DIODE CIRCUIT AND METHOD FOR MAKING SAME
    1.
    发明申请
    DIODE CIRCUIT AND METHOD FOR MAKING SAME 审中-公开
    二极管开关和制造二极管开关的方法

    公开(公告)号:WO03050885A3

    公开(公告)日:2003-09-04

    申请号:PCT/EP0213138

    申请日:2002-11-22

    CPC classification number: H01L29/417 H01L27/0676 H01L29/868

    Abstract: The invention concerns a diode circuit having a PIN structure (10), the semiconductor N being an embedded layer (32) whereon the region I (34) is deposited by epitaxial deposit, and an intermediate layer (P) (36) being introduced into the epitaxial layer. A metallization (38) of the semiconductor layer P and a metallization (44, 46) of the semiconductor layer N (32) are located on the same main surface of the semiconductor substrate (20) such that it is possible to incorporate comprising an integrated capacitor (14), and integrated resistor (12) and/or an integrated inductor (16).

    Abstract translation: 二极管电路包括PIN二极管结构10,其中,所述n型半导体层是掩埋层32,其上的i区域34通过外延施加,并且其中,在所述外延层的p型半导体层被引入第36 在p型半导体层和n型半导体层32的触点44,46的触点38被布置在半导体基板20的同一主表面上,因此与一体的冷凝器14,一个集成的电阻器12和/或整合 集成电感器16是可能的。

    2.
    发明专利
    未知

    公开(公告)号:DE50209602D1

    公开(公告)日:2007-04-12

    申请号:DE50209602

    申请日:2002-07-25

    Abstract: The magnetic component uses at least two different layers of magnetic material for carrying and amplifying the magnetic flux. The use of two different layers which may, however, have the same material composition allows the magnetic conductors to form a magnetic circuit with a locally matched domain alignment. The magnetic component accordingly allows considerable improvements to be achieved in the component parameter, in particular a considerable increase in the Q-factor.

    3.
    发明专利
    未知

    公开(公告)号:DE10158798A1

    公开(公告)日:2003-06-18

    申请号:DE10158798

    申请日:2001-11-30

    Abstract: A capacitor includes a semiconductor substrate in which a trench is formed through which the substrate is doped. A dielectric layer covers the surface of the trench, wherein furthermore an electrically conductive material is arranged in the trench. A first contact structure for contacting the electrically conductive material in the trench in an electrically conductive manner and a second contact structure for contacting the doped semiconductor substrate in an electrically conductive manner are also formed in the capacitor. The capacitor has low series resistance of the electrodes and may be produced in a simple manner.

    4.
    发明专利
    未知

    公开(公告)号:DE10330838B4

    公开(公告)日:2005-08-25

    申请号:DE10330838

    申请日:2003-07-08

    Abstract: An electronic device includes a substrate, an insulating layer arranged on the substrate, the insulating layer having an opening in an area of the surface of the substrate, an active layer arranged within the opening on the surface of the substrate, the active layer including a guard ring in those areas of the surface and of the active layer which are adjacent to the insulating layer, and a contacting layer arranged on an area of the active layer, the contact layer being adjacent to an area of the guard ring. The device may be produced by a process of three-fold self-alignment, to be precise utilizing a spacer process by means of which a diffusion source having a lateral extension far below the lithography limit is made possible.

    5.
    发明专利
    未知

    公开(公告)号:DE10330838A1

    公开(公告)日:2005-02-10

    申请号:DE10330838

    申请日:2003-07-08

    Abstract: An electronic device includes a substrate, an insulating layer arranged on the substrate, the insulating layer having an opening in an area of the surface of the substrate, an active layer arranged within the opening on the surface of the substrate, the active layer including a guard ring in those areas of the surface and of the active layer which are adjacent to the insulating layer, and a contacting layer arranged on an area of the active layer, the contact layer being adjacent to an area of the guard ring. The device may be produced by a process of three-fold self-alignment, to be precise utilizing a spacer process by means of which a diffusion source having a lateral extension far below the lithography limit is made possible.

    CAPACITOR AND A METHOD FOR PRODUCING A CAPACITOR

    公开(公告)号:AU2002356602A1

    公开(公告)日:2003-06-10

    申请号:AU2002356602

    申请日:2002-11-14

    Abstract: A capacitor includes a semiconductor substrate in which a trench is formed through which the substrate is doped. A dielectric layer covers the surface of the trench, wherein furthermore an electrically conductive material is arranged in the trench. A first contact structure for contacting the electrically conductive material in the trench in an electrically conductive manner and a second contact structure for contacting the doped semiconductor substrate in an electrically conductive manner are also formed in the capacitor. The capacitor has low series resistance of the electrodes and may be produced in a simple manner.

    8.
    发明专利
    未知

    公开(公告)号:DE10160829A1

    公开(公告)日:2003-06-26

    申请号:DE10160829

    申请日:2001-12-11

    Abstract: The invention concerns a diode circuit having a PIN structure (10), the semiconductor N being an embedded layer (32) whereon the region I (34) is deposited by epitaxial deposit, and an intermediate layer (P) (36) being introduced into the epitaxial layer. A metallization (38) of the semiconductor layer P and a metallization (44, 46) of the semiconductor layer N (32) are located on the same main surface of the semiconductor substrate (20) such that it is possible to incorporate comprising an integrated capacitor (14), and integrated resistor (12) and/or an integrated inductor (16).

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