公开(公告)号：KR20180039709A

公开(公告)日：2018-04-18

申请号：KR20187007107

申请日：2016-08-09

Applicant: BASF SE

Inventor： REICHARDT ROBERT ,  SIEBERT MAX ,  LAN YONGQING ,  LAUTER MICHAEL ,  USMAN IBRAHIM SHEIK ANSAR ,  GOLZARIAN REZA M ,  WEI TE YU ,  GUEVENC HACI OSMAN ,  PROELSS JULIAN ,  LEUNISSEN LEONARDUS

IPC: C09G1/02 ,  C09G1/04 ,  C09K3/14 ,  H01L21/306

CPC classification number: C09G1/02

Abstract: (i) 코발트및/또는 (ii) 코발트합금및 (iii) TiN 및/또는 TaN 을함유하는기판 (S) 의화학기계연마를위한화학기계연마 (CMP) 조성물 (Q) 의용도로서, 상기 CMP 조성물 (Q) 이하기를포함하는 CMP 조성물 (Q) 의용도: (E) 무기입자, (F) 아미노기및 산기 (Y) 를함유하는하나이상의유기화합물 (상기화합물은 n 개의아미노기및 n+1 개이상의산성프로톤을함유하고, n 은정수≥ 1 이다), (G) 각각의 CMP 조성물의총 중량에대해서, 0.2 wt.% 내지 2.5 wt.% 의양의하나이상의산화제, (H) 수성매질, CMP 조성물 (Q) 은 6 초과 9 미만의 pH 를가진다.

公开(公告)号：SG11201804636YA

公开(公告)日：2018-07-30

申请号：SG11201804636Y

申请日：2016-12-20

Applicant: BASF SE

Inventor： DÄSCHLEIN CHRISTIAN ,  SIEBERT MAX ,  LAUTER MICHAEL ,  PRZYBYLSKI PETER ,  PROELSS JULIAN ,  KLIPP ANDREAS ,  GUEVENC HACI OSMAN ,  LEUNISSEN LEONARDUS ,  BAUMANN ROELF-PETER ,  WEI TE YU

IPC: H01L21/321 ,  C11D3/00 ,  C11D3/37 ,  C11D11/00

Abstract: Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more nonionic polymers selected from the group consisting of poly- acrylamides, polyhydroxyethyl(meth)acrylates (PHE(M)A), polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polymers of formula (I), and mixtures thereof, wherein R1 is hydrogen, methyl, ethyl, n-propyl, /so-propyl, n-butyl, iso-butyl, or sec-butyl, R2 is hydrogen or methyl, and n is an integer, (B) poly(acrylic acid) (PAA) or acrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5.

公开(公告)号：SG11201606157VA

公开(公告)日：2016-08-30

申请号：SG11201606157V

申请日：2015-01-21

Applicant: BASF SE

Inventor： LAUTER MICHAEL ,  LANGE ROLAND ,  NOLLER BASTIAN MARTEN ,  SIEBERT MAX

IPC: C09G1/18 ,  C09G1/02 ,  H01L21/304

公开(公告)号：SG11201808692QA

公开(公告)日：2018-11-29

申请号：SG11201808692Q

申请日：2016-04-27

Applicant: BASF SE

Inventor： REICHARDT DR ,  SIEBERT MAX ,  LAN YONGQING ,  LAUTER MICHAEL ,  USMAN IBRAHIM SHEIK ANSAR ,  GOLZARIN REZA ,  GUEVENC DR ,  PROELSS DR ,  LEUNISSEN LEONARDUS

IPC: C09G1/02 ,  H01L21/321

Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) an anionic surfactant of the general formula (I) R-S wherein R is C5-C20-alkyl, C5-C20-alkenyl, C5-C20-alkylacyl or C5-C20-alkenylacyl and S is a sulfonic acid derivative, an amino acid derivative or a phosphoric acid derivative or salts or mixtures thereof (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.

公开(公告)号：SG11201804637UA

公开(公告)日：2018-07-30

申请号：SG11201804637U

申请日：2016-12-20

Applicant: BASF SE

Inventor： DÄSCHLEIN CHRISTIAN ,  SIEBERT MAX ,  LAUTER MICHAEL ,  PRZYBYLSKI PETER ,  PROELSS JULIAN ,  KLIPP ANDREAS ,  GUEVENC HACI OSMAN ,  LEUNISSEN LEONARDUS ,  BAUMANN ROELF-PETER ,  WEI TE YU

IPC: C11D3/37 ,  C11D11/00 ,  H01L21/02 ,  H01L21/321

Abstract: Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) polyethylene glycol (PEG) with a mass average molar mass (Mw) in the range of from 400 to 8,000 g/mol, (B) an anionic polymer selected from the group consisting of poly(acrylic acid) (PAA), acrylic acid-maleic acid copolymers, polyaspartic acid (PASA), polyglutamic acid (PGA), polyvinylphosphonic acid, polyvinylsulfonic acid, poly(styrenesulfonic acid), polycarboxylate ethers (PCE), PEG-phosphorous acids, and copolymers of said polymers, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5.

公开(公告)号：SG11201600360YA

公开(公告)日：2016-02-26

申请号：SG11201600360Y

申请日：2014-07-08

Applicant: BASF SE

Inventor： LAUTER MICHAEL ,  LI YUZHUO ,  NOLLER BASTIAN MARTEN ,  LANGE ROLAND ,  REICHARDT ROBERT ,  LAN YONGQING ,  BOYKO VOLODYMYR ,  KRAUS ALEXANDER ,  SEYERL JOACHIM VON ,  USMAN IBRAHIM SHEIK ANSAR ,  SIEBERT MAX ,  HARTNAGEL KRISTINE ,  DENGLER JOACHIM ,  HILLESHEIM NINA SUSANNE

IPC: C09G1/02 ,  C09G1/00 ,  C09G1/04 ,  C09K3/14

Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising abrasive particles containing ceria.

公开(公告)号：EP3099756A4

公开(公告)日：2017-08-02

申请号：EP15743237

申请日：2015-01-21

Applicant: BASF SE

Inventor： LAUTER MICHAEL ,  LANGE ROLAND ,  NOLLER BASTIAN MARTEN ,  SIEBERT MAX

IPC: C09G1/18 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/321

CPC classification number: C09G1/02 ,  C09G1/18 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/76224

Abstract: A chemical mechanical polishing (CMP) composition comprising (A) Colloidal or fumed inorganic particles or a mixture thereof, (B) a poly (amino acid) and or a salt thereof, and (M) an aqueous medium.

Abstract translation: 一种化学机械抛光（CMP）组合物，其包含（A）胶态或气相无机颗粒或其混合物，（B）聚氨基酸和/或其盐和（M）水性介质。

公开(公告)号：SG11201704287TA

公开(公告)日：2017-07-28

申请号：SG11201704287T

申请日：2015-12-11

Applicant: BASF SE

Inventor： REICHARDT ROBERT ,  SIEBERT MAX ,  LAN YONGQING ,  LAUTER MICHAEL ,  USMAN IBRAHIM SHEIK ANSAR ,  GOLZARIAN REZA ,  GUEVENC HACI OSMAN ,  PROELSS JULIAN ,  LEUNISSEN LEONARDUS

IPC: C09G1/00 ,  C09G1/02

Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a triazine derivative of the general formula (I) wherein R1, R2, R3, R4, R5 and R6 are independently from each other H, methyl, ethyl, propyl, butyl, pentyl, C2-C10-alkylcarboxylic acid, hydroxymethyl, vinyl or allyl (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.

公开(公告)号：SG11201810119PA

公开(公告)日：2018-12-28

申请号：SG11201810119P

申请日：2017-05-31

Applicant: BASF SE

Inventor： DAESCHLEIN CHRISTIAN ,  SIEBERT MAX ,  LAUTER MICHAEL ,  LEUNISSEN LEONARDUS ,  GARCIA ROMERO IVAN ,  GUEVENC HACI OSMAN ,  PRZYBYLSKI PETER ,  PROELSS JULIAN ,  KLIPP ANDREAS

IPC: C11D1/72 ,  C11D1/722 ,  C11D3/37 ,  C11D11/00 ,  H01L21/02

Abstract: Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more water-soluble nonionic copolymers of the general formula (I) and mixtures thereof, formula (I) wherein R1 and R3 are idependently from each other hydrogen, methyl, ethyl, n-propyl, isopropyl, n-butyl, iso-Butyl, or sec-butyl, R2 is methyl and x and y are an integer,1 (B)poly(acrylic acid) (PAA) oracrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C)water, wherein the pH of the composition is in the range of from 7.0 to 10.5.

公开(公告)号：SG11201807364VA

公开(公告)日：2018-10-30

申请号：SG11201807364V

申请日：2017-03-13

Applicant: BASF SE

Inventor： LAUTER MICHAEL ,  GUEVENC HACI OSMAN ,  SIEBERT MAX ,  LAN YONGQING ,  USMAN IBRAHIM SHEIK ANSAR ,  GOLZARIAN REZA M ,  WEI TE YU

IPC: C09G1/04

Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a poly(amino acid) and or a salt thereof (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.