one or more terminals of the battery cells, a connection plate electrically coupled to the connection tab, and having an opening for accommodating a protruding portion of the connection tab, and a protective circuit module electrically coupled to the connection plate, and having a combination groove, wherein the connection plate is on a first surface of the protective circuit module to face the combination groove, and wherein the first surface of the protective circuit module faces the connection tab.

Abstract translation: 可再充电电池组包括多个电池单元，电连接到电池单元的一个或多个端子的连接凸片，电连接到连接凸片的连接板，并具有用于容纳连接凸片的突出部分的开口， 以及保护电路模块，电连接到所述连接板，并且具有组合凹槽，其中所述连接板位于所述保护电路模块的面对所述组合凹槽的第一表面上，并且其中所述保护电路模块的第一表面面向 连接标签。

公开(公告)号：US20140099123A1

公开(公告)日：2014-04-10

申请号：US14044226

申请日：2013-10-02

Applicant: Electronics and Telecommunications Research Institute

Inventor： Sae-Kyoung KANG ,  Joon-Ki LEE ,  Joon-Young HUH

IPC: H04B10/40

CPC classification number: H04B10/40 ,  G02B6/4281 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/189 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10462

Abstract: A flexible printed circuit board (FPCB) includes at least one signal pad part disposed at each of a top and bottom of a flexible substrate base and configured to include an upper signal pad and a lower signal pad and a through hole formed at a portion corresponding to a signal via, a signal line disposed at the top of the substrate base, and extending from the upper signal pad along a length direction of the substrate base, an upper ground pad disposed at the top of the substrate base to be separated from the upper signal pad and the signal line near the upper signal pad, and a lower ground pad disposed at the bottom of the substrate base to be separated from the lower signal pad near the lower signal pad, and connected to the upper ground pad through a ground via.

Abstract translation: 柔性印刷电路板（FPCB）包括设置在柔性基板基底的顶部和底部的每一个处的至少一个信号焊盘部分，并被配置为包括上部信号焊盘和下部信号焊盘以及形成在对应部分的部分的通孔 信号通孔，设置在基板顶部的信号线，并且沿着基板基底的长度方向从上信号焊盘延伸;上接地焊盘，设置在基板基座的顶部，以与基板基板分离; 上信号焊盘和靠近上信号焊盘的信号线，以及设置在基板底部的下接地焊盘，以与下信号焊盘附近的下信号焊盘分离，并通过地面连接到上接地焊盘 通过。

公开(公告)号：US20130140079A1

公开(公告)日：2013-06-06

申请号：US13817964

申请日：2011-08-23

Applicant: Tatsuya Nakamura

Inventor： Tatsuya Nakamura

IPC: H01G2/10

CPC classification number: H01G2/10 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651

Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.

Abstract translation: 一种电容器保持器，包括形成为能够安装电容器的尖端的形状的主体部分; 以及引导部，其固定到主体部并且可以被焊接到预定的配合位置。 主体部分具有露出电容器的前端的开口，以及当电容器的前端装配到电容器的前端时与端子表面抵接部分邻接电容器的顶端表面 身体部位。 引线部分相对于参考平面固定在与电容器相对的位置处的主体部分，该基准面是包括抵靠端表面抵接部分的电容器的末端表面的平面。