公开(公告)号：GB2506770A8

公开(公告)日：2015-09-23

申请号：GB201321363

申请日：2010-08-12

Applicant: IBM ,  RF MICRO DEVICES INC

Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS LEDDY ,  STAMPER ANTHONY K ,  COSTA JULIO CARLOS ,  HAMMOND JONATHAN HALE

IPC: B81B3/00 ,  B81C3/00 ,  H01H1/00

Abstract: A MEMS structure, comprising a lower forcing electrode and a lower contact electrode, remote from the lower forcing electrode; a cantilever beam 34 is positioned above the lower forcing electrode and the lower contact electrode; a capping layer 42 hermetically seals the lower forcing electrode, the lower contact electrode and the cantilever beam 34, the capping layer 42 having a sealed portion 40 positioned on a side of the lower contact electrode, remote from the lower forcing electrode and an end portion of the cantilever beam 34. Wherein the cantilever beam 34 may be devoid of stresses from material variability of a sealing material used to seal the capping layer 42.

公开(公告)号：GB2485714A8

公开(公告)日：2015-09-23

申请号：GB201203306

申请日：2010-08-12

Applicant: IBM ,  RF MICRO DEVICES INC

Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS L ,  STAMPER ANTHONY K ,  HAMMOND JONATHAN HALE ,  COSTA JULIO CARLOS

IPC: B81C1/00

Abstract: Integrated MEMS switches, design structures and methods of fabricating such switches are provided. The method includes forming at least one tab (32a) of sacrificial material (36) on a side of a switching device (34) which is embedded in the sacrificial material. The method further includes stripping the sacrificial material through at least one opening (40) formed on the at least one tab which is on the side of the switching device, and sealing the at least one opening with a capping material (42).

公开(公告)号：GB2506770A

公开(公告)日：2014-04-09

申请号：GB201321363

申请日：2010-08-12

Applicant: IBM ,  RF MICRO DEVICES INC

Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS LEDDY ,  STAMPER ANTHONY K ,  COSTA JULIO CARLOS ,  HAMMOND JONATHAN HALE

IPC: B81B3/00 ,  B81C3/00 ,  H01H1/00

Abstract: A MEMS structure, comprising a lower forcing electrode and a lower contact electrode, remote from the lower forcing electrode; a cantilever beam 34 is positioned above the lower forcing electrode and the lower contact electrode; a capping layer 42 hermetically seals the lower forcing electrode, the lower contact electrode and the cantilever beam 34, the capping layer 42 having a sealed portion 40 positioned on a side of the lower contact electrode, remote from the lower forcing electrode and an end portion of the cantilever beam 34. Wherein the cantilever beam 34 may be devoid of stresses from material variability of a sealing material used to seal the capping layer 42.

公开(公告)号：GB2485714B8

公开(公告)日：2015-09-23

申请号：GB201203306

申请日：2010-08-12

Applicant: IBM ,  RF MICRO DEVICES INC

Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS L ,  STAMPER ANTHONY K ,  HAMMOND JONATHAN HALE ,  COSTA JULIO CARLOS

IPC: B81C1/00

公开(公告)号：GB2485714B

公开(公告)日：2014-05-14

申请号：GB201203306

申请日：2010-08-12

Applicant: IBM ,  RF MICRO DEVICES INC

Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS L ,  STAMPER ANTHONY K ,  HAMMOND JONATHAN HALE ,  COSTA JULIO CARLOS

IPC: B81C1/00

公开(公告)号：GB2485714A

公开(公告)日：2012-05-23

申请号：GB201203306

申请日：2010-08-12

Applicant: IBM ,  RF MICRO DEVICES INC

Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS L ,  STAMPER ANTHONY K ,  HAMMOND JONATHAN HALE ,  COSTA JULIO CARLOS

IPC: B81C1/00

Abstract: Integrated MEMS switches, design structures and methods of fabricating such switches are provided. The method includes forming at least one tab (32a) of sacrificial material (36) on a side of a switching device (34) which is embedded in the sacrificial material. The method further includes stripping the sacrificial material through at least one opening (40) formed on the at least one tab which is on the side of the switching device, and sealing the at least one opening with a capping material (42).

公开(公告)号：GB2506770B8

公开(公告)日：2015-09-23

申请号：GB201321363

申请日：2010-08-12

Applicant: IBM ,  RF MICRO DEVICES INC

Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS LEDDY ,  STAMPER ANTHONY K ,  COSTA JULIO CARLOS ,  HAMMOND JONATHAN HALE

IPC: B81B3/00 ,  B81C3/00 ,  H01H1/00

公开(公告)号：EP1839338A4

公开(公告)日：2011-11-09

申请号：EP05854112

申请日：2005-12-14

Applicant: IBM

Inventor： ADKISSON JAMES W ,  GAMBINO JEFFREY P ,  JAFFE MARK D ,  LEIDY ROBERT K ,  RASSEL RICHARD J ,  STAMPER ANTHONY K

IPC: H01L29/04 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L21/76819 ,  H01L21/76834 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14645 ,  H01L27/14683

公开(公告)号：EP1979932A4

公开(公告)日：2012-03-14

申请号：EP07710130

申请日：2007-01-15

Applicant: IBM

Inventor： ERTURK METE ,  GROVES ROBERT A ,  JOHNSON JEFFREY B ,  JOSEPH ALVIN J ,  LIU QIZHI ,  SPROGIS EDMUND J ,  STAMPER ANTHONY K

IPC: H01L21/77 ,  H01L21/302 ,  H01L21/306 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1974379A4

公开(公告)日：2011-06-01

申请号：EP07710226

申请日：2007-01-19

Applicant: IBM

Inventor： COOLBAUGH DOUGLAS D ,  DOWNES KEITH E ,  LINDGREN PETER J ,  STAMPER ANTHONY K

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L23/481 ,  H01L21/76808 ,  H01L21/76813 ,  H01L21/76832 ,  H01L23/5223 ,  H01L28/60 ,  H01L2221/1036 ,  H01L2924/0002 ,  H01L2924/00