公开(公告)号：CA2144405A1

公开(公告)日：1995-12-04

申请号：CA2144405

申请日：1995-03-10

Applicant: IBM

Inventor： CALI MATTHEW F ,  CUOMO JEROME J ,  MIKALSEN DONALD J ,  RUTLEDGE JOSEPH D ,  SELKER EDWIN J

IPC: G01L5/22 ,  G05G9/047 ,  G06F3/033 ,  G06F3/023

Abstract: A strain sensitive columnar transducer for a data entry keyboard contains a column upstanding from the keyboard. Strain sensitive orthogonally oriented patterns are formed on a single flexible planar sheet which is sliced to place each of the patterns on a separate tab. The planar sheet is forced over the column so that the patterns lie up against the sides of the column to measure force exerted on the column.

公开(公告)号：DE3885706T2

公开(公告)日：1994-05-11

申请号：DE3885706

申请日：1988-08-18

Applicant: IBM

Inventor： MIKALSEN DONALD J ,  ROSSNAGEL STEPHEN M

IPC: H01L21/203 ,  C23C14/34 ,  C23C14/35 ,  H01J37/34 ,  H01L21/285

Abstract: A magnetron sputter etching/deposition system comprising a hollow cathode electron source (20) in combination with a magnetron sputter deposition plasma device (1) within a containment chamber (17), said hollow cathode (20) being disposed to inject electrons into the magnetic field (15) of the magnetron plasma device (1) adjacent to the magnetron cathode surface (10) to which a deposition source (30) is affixed. Said system further includes means for initiating and maintaining a discharge plasma within the hollow cathode (20) and for initiating and maintaining the magnetron plasma. The improvement of the invention comprises a workpiece (40) to be coated, located in said chamber (17), spaced from said magnetron cathode surface (10) which may be biased to attract particles emitted by said deposition source (30). A particle collimation filter (34) is interposed between the magnetron cathode surface (10) and said workpiece (40) but outside of said plasma region, which prevents any deposition particles (38) from reaching said workpiece (40) which are not travelling in a direction substantially perpendicular thereto. Said particle collimation filter assembly (34) is composed of a plurality of closely packed elongated tubes (36), the axis of all of said tubes being disposed normal to both the magnetron cathode surface (10) and the workpiece (40) to be coated.

公开(公告)号：DE3885706D1

公开(公告)日：1993-12-23

申请号：DE3885706

申请日：1988-08-18

Applicant: IBM

Inventor： MIKALSEN DONALD J ,  ROSSNAGEL STEPHEN M

IPC: H01L21/203 ,  C23C14/34 ,  C23C14/35 ,  H01J37/34 ,  H01L21/285

Abstract: A magnetron sputter etching/deposition system comprising a hollow cathode electron source (20) in combination with a magnetron sputter deposition plasma device (1) within a containment chamber (17), said hollow cathode (20) being disposed to inject electrons into the magnetic field (15) of the magnetron plasma device (1) adjacent to the magnetron cathode surface (10) to which a deposition source (30) is affixed. Said system further includes means for initiating and maintaining a discharge plasma within the hollow cathode (20) and for initiating and maintaining the magnetron plasma. The improvement of the invention comprises a workpiece (40) to be coated, located in said chamber (17), spaced from said magnetron cathode surface (10) which may be biased to attract particles emitted by said deposition source (30). A particle collimation filter (34) is interposed between the magnetron cathode surface (10) and said workpiece (40) but outside of said plasma region, which prevents any deposition particles (38) from reaching said workpiece (40) which are not travelling in a direction substantially perpendicular thereto. Said particle collimation filter assembly (34) is composed of a plurality of closely packed elongated tubes (36), the axis of all of said tubes being disposed normal to both the magnetron cathode surface (10) and the workpiece (40) to be coated.

公开(公告)号：CA2089791C

公开(公告)日：1998-11-24

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  MARINO JEFFREY R ,  FARRELL CURTIS E ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used as a surface of conductors i n electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these s urfaces. These materials are used as a surface coating for lead frames for packaging inte grated circuit chips. These materials can be decal transferred onto conductor surfaces or elect rolessly or electrolytically disposed thereon.

公开(公告)号：BR9301497A

公开(公告)日：1993-10-26

申请号：BR9301497

申请日：1993-04-12

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARREL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  TOOLE TERRENCE R O ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L21/40

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：CA2089791A1

公开(公告)日：1993-10-25

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARRELL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.