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公开(公告)号:KR1020130036700A
公开(公告)日:2013-04-12
申请号:KR1020120080534
申请日:2012-07-24
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: G03F7/3057 , H01L21/67051
Abstract: PURPOSE: An apparatus and method for processing a substrate are provided to prevent a developer from being undulated by separately collecting a first processing solution and smoothly substituting the first processing solution for a second processing solution. CONSTITUTION: A first processing solution supply unit supplies a first processing solution to a substrate(G). A gas supply unit(21) supplies a preset gas to the surface of the substrate in which the first processing solution is collected. A second rinse nozzle discharges a second processing solution to the surface of the substrate. A first rinse nozzle(22) discharges the second processing solution to the surface of the substrate to which the gas is supplied. A solution collecting unit(27) forms a solution collected part extended in a width direction of the substrate on a substrate transfer path by the second processing solution supplied by the first rinse nozzle.
Abstract translation: 目的:提供一种用于处理基板的装置和方法,以通过分开收集第一处理溶液并平滑地将第一处理溶液代替第二处理溶液来防止显影剂波动。 构成:第一处理溶液供应单元向基板(G)提供第一处理溶液。 气体供给单元(21)将预先设定的气体供给到收集第一处理液的基板的表面。 第二冲洗喷嘴将第二处理溶液排出到基板的表面。 第一冲洗喷嘴(22)将第二处理溶液排放到供给气体的基板的表面。 溶液收集单元(27)通过由第一冲洗喷嘴提供的第二处理溶液在基板输送路径上形成在基板的宽度方向上延伸的溶液收集部分。
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公开(公告)号:KR1020160144315A
公开(公告)日:2016-12-16
申请号:KR1020160068609
申请日:2016-06-02
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/02 , H05H1/46 , H01L21/3065
CPC classification number: H01L21/02252 , H01L21/02274 , H01L21/02315 , H01L21/0234 , H01L21/3065 , H05H1/46
Abstract: 표면개질장치의손상을억제하면서, 당해표면개질장치에있어서기판의표면을적절하게개질한다. 표면개질장치(30)는처리용기(100) 내에배치되어, 기판(S, S)이적재되는하부전극(110)과, 처리용기(100) 내에서하부전극(110)에대향해서배치되는상부전극(140)을갖는다. 하부전극(110)은플라즈마생성용의소정주파수의전압을인가하기위한고주파전원(134)에접속되고, 상부전극(140)은접지되어있다. 소정주파수는, 13MHz 내지 100MHz 중어느하나이다.
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公开(公告)号:KR1020090131251A
公开(公告)日:2009-12-28
申请号:KR1020090052392
申请日:2009-06-12
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302 , H01L21/677 , H01L21/304
CPC classification number: H01L21/67017 , H01L21/302 , H01L21/67706 , H01L21/67715 , H01L21/67736
Abstract: PURPOSE: A substrate processing apparatus and a substrate processing method are provided to suppress a development mark by efficiently changing a first processing liquid provided to a substrate to be processed with a second processing liquid. CONSTITUTION: In a device, a conveying line(2) includes a first return section(M1), a second return section(M2), and a third return section(M3). A return driving unit operates a roller to transfer a substrate on a conveying line. A first processing liquid supplies a first processing solution to the substrate within the first return section. A second processing solution supply unit(13) supplies a second processing solution to the substrate within the third return section. An elevating unit forms an inclined convey line which is continued from the first return section by transferring the roller installed at the second return section.
Abstract translation: 目的:提供一种基板处理装置和基板处理方法,通过用第二处理液有效地改变设置在待处理基板上的第一处理液来抑制显影标记。 构成:在装置中,传送线(2)包括第一返回部分(M1),第二返回部分(M2)和第三返回部分(M3)。 返回驱动单元操作辊子以在输送线路上传送基板。 第一处理液体将第一处理溶液供应到第一返回部分内的基板。 第二处理溶液供应单元(13)将第二处理溶液供应到第三返回部分内的基板。 升降单元形成倾斜的输送线,该输送线通过传送安装在第二返回部分的滚子而从第一返回部分继续。
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