公开(公告)号：US20120019985A1

公开(公告)日：2012-01-26

申请号：US12839596

申请日：2010-07-20

Applicant: CHUN-KONG CHAN ,  CHI-CHING CHEN

Inventor： CHUN-KONG CHAN ,  CHI-CHING CHEN

IPC: H01G9/045

CPC classification number: H01G9/045 ,  H01G9/008 ,  H01G9/10 ,  H05K3/306 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/2036

Abstract: An aluminum electrolytic capacitor includes a main body, two electric leads, and a metal set plate. The main body has a base and a plastic insulating film. The electric leads are located at one end of the base. The metal set plate is located at opposite end, with a connecting portion and a soldering portion. The connecting portion is located at the surface of the other end of the base opposite of the two electric leads. The soldering portion extends outside of the main body. The plastic insulating film wraps around the main body and the outer edge of the connecting portion. Thereby, the metal set plate is secured firmly with the main body. The soldering portion of the metal set plate is soldered onto the printed circuit board, allowing the aluminum electrolytic capacitor to be firmly attached to the printed circuit board.

Abstract translation: 铝电解电容器包括主体，两个电引线和金属板。 主体有一个基座和一个塑料绝缘膜。 电引线位于基座的一端。 金属制板位于相对端，具有连接部分和焊接部分。 连接部位于与两个电引线相反的基座的另一端的表面。 焊接部分延伸到主体的外部。 塑料绝缘膜围绕主体和连接部分的外边缘卷绕。 由此，金属固定板与主体牢固地固定。 金属制板的焊接部分焊接到印刷电路板上，使得铝电解电容器牢固地附接到印刷电路板上。

公开(公告)号：US20090051446A1

公开(公告)日：2009-02-26

申请号：US12229114

申请日：2008-08-20

Applicant: Jeffrey A. McCracken

Inventor： Jeffrey A. McCracken

IPC: H03B1/00

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：US20080250377A1

公开(公告)日：2008-10-09

申请号：US11696659

申请日：2007-04-04

Applicant: Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

Inventor： Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

IPC: G06F17/50 ,  G01R31/00

CPC classification number: G01R31/2818 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3457 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0367 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/10333 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Abstract translation: 提供了使用高密度互连（HDI技术）访问在印刷电路板（PCB）的内层上的导电迹线上路由的高速信号的方法和装置。 导电迹线可以耦合到具有设置在muVia的外层焊盘上方的导电圆顶的微孔（muVia）。 与使用电镀通孔（PTH）技术的常规测试点相比，在线测试（ICT）固定装置或高速测试探头可与导电圆顶接口以测试具有降低的反射损耗和其他寄生效应的高速信号。

公开(公告)号：US20080225461A1

公开(公告)日：2008-09-18

申请号：US12039284

申请日：2008-02-28

Applicant: Yukihiko SHIRAKAWA ,  Iwao MIURA

Inventor： Yukihiko SHIRAKAWA ,  Iwao MIURA

IPC: H01G4/224

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

Abstract: There are provided an electronic component permitting easy surface mounting onto a circuit board and, a mounted structure and an inverter device therewith.A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

Abstract translation: 提供了允许容易地安装到电路板上的电子部件，以及安装的结构和与其相反的逆变器装置。 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

公开(公告)号：US20080081253A1

公开(公告)日：2008-04-03

申请号：US11905282

申请日：2007-09-28

Applicant: Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

Inventor： Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

IPC: H01M2/02

CPC classification number: H01M2/0413 ,  H01M2/0222 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10643 ,  H05K2201/10659 ,  Y02P70/613 ,  Y10S228/901

Abstract: A lead plate-attached coin-type battery is constituted from a combination of a coin-type battery and a positive lead plate. In the coin-type battery, a negative cap seals the aperture of a positive outer can. In a lateral view, the positive lead plate is crank-shaped, and one end thereof is attached to the outer surface of the positive outer can of the coin-type battery. A lead plate is not attached to the negative cap. One or more projections that project in the Z axis direction are provided on the negative cap. In the lead plate-attached coin-type battery, the positive lead plate and negative cap have been attached to respective conductive lands on a circuit board by a solder reflow method.

Abstract translation: 引线板式硬币型电池由硬币型电池和正极引线板的组合构成。 在硬币型电池中，负极帽密封正外壳的孔径。 在侧视图中，正极引线板是曲柄形的，其一端连接到硬币型电池的正外壳的外表面。 引线板未连接到负极盖。 在Z轴方向上投影的一个或多个突起设置在负极盖上。 在带引线板的硬币型电池中，通过焊料回流法将正极引线板和负极盖安装在电路板上的各个导电焊盘上。

公开(公告)号：US20050219215A1

公开(公告)日：2005-10-06

申请号：US10814147

申请日：2004-04-01

Applicant: Yung Wu

Inventor： Yung Wu

IPC: G09G5/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: G06F3/0317 ,  H05K1/0274 ,  H05K1/18 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10462

Abstract: An optical mouse has a housing, a printed circuit board, a light source unit, a photodetector unit, a light-guiding unit and a lens unit. The light source unit has different colors of image light sources and is disposed on the printed circuit board. The light-guiding unit is arranged in the housing and adjacent to the light source unit for guiding a non-complementary color light relative to a reflection surface from one of the image light sources to the reflection surface. The lens unit is arranged in the housing and positioned below the photodetector unit for converging a reflected light reflected by the reflection surface into the photodetector unit. Furthermore, the optical mouse can be operated on various colors of reflection surfaces, and still retains better sensitivity.

Abstract translation: 光学鼠标具有壳体，印刷电路板，光源单元，光电检测器单元，导光单元和透镜单元。 光源单元具有不同的图像光源颜色，并且布置在印刷电路板上。 导光单元布置在壳体中并且与光源单元相邻，用于相对于从图像光源中的一个到反射表面的反射表面引导非互补色光。 透镜单元布置在壳体中并且位于光电检测器单元下方，用于将由反射表面反射的反射光会聚到光电检测器单元中。 此外，光学鼠标可以以各种颜色的反射表面操作，并且仍然保持更好的灵敏度。

公开(公告)号：US06677707B1

公开(公告)日：2004-01-13

申请号：US09612163

申请日：2000-07-08

Applicant: Thomas Dietiker

Inventor： Thomas Dietiker

IPC: H01L3300

CPC classification number: H05K3/3426 ,  H01L33/62 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10787 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00012

Abstract: A unique side mounted LED and side sensing photo-transistor with free-end contacts, useful for thin profile side and back lighting and low-profile touch screen photo-circuits, and a method of manufacturing the side mounted side emitting or sensing photo circuit components.

Abstract translation: 独特的侧面安装的LED和具有自由端触点的侧面感测光电晶体管，用于薄型侧面和背面照明以及低调触摸屏光电路，以及制造侧面安装侧发射或感测光电路部件的方法 。

公开(公告)号：US06509714B2

公开(公告)日：2003-01-21

申请号：US10005688

申请日：2001-11-08

Applicant: Koji Tomitsuka ,  Kenji Ogata ,  Taisuke Takiguchi ,  Shunji Watanabe

Inventor： Koji Tomitsuka ,  Kenji Ogata ,  Taisuke Takiguchi ,  Shunji Watanabe

IPC: H01M10216

CPC classification number: H01G4/228 ,  H01G2/065 ,  H01M2/0222 ,  H01M2/30 ,  H01M2/34 ,  H01M10/0427 ,  H05K1/181 ,  H05K2201/10462 ,  Y02P70/611

Abstract: A secondary battery or capacitor fitted with terminals and occupies less area on a packaging substrate. Either one of the positive and negative terminals is mounted within the outer surface of the secondary battery or capacitor. This reduces the area occupied by the secondary battery or capacitor fitted with terminals on the substrate. At least one step is formed on the terminal positioned opposite to the substrate. This prevents electrical shorting between the positive electrode can and the negative terminal.

公开(公告)号：US20020142193A1

公开(公告)日：2002-10-03

申请号：US09778155

申请日：2001-02-06

Inventor： Tzung-Cheng Yang

IPC: H01M010/00

CPC classification number: H01M2/1066 ,  H01M6/40 ,  H05K1/181 ,  H05K2201/10037 ,  H05K2201/10462 ,  Y02P70/611

Abstract: This invention eliminates the requirement of a battery compartment of electronic devices, so that the size of the electronic devices can be greatly reduced. This invention is very usefully especially for medical devices and portable devices or the like.

Abstract translation: 本发明消除了电子设备的电池室的要求，从而可以大大减少电子设备的尺寸。 本发明特别适用于医疗器械和便携式装置等。

公开(公告)号：US06252791B1

公开(公告)日：2001-06-26

申请号：US09473848

申请日：1999-12-28

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C502

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuitry board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用主电路板，其两侧附着有多个子板，每个子板承载多个集成电路芯片。