公开(公告)号：CA2089791C

公开(公告)日：1998-11-24

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  MARINO JEFFREY R ,  FARRELL CURTIS E ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used as a surface of conductors i n electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these s urfaces. These materials are used as a surface coating for lead frames for packaging inte grated circuit chips. These materials can be decal transferred onto conductor surfaces or elect rolessly or electrolytically disposed thereon.

公开(公告)号：BR9301497A

公开(公告)日：1993-10-26

申请号：BR9301497

申请日：1993-04-12

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARREL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  TOOLE TERRENCE R O ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L21/40

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：CA2089791A1

公开(公告)日：1993-10-25

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARRELL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.