公开(公告)号：DE102005043557A1

公开(公告)日：2006-09-28

申请号：DE102005043557

申请日：2005-09-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  FUERGUT EDWARD ,  POHL JENS ,  BAUER MICHAEL ,  HEITZER LUDWIG

IPC: H01L23/50 ,  H01L21/50 ,  H01L25/065

Abstract: Device has a through contact (2) arranged in an end region (5) of the device. A semiconductor chip is partly embedded in a plastic frame ground (10). Contact surfaces (11) on an active topside of the chip stay in electrical communication with the contact, which is arranged in a prefabricated through contact flat rod (15). The rod is positioned in the end region, and exhibits a through opening (16) filled with metal. An independent claim is also included for a method for manufacturing a semiconductor device that includes a through contact.

公开(公告)号：DE102005005750A1

公开(公告)日：2006-08-17

申请号：DE102005005750

申请日：2005-02-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  HAIMERL ALFRED ,  SCHOBER WOLFGANG ,  BAUER MICHAEL ,  KESSLER ANGELA

IPC: C09J5/00 ,  B29C65/02 ,  B29C70/70 ,  B32B27/08 ,  C08J5/00

公开(公告)号：DE102005005749A1

公开(公告)日：2006-08-17

申请号：DE102005005749

申请日：2005-02-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  BAUER MICHAEL ,  ESCHER-POEPPEL IRMGARD

IPC: H01L23/488 ,  H01L23/50

Abstract: The component has surface-mountable external contacts (1) arranged on external contact connecting surfaces in its lower side. The connecting surfaces consist of a recess in its respective middle area, where the recess consists of a dovetail profile. Surface extension of the recess is smaller than a maximum cross section of external contacts. The recess has a circular form edges in the connecting surfaces. An independent claim is also included for a method for manufacturing a semiconductor component.

公开(公告)号：DE102005021653A1

公开(公告)日：2006-07-13

申请号：DE102005021653

申请日：2005-05-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  WOERNER HOLGER ,  JEREBIC SIMON ,  BAUER MICHAEL ,  ESCHER-POEPPEL IRMGARD

IPC: H01L21/58 ,  H01L21/60

Abstract: Surface mounted semiconductor components (1) comprises plastics housing (2) and solder balls (3) as outer contacts (4) on its underside (5), which contains layer (6) of soft solder (7) in edge region (8) of semiconductor component underside.Preferably, soft solder layer is mounting spacer of solder balls of component during its fitting on circuit board. Typically, soft solder layer is shaped like through ring (9) surrounding solder balls. Independent claims are included for circuit board and manufacturing method of surface mounted semiconductor component.

公开(公告)号：DE102004043663B4

公开(公告)日：2006-06-08

申请号：DE102004043663

申请日：2004-09-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: H01L23/04 ,  G01L9/00

Abstract: A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.

公开(公告)号：DE102004058876B3

公开(公告)日：2006-05-24

申请号：DE102004058876

申请日：2004-12-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  VILSMEIER HERMANN ,  JEREBIC SIMON ,  BAUER MICHAEL

IPC: H01L21/58

Abstract: The method involves applying a supporting and a transporting foil on an adhesive layer (1) applied on rear side of semiconductor chips (2). A protective foil is removed from an active top side (8) of the chips. The coated semiconductor chips with the adhesive layer are taken off from a non-hardened adhesive (10) of the foil under forcing a bond bridge (4) of a semiconductor wafer material along separation slots.

公开(公告)号：DE102004040414A1

公开(公告)日：2006-03-02

申请号：DE102004040414

申请日：2004-08-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  BAUER MICHAEL ,  STEINER RAINER

IPC: H01L21/60 ,  H01L23/50

Abstract: A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.

公开(公告)号：DE102004054147A1

公开(公告)日：2006-02-23

申请号：DE102004054147

申请日：2004-11-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  JEREBIC SIMON

IPC: H01L21/304 ,  H01L21/58 ,  H01L21/78

Abstract: The semi conductor chips [2] are first located on a protective foil and an adhesive foil [4] placed in position together with a transport foil [9]. The adhesive is of a type that can be hardened by exposure to radiation. The gap [11] between the chips is not hardened and allows separation of the individual chips.

公开(公告)号：DE102004022884A1

公开(公告)日：2005-12-08

申请号：DE102004022884

申请日：2004-05-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  WOERNER HOLGER ,  JEREBIC SIMON ,  BAUER MICHAEL

IPC: H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/50

公开(公告)号：DE10245451B4

公开(公告)日：2005-07-28

申请号：DE10245451

申请日：2002-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  BIRZER CHRISTIAN ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H01L23/485 ,  H01L23/48 ,  H01L21/50

Abstract: The top metallization layer (4) of the semiconductor chip has fixed contact surfaces (5) carrying a layer (6) of elastomeric embedding mass (7) with electroconducting components (8). A dimensionally-stable contact plate (9) is embedded in the mass by its underside (10) and edges (11, 12). The underside of the contact plate is electrically connected by the electroconducting components of the embedding mass with the contact surfaces of the semiconductor chip. An Independent claim is included for the corresponding method of manufacture.