公开(公告)号：JP2007112134A

公开(公告)日：2007-05-10

申请号：JP2006302593

申请日：2006-11-08

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： BOGNER GEORG DIPL PHYS ,  GRAMANN WOLFGANG ,  KROMOTIS PATRICK ,  MARCHL WERNER ,  SPAETH WERNER DR ,  WAITL GUENTHER

IPC: B29C33/38 ,  B29C39/02 ,  B29D11/00 ,  B29L11/00 ,  F21V5/04 ,  G02B3/00 ,  H01L21/56 ,  H01L25/075 ,  H01L33/00

CPC classification number: G02B3/0031 ,  B29D11/00278 ,  B29D11/00365 ,  F21V5/04 ,  F21Y2115/10 ,  G02B3/0056 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a rational manufacturing method of a lens mold suitable for manufacturing a lens area.
SOLUTION: When spheres are fully tightly arranged in a hexagonal housing part, a group of spheres spontaneously becomes a hexagonal lattice structure. Therefore the housing part can be completely filled with spheres to be shaped. Since the housing part 20 has a hexagonal cross section and the small spheres 22 are tightly mounted, the small spheres 22 can be arranged correspondingly to the hexagonal lattice structure. The small sphere 22 has a radius substantially corresponding to the radius of a micro lens 8 to be manufactured, and the small sphere 22 can be tightly housed in the housing part 20.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供适合于制造透镜区域的透镜模具的合理制造方法。 解决方案：当球体完全紧密地布置在六边形壳体部分中时，一组球自发地变成六边形格子结构。 因此，壳体部分可以被完全填充成球形。 由于壳体部件20具有六边形横截面并且小球体22紧密地安装，所以小球体22可以相对于六边形格子结构排列。 小球22具有与要制造的微透镜8的半径基本对应的半径，并且小球体22可以紧密地容纳在壳体部分20中。版权所有（C）2007，JPO＆INPIT

公开(公告)号：DE10107689B4

公开(公告)日：2010-11-11

申请号：DE10107689

申请日：2001-02-19

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GRAMANN WOLFGANG ,  OBERSCHMID RAIMUND ,  SPAETH WERNER ,  TEICH WOLFGANG

IPC: H01L21/66 ,  G01M11/00 ,  G01N21/66 ,  G01R31/26

公开(公告)号：WO0213231A3

公开(公告)日：2002-06-20

申请号：PCT/DE0102874

申请日：2001-07-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  GRAMANN WOLFGANG ,  KROMOTIS PATRICK ,  MARCHL WERNER ,  SPAETH WERNER ,  WAITL GUENTER

Inventor： BOGNER GEORG ,  GRAMANN WOLFGANG ,  KROMOTIS PATRICK ,  MARCHL WERNER ,  SPAETH WERNER ,  WAITL GUENTER

IPC: B29C39/02 ,  B29D11/00 ,  B29L11/00 ,  F21V5/04 ,  G02B3/00 ,  H01L25/075 ,  H01L33/00 ,  F21V5/00

CPC classification number: G02B3/0031 ,  B29D11/00278 ,  B29D11/00365 ,  F21V5/04 ,  F21Y2115/10 ,  G02B3/0056 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a radiation source, which has an assembly of semiconductor chips that are positioned beneath a field of micro-lenses (8) arranged in a hexagonal lattice structure. The radiation source is characterised by a high radiation output and a high radiation density.

Abstract translation: 辐射源包括布置在以六边形格子结构布置的微透镜（8）的场下方的半导体芯片阵列。 辐射源具有高辐射功率和辐射率的特点。

公开(公告)号：DE50308190D1

公开(公告)日：2007-10-25

申请号：DE50308190

申请日：2003-07-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： DACHS JUERGEN ,  GRAMANN WOLFGANG ,  KAEMPF MATHIAS ,  SINGER FRANK ,  STEEGMUELLER ULRICH

IPC: G02B6/42 ,  G11B7/12 ,  G11B7/125 ,  G11B7/22

Abstract: The invention relates to an optical scanning head for reading an optical data memory. Said head comprises a substrate (12) with a principal surface, an edge-emitting laser component (30), which is located on the principal surface of the substrate (12) and whose emission axis (34) runs essentially parallel to the first principal plane, a deflection device (36), which is positioned on the principal surface of the substrate, for deflecting the laser radiation (32) in a direction that is essentially perpendicular to the principal surface, at least one signal detector (20, 22; 62) for recording the laser radiation that is reflected by the optical data memory and an optical element (40), which conducts the deflected laser radiation to the optical data memory and the reflected laser radiation to the signal detector(s) (20, 22), said optical element (40) being connected to the substrate (12) by at least one support element (36, 38). The invention also relates to a method for producing a scanning head of this type.

公开(公告)号：DE10107689A1

公开(公告)日：2003-01-02

申请号：DE10107689

申请日：2001-02-19

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GRAMANN WOLFGANG ,  OBERSCHMID RAIMUND ,  SPAETH WERNER ,  TEICH WOLFGANG

IPC: G01N21/66 ,  H01L21/66 ,  G01M11/00 ,  G01R31/26 ,  H01L33/00

Abstract: An electrolyte is introduced between the wafer contact region and probe contact (31) for establishing electrical connection between the wafer (2) and measuring probe (3). An Independent claim is included for opto-electronic component parameter measuring device.

公开(公告)号：DE102004012014A1

公开(公告)日：2005-10-13

申请号：DE102004012014

申请日：2004-03-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SPAETH WERNER ,  GRAMANN WOLFGANG ,  GROETSCH STEFAN ,  SCHWARZ THOMAS ,  STEEGMUELLER ULRICH ,  KUEHNELT MICHAEL

IPC: H01S3/094 ,  H01S3/0941 ,  H01S3/109 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/04 ,  H01S5/06 ,  H01S5/14 ,  H01S5/183

Abstract: Surface emitting laser comprises semiconductor chip (1), external resonator mirror (2) and at least one optical pumping device (3) of chip. Pumping device contains pump laser (4), beam shaper (5), reverse element (8) and concave mirror (9). Pumping device includes assembly platform (6) for its elements with main surface (7) facing elements of pumping device. Preferably platform main surface is located orthogonally to main radiation direction (11) of surface emitting laser.

公开(公告)号：DE10253907A1

公开(公告)日：2004-04-01

申请号：DE10253907

申请日：2002-11-19

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GRAMANN WOLFGANG ,  DACHS JUERGEN ,  KAEMPF MATHIAS ,  STEEGMUELLER ULRICH ,  SINGER FRANK

IPC: G02B6/42 ,  G11B7/12 ,  G11B7/125 ,  G11B7/22

Abstract: The device has a substrate, a laser component whose radiation axis is essentially parallel to a first main plane, a deflector for deflecting the beam perpendicularly to a main surface, at least one signal detector for detecting laser radiation reflected from the data memory and an optical element joined to the substrate via a supporting element(s) for guiding the deflected beam to the data memory and the reflected beam to the signal detector(s). The device has a substrate (12) with a main surface, an edge emitting laser component (30) whose radiation axis is essentially parallel to the first main plane, a deflector (36) on the main substrate surface for deflecting the laser radiation (32) essentially perpendicularly to the main surface, at least one signal detector (20,22) for detecting the laser radiation reflected from the data memory and an optical element (40) for guiding the deflected beam to the data memory and the reflected beam to the signal detector(s). The optical element is joined to the substrate via at least one supporting element (36,38). AN Independent claim is also included for the following: (a) a method of manufacturing an inventive scanning head.

公开(公告)号：DE59707787D1

公开(公告)日：2002-08-29

申请号：DE59707787

申请日：1997-01-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GRAMANN WOLFGANG ,  SPAETH WERNER ,  WAITL GUENTHER ,  BRUNNER HERBERT

IPC: G09F9/33 ,  H01L25/075 ,  H01L33/00 ,  H01L33/38 ,  H01L33/40

Abstract: The invention concerns an LED device (1) comprising at least one LED chip (2), wherein front contact plating (8) is disposed on a light outlet surface of a light-emitting body (5) and rear contact plating (6) is disposed on a side of the light-emitting body (5) lying opposite the light outlet surface. The LED chip (2) is disposed between a first (15) and a second strip conductor carrier (31), the first strip conductor (15) being transparent and comprising at least one first electrical conductor (16) which contacts the front contact plating (8), and the second strip conductor carrier (31) comprising at least one second electrical conductor (13) which contacts the rear contact plating (6). The LED device (1) according to the invention has inter alia the particular advantage that the size of the LED chip (2) is reduced with respect to conventional LED devices and hence the beam density can be increased.

公开(公告)号：DE102004012014B4

公开(公告)日：2009-09-10

申请号：DE102004012014

申请日：2004-03-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SPAETH WERNER ,  GRAMANN WOLFGANG ,  GROETSCH STEFAN ,  SCHWARZ THOMAS ,  STEEGMUELLER ULRICH ,  KUEHNELT MICHAEL

IPC: H01S5/04 ,  H01S3/094 ,  H01S3/0941 ,  H01S3/109 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/06 ,  H01S5/14 ,  H01S5/183

Abstract: Surface emitting laser comprises semiconductor chip (1), external resonator mirror (2) and at least one optical pumping device (3) of chip. Pumping device contains pump laser (4), beam shaper (5), reverse element (8) and concave mirror (9). Pumping device includes assembly platform (6) for its elements with main surface (7) facing elements of pumping device. Preferably platform main surface is located orthogonally to main radiation direction (11) of surface emitting laser.

公开(公告)号：DE10331565A1

公开(公告)日：2004-12-30

申请号：DE10331565

申请日：2003-07-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： OBERSCHMID RAIMUND ,  MAIWALD HUBERT ,  BAUR JOHANNES ,  HAERLE VOLKER ,  GRAMANN WOLFGANG

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/68 ,  H01L21/66

Abstract: A wafer holding device (1) comprises a vacuum chamber (3) with a holed (4) suction disc (5) against the wafer (6). The holding disc is at least partly transparent to electromagnetic radiation emitted by the wafer that penetrates the disc. Independent claims are also included for the following: (a) a wafer measuring device;and (b) a wafer measuring process.