Abstract:
3차원 구조의 비휘발성 메모리 장치가 제공된다. 비휘발성 메모리 장치는 제 1 워드 라인들이 적층된 제 1 워드 라인 스택들, 제 1 워드 라인들과 평행한 제 2 워드 라인들이 적층된 제 2 워드 라인 스택들, 제 1 워드 라인들을 연결하는 제 1 연결 라인들 및 제 2 워드 라인들을 연결하는 제 2 연결 라인들을 포함하되, 제 1 연결 라인들 각각은, 동일층에 위치하는 제 1 워드 라인들을 연결하고, 제 2 연결 라인들 각각은, 동일층에 위치하는 제 2 워드 라인들을 연결하며, 한 쌍의 제 1 워드 라인 스택들 사이에는, 적어도 하나의 제 2 워드 라인 스택이 배치된다. 3차원, 워드 라인, 핑거 구조
Abstract:
PURPOSE: A nonvolatile memory device, a programming method thereof, and a memory system including the same are provided to reduce a leakage due to difference between a channel voltage and a bit line voltage by applying a positive voltage to a selection bit line in a program operation. CONSTITUTION: A first positive voltage is applied to a selection bit line(S110). A second positive voltage is applied to an unselected bit line(S120). A third positive voltage is applied to the selected string selection line. A fourth positive voltage is applied to the unselected string selection line. A program operation voltage is applied to word lines(S130).
Abstract:
PURPOSE: A flash memory device and a programming/erasing method thereof are provided to maintain the voltage of a first selection line below the voltage of a bulk region by applying a low voltage to the first selection line among the first voltage and the voltage level of the bulk region. CONSTITUTION: Memory cell transistors are positioned on a bulk region(120). Normal word lines are respectively connected to gates of the memory cell transistors. A first dummy cell transistor(TD1) is connected to the memory cell transistor. The first dummy word line is connected to the gate of the first dummy cell transistor. A first selection transistor(TSS) is connected to the first dummy cell transistor. The first selection line is connected to the gate of the first selection transistor. A voltage controller(150) applies the low voltage among the first voltage and the voltage level of the bulk region to the first selection line.
Abstract:
PURPOSE: A non volatile memory device and a method of fabricating the same are provided to simplify a process by using a substrate with high impurity concentration and low non-resistance. CONSTITUTION: In a non volatile memory device and a method of fabricating the same, a second conductive type substrate comprises a plurality of wells having the first conductivity type. A plurality of memory cells are formed on one among a plurality of wells. A peripheral circuit comprises at least one first transistor and at least one second transistor. The first transistor is formed on the substrate(100) and has the first conductivity type. The second transistor is formed on the other one among a plurality of wells and has the second conductive type.
Abstract:
High-voltage MOS transistors with a floated drain-side auxiliary gate are provided. The high-voltage MOS transistors include a source region and a drain region provided in a semiconductor substrate. A main gate electrode is disposed over the semiconductor substrate between the drain region and the source region. A lower drain-side auxiliary gate and an upper drain-side auxiliary gate are sequentially stacked over the semiconductor substrate between the main gate electrode and the drain region. The lower drain-side auxiliary gate is electrically insulated from the semiconductor substrate, the main gate electrode and the upper drain-side auxiliary gate. Methods of fabricating the high-voltage MOS transistors are also provided.
Abstract:
본 발명은 저항 소자를 구비하는 반도체 소자 및 그 형성 방법을 제공한다. 본 발명에 따르면, 어레이 영역의 셀 게이트 패턴을 형성한 후에 새로운 도전막으로 저항영역에 저항 소자를 형성한다. 이로써, 셀 게이트 패턴을 이루는 게이트 막의 특성에 구속되지 않고 저항값 조절이 용이하며, 균일한 면저항값을 얻을 수 있으며 칩의 면적을 최소화할 수 있다. 저항 소자, 비휘발성 메모리 소자