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    Method of manufacturing a dielectric resonant apparatus
    81.
    发明授权
    Method of manufacturing a dielectric resonant apparatus 失效
    制造介质谐振装置的方法

    公开(公告)号：US5764117A

    公开(公告)日：1998-06-09

    申请号：US677925

    申请日：1996-07-10

    Applicant: Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

    Inventor： Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

    IPC: H01P1/205 ,  H01P1/213 ,  H01P5/08 ,  H01P7/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01P1/202

    CPC classification number: H05K1/0243 ,  H01P1/2056 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/368

    Abstract: A method of manufacturing a dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

    Abstract translation: 一种制造介质谐振元件的方法包括至少一个电介质多级谐振器，其包括一个介电块，形成在一个介质块中的多个内导体形成孔，形成在每个内导体形成孔的内表面上的内导体 以及覆盖所述一个介质块的大致整个外表面的外导体，所述介质多级谐振器在所述一个介质块中构成多个介质谐振器; 以及固定安装在电介质多级谐振器上的安装基板，用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号，当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极，并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

    Electronic device
    84.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号：US09386703B2

    公开(公告)日：2016-07-05

    申请号：US14345143

    申请日：2012-09-13

    Applicant: Akira Oikawa

    Inventor： Akira Oikawa

    IPC: H05K7/00 ,  H05K1/18 ,  H03H9/05 ,  H03H9/10 ,  H05K3/28 ,  H01L23/31 ,  H05K1/02

    CPC classification number: H05K1/185 ,  H01L23/3121 ,  H01L23/315 ,  H01L2224/16225 ,  H03H9/059 ,  H03H9/1085 ,  H05K1/0271 ,  H05K3/284 ,  H05K2201/10068

    Abstract: The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.

    Abstract translation: 该电子装置设置有布线板，安装在布线板的上表面（前表面）上以使其功能表面（主表面）面向上表面的压电元件（电子部件），以及 树脂部分粘附到压电元件的侧表面和布线板，并且密封布线板的上表面和压电元件的功能表面之间的相对的空间。 此外，树脂部分相对于相对的空间凹陷成形。

    Using dielectric substrates, embedded with vertical wire structures, with slotline and microstrip elements to eliminate parallel-plate or surface-wave radiation in printed-circuits, chip packages and antennas
    86.
    发明授权
    Using dielectric substrates, embedded with vertical wire structures, with slotline and microstrip elements to eliminate parallel-plate or surface-wave radiation in printed-circuits, chip packages and antennas 有权
    使用嵌入垂直导线结构的介质基板，带有槽线和微带元件，以消除印刷电路，芯片封装和天线中的平行板或表面波辐射

    公开(公告)号：US09007265B2

    公开(公告)日：2015-04-14

    申请号：US12651539

    申请日：2010-01-04

    Applicant: Nirod K. Das

    Inventor： Nirod K. Das

    IPC: H01Q1/38 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H01Q1/38 ,  H05K1/024 ,  H05K1/0251 ,  H05K1/0366 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0281 ,  H05K2201/10068

    Abstract: Substrate arrangements useful for high-performance radio-frequency planar circuits and antennas eliminate excitation of parallel-plate or surface-wave radiations. By eliminating such radiation which escapes sideways through the substrates, the loss of valuable power carried away by these radiations can be avoided, and/or complications resulting from these radiations (e.g., in the form or electromagnetic interference, cross-talk between circuit components or poor signal integrity) can be avoided. A new type of substrate layer is embedded with thin conducting wires that are closely packed and oriented normal to the substrate layering. These conducting wires change the substrate behavior in a unique way. Such new substrate layers may be used in slotline/coplanar waveguide circuits and microstrip antennas to achieve high-performance radio-frequency operations.

    Abstract translation: 用于高性能射频平面电路和天线的衬底布置消除了平行板或表面波辐射的激发。 通过消除通过基板横向逸出的这种辐射，可以避免由这些辐射带走的有价值功率的损失，和/或由这些辐射引起的并发症（例如，形式或电磁干扰，电路部件之间的串扰或 信号完整性差）。 一种新型的基底层被埋入细密的导线，其紧密堆积并且垂直于基底分层。 这些导线以独特的方式改变基板行为。 这种新的衬底层可以用于槽线/共面波导电路和微带天线中，以实现高性能的射频操作。

    ELECTRONIC DEVICE
    87.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20140369013A1

    公开(公告)日：2014-12-18

    申请号：US14345143

    申请日：2012-09-13

    Applicant: Akira Oikawa

    Inventor： Akira Oikawa

    IPC: H05K1/18

    CPC classification number: H05K1/185 ,  H01L23/3121 ,  H01L23/315 ,  H01L2224/16225 ,  H03H9/059 ,  H03H9/1085 ,  H05K1/0271 ,  H05K3/284 ,  H05K2201/10068

    Abstract: The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.

    Abstract translation: 该电子装置设置有布线板，安装在布线板的上表面（前表面）上以使其功能表面（主表面）面向上表面的压电元件（电子部件），以及 树脂部分粘附到压电元件的侧表面和布线板，并且密封布线板的上表面和压电元件的功能表面之间的相对的空间。 此外，树脂部分相对于相对的空间凹陷成形。

    COMPOSITE ELECTRONIC COMPONENT
    88.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号：US20140313682A1

    公开(公告)日：2014-10-23

    申请号：US14257006

    申请日：2014-04-21

    Applicant: NIHON DEMPA KOGYO CO., LTD.

    Inventor： HIROYUKI MITOME

    IPC: H05K1/02

    CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10553 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

    Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

    Abstract translation: 复合电子部件包括具有宽表面端子的金属部件，具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度，该宽度被配置为：减小在栅极阻焊堤一侧的截面区域中发生的气泡，与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

    Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate
    89.
    发明授权
    Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate 有权
    电子元件封装，电子元器件封装基座，电子元件封装和电路基板的结构

    公开(公告)号：US08279610B2

    公开(公告)日：2012-10-02

    申请号：US12674505

    申请日：2008-08-21

    Applicant: Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

    Inventor： Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

    IPC: H05K1/00 ,  H05K1/18

    CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

    Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.

    Abstract translation: 电子部件封装具有从顶部观察为矩形形状的基部和金属盖。 使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。 在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组 形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。 此外，在基座的短边方向上的与一个角位置相对的另一个角位置处设置有沿着基座的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置 位置。 至少一个端子电极是连接到金属盖的接地端子电极。

    APPARATUS FOR MANAGING HEAT DISTRIBUTION IN AN OSCILLATOR SYSTEM
    90.
    发明申请
    APPARATUS FOR MANAGING HEAT DISTRIBUTION IN AN OSCILLATOR SYSTEM 审中-公开
    用于管理振荡器系统中的热分布的装置

    公开(公告)号：US20120236510A1

    公开(公告)日：2012-09-20

    申请号：US13051946

    申请日：2011-03-18

    Applicant: Chih Wei Wong

    Inventor： Chih Wei Wong

    IPC: H05K7/02 ,  H05K3/30

    CPC classification number: H05K7/205 ,  H05K1/0201 ,  H05K1/185 ,  H05K2201/10068 ,  Y10T29/4913

    Abstract: A system and method of making an apparatus for managing heat distribution in an oscillator system is disclosed. In an example embodiment, the apparatus includes a resonator configured to provide a periodic signal, a circuit coupled to the resonator configured to compensate for changes in the periodic signal due to variation in temperature, and further includes a heat source configured to generate heat that heats the resonator and the circuit. At least one of the resonator, circuit, and heat source is embedded in a substrate, and the resonator, circuit, and heat source are arranged to heat the resonator and circuit substantially the same amount.

    Abstract translation: 公开了一种制造用于管理振荡器系统中的热分配的装置的系统和方法。 在一个示例性实施例中，该装置包括被配置为提供周期性信号的谐振器，耦合到谐振器的电路，被配置为补偿由温度变化引起的周期性信号的变化，并且还包括被配置为产生热量的热源 谐振器和电路。 谐振器，电路和热源中的至少一个嵌入在衬底中，并且谐振器，电路和热源被布置成加热谐振器和电路基本上相同的量。

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