公开(公告)号：US09877397B2

公开(公告)日：2018-01-23

申请号：US14923941

申请日：2015-10-27

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro Maruyama ,  Kenshi Kai ,  Nobuyuki Kanzawa ,  Mitsutoshi Sawano

IPC: H05K3/30 ,  H01L21/44 ,  H05K3/34 ,  H01L23/498 ,  H01L21/48 ,  H01L25/07 ,  H05K3/40 ,  H01L23/373

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

公开(公告)号：US20170339794A1

公开(公告)日：2017-11-23

申请号：US15671899

申请日：2017-08-08

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro MARUYAMA ,  Kenshi KAI ,  Nobuyuki KANZAWA ,  Mitsutoshi SAWANO

IPC: H05K3/30 ,  H01L25/07 ,  H05K3/34 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40 ,  H01L23/373

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/532 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

公开(公告)号：US09801269B1

公开(公告)日：2017-10-24

申请号：US15150834

申请日：2016-05-10

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01P3/08 ,  H01P3/06

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US20170105285A1

公开(公告)日：2017-04-13

申请号：US15281340

申请日：2016-09-30

Applicant: TDK Corporation

Inventor： Kazuharu KITATANI ,  Yasunobu NOGUCHI

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K1/11 ,  H05K3/306 ,  H05K3/34 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10272

Abstract: A circuit board includes a base substrate, a busbar disposed on a mounting surface-side of the base substrate; and an electronic component disposed on the mounting surface-side and including a plurality of terminals, at least one of which is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion can be inserted. A first insertion portion through which the terminal can be inserted is provided in the component connecting end portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface, on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes, positioned closer to a rear surface of the base substrate than the component mounting surface.

公开(公告)号：US09606496B2

公开(公告)日：2017-03-28

申请号：US14326193

申请日：2014-07-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Ogawara

IPC: H05K1/00 ,  G03G15/00 ,  H05K3/40 ,  H05K1/02 ,  H05K3/34

CPC classification number: G03G15/80 ,  G03G21/1652 ,  H05K1/0254 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

公开(公告)号：US09549472B2

公开(公告)日：2017-01-17

申请号：US14305948

申请日：2014-06-16

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ryuichi Shibutani

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L25/105 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/181 ,  H05K1/186 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/2036 ,  Y02P70/613

Abstract: First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced.

Abstract translation: 形成在一个半导体封装表面上的第一电极焊盘包括表面积大于其它第一电极焊盘的表面积的第一增强电极焊盘。 形成在其上安装有半导体封装的印刷线路板上的第二电极焊盘包括至少一个第二增强电极焊盘。 第二加强电极垫与第一增强电极焊盘相对，并且其表面积大于其它第二电极焊盘的表面积。 第一和第二电极焊盘通过焊接连接部分连接。 圆柱形封闭构件包围连接第一和第二增强电极焊盘的焊接连接部分的外周边。 抑制诸如封装衬底和印刷电路板的半导体器件的翘曲量的增加，并且减少了相对于相邻焊料连接部件或相邻部件的焊料桥的发展。

公开(公告)号：US20160307700A1

公开(公告)日：2016-10-20

申请号：US15096571

申请日：2016-04-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK

IPC: H01G2/06 ,  H05K1/18 ,  H01G4/012 ,  H01G4/248 ,  H01G4/30 ,  H01G4/12

CPC classification number: H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0271 ,  H05K3/301 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A capacitor component includes a capacitor including a plurality of internal electrodes, a capacitor body containing a piezoelectric material formed in a region between adjacent electrodes among the plurality of internal electrodes, and external electrodes connected to the plurality of internal electrodes; and support parts formed of a metal and disposed to be coupled to the capacitor and having an annular shape to alleviate vibrations generated by the capacitor.

Abstract translation: 电容器部件包括：电容器，包括多个内部电极;电容器主体，包含形成在所述多个内部电极中的相邻电极之间的区域中的压电材料;以及外部电极，连接到所述多个内部电极; 以及由金属形成并被设置成耦合到电容器并且具有环形形状以支持由电容器产生的振动的支撑部分。

公开(公告)号：US20140317896A1

公开(公告)日：2014-10-30

申请号：US14204455

申请日：2014-03-11

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro MARUYAMA ,  Kenshi KAI ,  Nobuyuki KANZAWA ,  Mitsutoshi SAWANO

IPC: H05K3/30

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.

Abstract translation: 半导体器件的制造方法使用具有绝缘电路板定位夹具的安装夹具，具有形成在预定位置上的多个定位孔的管状接触元件定位夹具，以插入管状接触元件，以及管状接触元件压入 夹具 通过绝缘电路板定位夹具和管状接触元件定位夹具，绝缘电路板和管状接触元件被定位，并且管状接触元件被焊接到绝缘电路板，​​同时被管状接触元件压下 夹具

公开(公告)号：US07273380B2

公开(公告)日：2007-09-25

申请号：US11657995

申请日：2007-01-25

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20040048498A1

公开(公告)日：2004-03-11

申请号：US10634332

申请日：2003-08-04

Inventor： Hong Huang ,  Allan Mark

IPC: H05K001/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10257 ,  Y02P70/613

Abstract: The present invention provides a metallic power connector for PCB-to-PCB attachment using surface mount technology. The connector has a cross section that is in the shape of a hollow trapezoid. Parallel sides of the trapezoid are adapted for connecting to contact pads on the PCBs with differently shaped footprints. The non-parallel sides of the trapezoid provide structural stability and rigidity not found in prior art SMT connectors. The inventive metallic SMT power connector allows for power and heat flow from a first PCB to a second PCB, and is compatible with automated SMT processes.

Abstract translation: 本发明提供一种使用表面贴装技术的用于PCB到PCB连接的金属电源连接器。 连接器具有中空梯形形状的横截面。 梯形的平行侧适用于连接到具有不同形状印迹的PCB上的接触焊盘。 梯形的非平行边提供了现有技术的SMT连接器中没有发现的结构稳定性和刚性。 本发明的金属SMT电源连接器允许从第一PCB到第二PCB的功率和热量流动，并且与自动化SMT工艺兼容。