公开(公告)号：WO2011056491A1

公开(公告)日：2011-05-12

申请号：PCT/US2010/053904

申请日：2010-10-25

Applicant: PANDUIT CORP. ,  STRAKA, Frank, M. ,  TELLAS, Ronald, L.

Inventor： STRAKA, Frank, M. ,  TELLAS, Ronald, L.

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H01R4/2425 ,  H01R13/6625 ,  H01R13/6658 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/118 ,  H05K1/147 ,  H05K1/162 ,  H05K2201/09172 ,  H05K2201/09672 ,  H05K2201/10189 ,  Y10S439/941

Abstract: A communication Jack has a housing with a face having a plug receiving aperture. A conductive path pairs extends from corresponding plug interface contacts located at the plug receiving aperture to corresponding output terminate. A first circuit board is connected to the plug interface contacts and a second circuit board is connected to the plug Interface contacts and the output terminals. The first circuit board has a first single stage of crosstalk compensation with opposite polarity of the crosstalk of a plug for a first combination of the conductive path pairs. The second circuit board includes a second single stage of opposite polarity crosstalk compensation for some of the conductive path pairs not compensated on the first circuit board. The stages cancel substantially ail of the crosstalk caused by the plug, for the signal operating frequencies, for corresponding combinations of the conductive path pairs.

Abstract translation: 通信插孔具有带有插头接收孔的面的外壳。 导电路径对从位于插头接收孔处的相应插头接口触头延伸到对应的输出端。 第一电路板连接到插头接口触点，第二电路板连接到插头接口触点和输出端子。 第一电路板具有与导电路径对的第一组合的插头的串扰极性相反的串扰补偿的第一单级。 第二电路板包括用于在第一电路板上未补偿的一些导电路径对的相反极性串扰补偿的第二单级。 针对信号工作频率，对于导电路径对的相应组合，这些级基本上消除了由插头产生的串扰。

公开(公告)号：WO2009043649A2

公开(公告)日：2009-04-09

申请号：PCT/EP2008/061346

申请日：2008-08-28

Applicant: CONTINENTAL AUTOMOTIVE GMBH ,  BERNHARDT, Andreas ,  DEML, Ulrich ,  GÖTTE, Carsten ,  SCHINGALE, Angelika

Inventor： BERNHARDT, Andreas ,  DEML, Ulrich ,  GÖTTE, Carsten ,  SCHINGALE, Angelika

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/141 ,  H05K1/181 ,  H05K1/183 ,  H05K1/184 ,  H05K3/301 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/1059

Abstract: Die Erfindung betrifft einen dreidimensionalen elektrischen Schaltungsträgeraufbau mit mindestens zwei miteinander in Verbindung stehenden planaren, zweidimensionalen Substratplatten, die Kontaktierungselemente aufweisen und vorzugsweise beidseitig mit elektronischen Bauteilen bestückt sind, wobei die Substratplatten Substratplatten-Wandungen bilden, die in einem Winkel

Abstract translation: 本发明涉及一种具有至少两个相互连接的平面的，其具有触点接通二维基底板的三维电路支撑结构，并且在两侧上具有电子元件优选地装备，其特征在于，其被布置成一个角度<180°彼此衬底板形式的基底板墙壁， 有利地设置，导致具有基底板的壁，并且其中电导体装置之间产生的开放空间的三维空间形本体，其进行从基板板壁电流到相邻基底板壁，以及具有这样的电路支撑结构的电路基体支承和三维电路装置， 由至少两个这种三维电路载体构造的的。

公开(公告)号：WO1992003033A1

公开(公告)日：1992-02-20

申请号：PCT/US1991004435

申请日：1991-06-21

Applicant: MOTOROLA, INC.

Inventor： MOTOROLA, INC. ,  MORRISON, Andrew, T. ,  MULLINS, Aaron, B.

IPC: H05K07/20

CPC classification number: H05K1/0271 ,  H05K1/0243 ,  H05K1/116 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/1006

Abstract: A circuit carrying substrate (108) accommodates circuit components (102) with different coefficients of expansion and contraction from that of the circuit carrying substrate (108). Beneath such components (102) a plurality of slots (104) are formed so as to minimize the effects of such differing coefficients of expansion and contraction.

Abstract translation: 电路承载衬底（108）容纳具有与电路承载衬底（108）的膨胀和收缩不同的膨胀和收缩系数的电路部件（102）。 在这些部件（102）的下方形成有多个槽（104），以便使这种不同的膨胀和收缩系数的影响最小化。

公开(公告)号：KR1020080085399A

公开(公告)日：2008-09-24

申请号：KR1020070026848

申请日：2007-03-19

Applicant: 엘지이노텍 주식회사

Inventor： 박준석

IPC: G02F1/13357 ,  G02F1/1345 ,  H01L33/00 ,  H05K7/14

CPC classification number: H05K1/142 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/10106

Abstract: An LED(Light-Emitting Diode) and a backlight unit comprising the same are provided to replace only a PCB(Printed Circuit Board) having defects easily when the corresponding PCB has defects. Two PCBs(111,121) are joined to each other by concave and convex portions(117,127) formed on respective lateral surfaces thereof. The PCBs have a plurality of LEDs(113,123). Molding parts(115,125) are formed on the LEDs. The molding parts control propagation directions of lights emitted from the LEDs while the molding parts protect the LED. The PCBs are electrically connected to each other through the concave and convex portions thereof. Conductive layers are formed on wall surfaces of the concave and convex portions. The concave and convex portions have variable geometric shapes. One of the PCBs has concave portions while the other of the PCBs has convex portions.

Abstract translation: 提供LED（发光二极管）和包括该LED的背光单元，以在相应的PCB具有缺陷时仅替换具有缺陷的PCB（印刷电路板）。 两个PCB（111,121）通过形成在其各个侧表面上的凹凸部分（117,127）彼此连接。 PCB具有多个LED（113,123）。 在LED上形成成型部件（115,125）。 成型部件控制从LED发出的光的传播方向，同时模制部件保护LED。 PCB通过其凹凸部分彼此电连接。 导电层形成在凹凸部的壁面上。 凹凸部分具有可变的几何形状。 PCB中的一个具有凹部，而另一个PCB具有凸部。

公开(公告)号：KR1020080053735A

公开(公告)日：2008-06-16

申请号：KR1020060125656

申请日：2006-12-11

Applicant: 삼성전자주식회사

Inventor： 방효재 ,  이동춘 ,  한성찬 ,  김중현 ,  최현석

IPC: H01L23/02 ,  H01L21/60

CPC classification number: H01C1/144 ,  H01C1/01 ,  H01C7/18 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09172 ,  H05K2201/10045 ,  Y02P70/613

Abstract: A chip network resistor using solder balls and a semiconductor module including the same are provided to prevent defective of the chip network resistor by adhering the chip network resistor and a printed circuit board at a bottom surface. A chip network resistor includes a body made of an insulating material and a resistor(110) disposed on the body. External electrodes are connected to the resistor, and are disposed on a lower surface of the body. Solder balls(114) are adhered on the external electrodes. The insulating material of the body comprises alumina and a polymer, and the body has convex portions(106) and concave portions(104). The upper portion of the resistor is covered by an insulating layer.

Abstract translation: 提供使用焊球的芯片网络电阻器和包含该芯片的半导体模块，以通过将芯片网络电阻器和印刷电路板粘附在底面来防止芯片网络电阻器的缺陷。 芯片网络电阻器包括由绝缘材料制成的主体和设置在主体上的电阻器（110）。 外部电极连接到电阻器，并且设置在主体的下表面上。 焊球（114）粘附在外部电极上。 主体的绝缘材料包括氧化铝和聚合物，本体具有凸部（106）和凹部（104）。 电阻器的上部被绝缘层覆盖。

公开(公告)号：KR100135937B1

公开(公告)日：1998-04-29

申请号：KR1019940021303

申请日：1994-08-27

Applicant: 인터내셔널 비지네스 머신즈 코포레이션

Inventor： 구리하라미끼오 ,  니시사또루 ,  오노데라다까히로 ,  구시마가즈나리

IPC: H01L21/60

CPC classification number: G02F1/13452 ,  H01L2924/0002 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09172 ,  H01L2924/00

Abstract: 본 발명은 녹아 나온 땜납의 서로 이웃한 입력 전극으로의 유동을 방지하고, 또 입력 전극에 가해지는 전단 방향의 응력의 집중을 회피하는 가공이 실시되어 전극 사이의 쇼트나 단선을 방지하는 것을 목적으로 한다.
입력 전극(28)에 대응하는 슬릿 구멍(26)의 장벽은 요철 형상으로 되어 있다. 입력 전극(28)은 기판전극(30)과 중합되어 가열함으로써 땜납(32)가 녹아 양 전극(28 및 30)을 고정한다. 녹아 나온 땜납(32)는 베이스(22)와 기판(18A) 사이를 모세관 현상으로 유동한다. 이 땜납의 유동을 슬릿 구멍(26)의 장변에 철부(26A)를 형성하여 요철로 함으로써, 서로 이웃하는 입력 전극(28)을 접속하는 베이스(22)를 비직선으로 함으로써, 서로 이웃하는 입력 전극(28)로의 유동을 저지하고 있다. 또, 액정 셀(16)과 기판(18A 및 18B)가 상대 이동한 경우, 철부(26A)과 개개의 입력 전극(28)과의 접합부로, 각각 독립한 변형이 가능하게 되고 전단 방향의 응력의 집중이 회피되어 강도가 증가하고 있다.

公开(公告)号：WO2011075730A2

公开(公告)日：2011-06-23

申请号：PCT/US2010061337

申请日：2010-12-20

Applicant: CID TECHNOLOGIES INC ,  CHRISTY ALEXANDER

Inventor： CHRISTY ALEXANDER

IPC: F21S2/00 ,  F21V17/00 ,  F21V23/00 ,  F21V29/00 ,  F21Y101/02

CPC classification number: F21S2/005 ,  F21K9/00 ,  F21S8/033 ,  F21V19/001 ,  F21V23/006 ,  F21V29/004 ,  F21V29/20 ,  F21V29/54 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2107/40 ,  F21Y2107/60 ,  F21Y2115/10 ,  H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/09172 ,  H05K2201/10106

Abstract: A lamp assembly may include a frustum or an arcuate panel, a plurality of light emitting diodes positioned at least partially about the frustum or the arcuate panel, and a driver circuit configured to electrically drive the plurality of light emitting diodes from a source of voltage. The lamp assembly may further include multiple frusta or arcuate panels juxtaposed with each other. The lamp assembly may further include a thermally conductive medium positioned at least partially about at least some of the plurality of light emitting diodes. The thermally conductive medium may be configured to at least partially control an operating temperature of the plurality of light emitting diodes by dissipating at least some thermal energy radiated outwardly by each of the plurality of light emitting diodes in response to current flow therethrough.

Abstract translation: 灯组件可以包括平截头体或弓形面板，至少部分地围绕平截头体或弓形面板定位的多个发光二极管以及被配置为从电压源电驱动多个发光二极管的驱动器电路。 灯组件还可以包括彼此并置的多个沮心或弓形面板。 灯组件还可以包括至少部分地围绕多个发光二极管中的至少一些定位的导热介质。 所述导热介质可以被配置成通过响应于流过其中的电流而耗散由所述多个发光二极管中的每一个向外辐射的至少一些热能来至少部分地控制所述多个发光二极管的操作温度。

公开(公告)号：WO2007041034A1

公开(公告)日：2007-04-12

申请号：PCT/US2006/037039

申请日：2006-09-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  PERRIER, Gaetan ,  BONVALLAT, Pierre ,  METRAL, Guy ,  KORUSCHOWITZ, Axel

Inventor： PERRIER, Gaetan ,  BONVALLAT, Pierre ,  METRAL, Guy ,  KORUSCHOWITZ, Axel

IPC: H01R13/514

CPC classification number: H05K1/144 ,  H01R13/6658 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09172

Abstract: A plug (10) includes a housing (12) and at least one functional component (54, 56) and/or circuit and is connectable with contacts of a telecommunications module, wherein the plug (10) includes at least two printed circuit boards (14, 16). An assembly, such as a distribution point, in particular a main distribution frame includes at least one telecommunications module and at least one plug (10). A method of manufacturing a plug including a housing and at least one functional component, which is connectable with contacts of a telecommunications module, includes the step of arranging at least two printed circuit boards in the plug.

Abstract translation: 插头（10）包括壳体（12）和至少一个功能部件（54,56）和/或电路，并且可与电信模块的触点连接，其中插头（10）包括至少两个印刷电路板 14，16）。 诸如分配点，特别是主配线架的组件包括至少一个电信模块和至少一个插头（10）。 一种制造包括壳体的插头和可与电信模块的触点连接的至少一个功能部件的插头的方法包括在插头中布置至少两个印刷电路板的步骤。

公开(公告)号：WO2005069318A1

公开(公告)日：2005-07-28

申请号：PCT/CH2004/000011

申请日：2004-01-13

Applicant: DELTA ENERGY SYSTEMS (SWITZERLAND) AG ,  MATERNE, Jürgen

Inventor： MATERNE, Jürgen

IPC: H01F37/00

CPC classification number: H05K1/165 ,  H01F17/0033 ,  H01F17/062 ,  H05K1/141 ,  H05K3/107 ,  H05K3/222 ,  H05K3/3421 ,  H05K3/366 ,  H05K2201/0305 ,  H05K2201/09172 ,  H05K2201/10287 ,  H05K2203/1476

Abstract: A coil of a high current magnetic element (1) with a magnetic core (5) that is mounted on a substrate (2) is formed by pieces of thick U-shaped wires (7.1 - 7.8) that are fitted over the magnetic core (5) and into corresponding holes (6) in the substrate (2) and interconnected in the required manner by grooves (9.1 - 9.10) on the lower surface of the substrate that are plated with copper and filled with solder. In this manner, the manufacturing of high current magnetic elements where thick wires have to be wound around the core can be realised with a high degree of automation that is without the need to manually wind a thick wire around the magnetic core.

Abstract translation: 具有安装在基板（2）上的磁芯（5）的高电流磁性元件（1）的线圈由安装在磁芯上的厚的U形导线（7.1-7.8）形成 （2）中的相应的孔（6）中并且以所需的方式通过镀有铜并填充有焊​​料的衬底的下表面上的凹槽（9.1-9.10）相互连接。 以这种方式，可以通过高度的自动化来实现其中粗线必须缠绕在芯上的高电流磁性元件的制造，而不需要手动地缠绕磁芯周围的粗线。

公开(公告)号：WO2004040591A1

公开(公告)日：2004-05-13

申请号：PCT/JP2003/013749

申请日：2003-10-28

Applicant: ローム株式会社 ,  栗山 尚大

Inventor： 栗山 尚大

IPC: H01C1/14

CPC classification number: H05K3/3442 ,  H01C1/16 ,  H01C13/02 ,  H05K2201/09172 ,  H05K2201/10045 ,  Y02P70/613

Abstract: 　絶縁基板の上面に抵抗膜の複数個を並べて形成し、前記絶縁基板の長手側面に、前記各抵抗膜に対する端子電極を長手側面に沿って所定の間隔ピッチで形成するとともに、各端子電極の間に凹み部を設けて成る固定ネットワーク抵抗器において、前記凹み部における長手側面に沿った幅寸法を、前記間隔ピッチの０．４４～０．４８倍にするか、或いは、０．５２５～０．６２５倍にすることにより、半田付け実装のときに前記各端子電極間に半田ブリッジが発生する率、及び、前記長手側面のうち前記各凹み部の間における端子電極形成部に欠けが発生する率を低くする。

Abstract translation: 一种固定网络电阻器，包括形成在绝缘基板的上表面上的多个电阻膜，以及沿着纵向侧面在绝缘基板的纵向侧面上以指定间距形成的各个电阻膜的端子电极，其中 在各端子电极之间设置凹部。 通过设置沿着纵向侧面的凹槽的宽度尺寸，在执行焊接安装时的端子电极之间的焊料桥的发生率和在纵向侧面中的凹部之间的端子电极形成部分处的芯片的发生率降低 在指定间距的0.44-0.48倍或0.525-0.625倍的范围内。