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公开(公告)号:JPH10177721A
公开(公告)日:1998-06-30
申请号:JP31361897
申请日:1997-11-14
Applicant: IBM
Inventor: BRADY MICHAEL J , BRAREN BODIL E , GAMBINO RICHARD J , GRILL ALFRED , PATEL VISHNUBHAI V
IPC: B41M5/26 , G11B7/00 , G11B7/0045 , G11B7/0055 , G11B7/24 , G11B7/243 , G11B7/258 , G11B7/30
Abstract: PROBLEM TO BE SOLVED: To obtain an optical memory medium based on completely novel memory principle and to obtain an optical memory device using this medium by recording data corresponding to characteristics of an amorphous solid selected from a group of materials each having refractive index and reflectance. SOLUTION: The amorphous solid is selected from a group of diamond-like carbon, silicon carbide, boron carbide, boron nitride, amorphous silicon and amorphous germanium, and the solid contains hydrogen by up to 50 atm% with covalent bonds. A specified region of the amorphous solid having a first refractive index and having atoms with covalent bonds is heated with laser light to change the refractive index in the heated area to a second refractive index. Thus, two states can be produced to correspond the memory of data without dissolving or crystallizing the amorphous solid. The density of the solid is changed by heating, which accompanies changes in the refractive index and reflectance.
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公开(公告)号:CA1191477A
公开(公告)日:1985-08-06
申请号:CA426785
申请日:1983-04-27
Applicant: IBM
Inventor: BRADY MICHAEL J , MEYERSON BERNARD S , WARLAUMONT JOHN M
Abstract: X-RAY MASK SUBSTRATE AND METHOD OF FABRICATION THEREOF An improved X-ray lithography mask has been fabricated by forming an X ray absorbing lithography pattern on a supporting foil of hydrogenated amorphous carbon. The substrate foil is formed by depositing a carbon film in the presence of hydrogen onto a surface having a temperature below 375.degree.C. The hydrogen concentration is maintained sufficiently high that the resulting film has at least one atom percent of hydrogen. A film having about 20 atom percent of hydrogen is preferred. While impurities are permitted, impurities must be maintained at a level such that the optical bandgap of the resulting film is at least one electron volt. A film with an optical bandgap of about 2 electron volts is preferred.
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公开(公告)号:FR2376537A1
公开(公告)日:1978-07-28
申请号:FR7736208
申请日:1977-11-24
Applicant: IBM
Inventor: COMERFORD LIAM D , CROW JOHN D , LAFF ROBERT A , LEAN ERIC G , BRADY MICHAEL J
IPC: G02B6/12 , G02B6/30 , G02B6/42 , H01L27/15 , H01L33/00 , H01S5/00 , H01S5/022 , H01S5/042 , H01S5/40 , H01S3/23 , H01S3/101
Abstract: An optical assembly structure wherein miniature optical components such as lasers, modulators, lenses, thin-film and fiber-optic waveguides, and photodetectors are critically aligned and supported for coactive operation by means of two or more wafers which are formed with complementary grooves and mortises to support the loose optical components such as lenses and fiber-optic waveguides and to receive alignment rails to insure the relativity of the wafers, which also have formed integral therewith optical elements such as waveguides, modulators, and lasers, to produce an integrated optical assembly somewhat in the manner of an "optical bench," wherein the bench structure also provides an active optical element.
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公开(公告)号:CA2153441A1
公开(公告)日:1996-03-10
申请号:CA2153441
申请日:1995-07-07
Applicant: IBM
Inventor: MOSKOWITZ PAUL A , BRADY MICHAEL J , COTEUS PAUL W
IPC: G08B13/24 , G06K19/077 , H01L23/66 , H04B1/59
Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.
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公开(公告)号:CA1085950A
公开(公告)日:1980-09-16
申请号:CA287494
申请日:1977-09-26
Applicant: IBM
Inventor: COMERFORD LIAM D , CROW JOHN D , LAFF ROBERT A , LEAN ERIC G , BRADY MICHAEL J
IPC: G02B6/12 , G02B6/30 , G02B6/42 , H01L27/15 , H01L33/00 , H01S5/00 , H01S5/022 , H01S5/042 , H01S5/40 , H01L31/12 , G02B5/14
Abstract: SELF-ALIGNING SUPPORT STRUCTURE FOR OPTICAL COMPONENTS An optical assembly structure wherein miniature optical components such as lasers, modulators, lenses, thin-film and fiber-optic waveguides, and photodetectors are critically aligned and supported for coactive operation by means of two or more wafers which are formed with complementary grooves and mortises to support the loose optical components such as lenses and fiber-optic waveguides and to receive alignment rails to insure the relativity of the wafers, which also have formed integral therewith optical elements such as waveguides, modulators, and lasers, to produce an integrated optical assembly somewhat in the manner of an "optical bench", wherein the bench structure also provides an active optical element.
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公开(公告)号:CA2089791C
公开(公告)日:1998-11-24
申请号:CA2089791
申请日:1993-02-18
Applicant: IBM
Inventor: BRADY MICHAEL J , MARINO JEFFREY R , FARRELL CURTIS E , KANG SUNG K , PURUSHOTHAMAN SAMPATH , MIKALSEN DONALD J , MOSKOWITZ PAUL A , O'SULLIVAN EUGENE J , O'TOOLE TERRENCE R , RIELEY SHELDON C , WALKER GEORGE F
IPC: H01L21/60 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/603 , H01L21/768 , H01L23/495 , H01L23/498 , H01L23/532
Abstract: Silicon and germanium containing materials are used as a surface of conductors i n electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these s urfaces. These materials are used as a surface coating for lead frames for packaging inte grated circuit chips. These materials can be decal transferred onto conductor surfaces or elect rolessly or electrolytically disposed thereon.
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公开(公告)号:CA2153440A1
公开(公告)日:1996-03-10
申请号:CA2153440
申请日:1995-07-07
Applicant: IBM
Inventor: BRADY MICHAEL J , COFINO THOMAS A , HEINRICH HARLEY K , JOHNSON GLEN W , MOSKOWITZ PAUL A , WALKER GEORGE F
IPC: H01Q1/40 , G01V15/00 , G06K19/077 , H01Q1/22 , H01Q7/00 , H01Q9/16 , H01Q21/26 , H01Q21/28 , H04B1/38 , H04B1/59
Abstract: The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.
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公开(公告)号:BR9301497A
公开(公告)日:1993-10-26
申请号:BR9301497
申请日:1993-04-12
Applicant: IBM
Inventor: BRADY MICHAEL J , FARREL CURTIS E , KANG SUNG K , MARINO JEFFREY R , MIKALSEN DONALD J , MOSKOWITZ PAUL A , O'SULLIVAN EUGENE J , TOOLE TERRENCE R O , PURUSHOTHAMAN SAMPATH , RIELEY SHELDON C , WALKER GEORGE F
IPC: H01L21/60 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/603 , H01L21/768 , H01L23/495 , H01L23/498 , H01L23/532 , H01L21/40
Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.
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公开(公告)号:CA2089791A1
公开(公告)日:1993-10-25
申请号:CA2089791
申请日:1993-02-18
Applicant: IBM
Inventor: BRADY MICHAEL J , FARRELL CURTIS E , KANG SUNG K , MARINO JEFFREY R , MIKALSEN DONALD J , MOSKOWITZ PAUL A , O'SULLIVAN EUGENE J , O'TOOLE TERRENCE R , PURUSHOTHAMAN SAMPATH , RIELEY SHELDON C , WALKER GEORGE F
IPC: H01L21/60 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/603 , H01L21/768 , H01L23/495 , H01L23/498 , H01L23/532
Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.
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