公开(公告)号：US10017382B2

公开(公告)日：2018-07-10

申请号：US15043850

申请日：2016-02-15

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: H01L21/00 ,  B81C1/00 ,  B81B3/00 ,  G01C19/56 ,  G01P15/00 ,  G01L19/00 ,  G01L9/00 ,  G01P15/08 ,  G01P15/125 ,  B81B7/04 ,  G01C19/5769 ,  B81B7/02 ,  B81B7/00

CPC classification number: B81C1/00293 ,  B81B3/0021 ,  B81B7/0041 ,  B81B7/007 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81C1/00134 ,  B81C1/00309 ,  B81C2201/013 ,  B81C2203/0118 ,  G01C19/56 ,  G01C19/5769 ,  G01L9/0044 ,  G01L19/0076 ,  G01L19/0092 ,  G01P15/00 ,  G01P15/0802 ,  G01P15/125

Abstract: A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

公开(公告)号：US20180186627A1

公开(公告)日：2018-07-05

申请号：US15857461

申请日：2017-12-28

Applicant: Intel IP Corporation

Inventor： Gerald Ofner ,  Thorsten Meyer ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00238 ,  B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/10 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

公开(公告)号：US20180164241A1

公开(公告)日：2018-06-14

申请号：US15567632

申请日：2016-04-11

Applicant: Dan Haronian

Inventor： Dan Haronian

IPC: G01N27/26 ,  G01N31/22 ,  H01L41/113 ,  H02N2/18 ,  B81B3/00

CPC classification number: G01N27/26 ,  B81B3/0021 ,  B81B3/0064 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/03 ,  B81B2203/0136 ,  G01N27/4145 ,  G01N31/22 ,  H01L41/1136 ,  H02N1/08 ,  H02N2/18

Abstract: The present invention discloses, inter alia, a micro-electromechanical device (MEMD) for sensing and for harvesting electrical energy responsive to being subjected to mechanical forces, comprising at least one first conductive element fixedly mounted on a first support, wherein the at least one first conductive element is chargeable with electrons; and at least one second conductive element inertia-mounted on a second support such that the first and second supports are electrically isolated from each other.

公开(公告)号：US09988261B2

公开(公告)日：2018-06-05

申请号：US13917044

申请日：2013-06-13

Applicant: Robert Bosch GmbH

Inventor： Julian Gonska ,  Jochen Reinmuth ,  Kathrin Gutsche

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00 ,  B81B7/02

CPC classification number: B81B3/0018 ,  B81B7/0038 ,  B81B7/02 ,  B81B2201/025 ,  B81C1/00134

Abstract: A micromechanical device, in particular a sensor device, and a method for manufacturing a micromechanical device are provided. The micromechanical device has a housing, the housing including a first cavity, and the housing including a second cavity that is separate from the first cavity. The micromechanical device is configured in such a way that a predetermined first gas pressure prevails in the first cavity, and a predetermined second gas pressure which is reduced compared to the first gas pressure prevails in the second cavity. A heating element is situated in the area of the second cavity. The micromechanical device has a printed conductor, the heating element being heatable with the aid of the printed conductor.

公开(公告)号：US09975759B2

公开(公告)日：2018-05-22

申请号：US15647107

申请日：2017-07-11

Applicant: mCube, Inc.

Inventor： Chien Chen Lee ,  Tzu Feng Chang

IPC: H01L29/66 ,  B81B7/00 ,  B81C1/00 ,  G01P15/08 ,  G01R33/02 ,  G01C19/5783 ,  G01L1/00 ,  B81B3/00 ,  G01L9/00 ,  G01C19/5719

CPC classification number: B81B7/0074 ,  B81B3/0035 ,  B81B3/0062 ,  B81B3/0072 ,  B81B7/0032 ,  B81B7/0045 ,  B81B7/0048 ,  B81B7/0051 ,  B81B7/0054 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/0023 ,  B81C1/00261 ,  B81C1/00269 ,  B81C2203/0792 ,  G01C19/5719 ,  G01C19/5783 ,  G01L1/00 ,  G01L9/0042 ,  G01L19/0069 ,  G01L19/147 ,  G01P15/0802 ,  G01R33/02 ,  H04R2201/003

Abstract: A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

公开(公告)号：US09884757B2

公开(公告)日：2018-02-06

申请号：US14136199

申请日：2013-12-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Bernhard Winkler ,  Rainer Leuschner ,  Horst Theuss

IPC: H01L29/84 ,  B81B7/00 ,  G01L9/00 ,  G01L15/00 ,  G01L19/14

CPC classification number: B81B7/0058 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/015 ,  B81C2203/0154 ,  G01L9/0054 ,  G01L15/00 ,  G01L19/141 ,  G01L19/148 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

公开(公告)号：US09840409B2

公开(公告)日：2017-12-12

申请号：US14608038

申请日：2015-01-28

Applicant: InvenSense, Inc.

Inventor： Matthew Julian Thompson ,  Joseph Seeger

IPC: G01P15/125 ,  B81B3/00 ,  G01P15/08

CPC classification number: B81B3/0016 ,  B81B3/0037 ,  B81B2201/025 ,  B81B2203/0109 ,  B81B2203/0145 ,  B81B2203/053 ,  G01P15/125 ,  G01P2015/0837 ,  G01P2015/0854 ,  G01P2015/086

Abstract: A system and method for providing a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a substrate, an anchor region coupled to the substrate, at least one support arm coupled to the anchor region, at least two guiding arms coupled to and moving relative to the at least one support arm, a plurality of sensing elements disposed on the at least two guiding arms to measure motion of the at least two guiding arms relative to the substrate, and a proof mass system comprising at least one mass coupled to each of the at least two guiding arms by a set of springs. The proof mass system is disposed outside the anchor region, the at least one support arm, the at least two guiding arms, the set of springs, and the plurality of sensing elements.

公开(公告)号：US20170341927A1

公开(公告)日：2017-11-30

申请号：US15582333

申请日：2017-04-28

Applicant: Robert Bosch GmbH

Inventor： Benny Pekka Herzogenrath ,  Johannes Classen

IPC: B81B3/00 ,  G01C19/5712 ,  B81C1/00 ,  G01P15/125

CPC classification number: B81B3/0008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2203/0181 ,  B81B2203/0338 ,  B81C1/00174 ,  B81C1/00476 ,  B81C2201/0132 ,  G01C19/56 ,  G01C19/5656 ,  G01C19/5712 ,  G01P1/003 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0831 ,  G01P2015/0834 ,  G01P2015/0837

Abstract: A micromechanical sensor that is produced surface-micromechanically includes at least one mass element formed in a third functional layer that is non-perforated at least in certain portions. The sensor has a gap underneath the mass element that is formed by removal of a second functional layer and at least one oxide layer. The removal of the at least one oxide layer takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer.

公开(公告)号：US09728652B2

公开(公告)日：2017-08-08

申请号：US13358316

申请日：2012-01-25

Applicant: Klaus Elian ,  Franz-Peter Kalz ,  Horst Theuss

Inventor： Klaus Elian ,  Franz-Peter Kalz ,  Horst Theuss

IPC: H01L29/84 ,  H01L29/66 ,  B81C1/00 ,  G01P15/12 ,  G01L1/20

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2201/0292 ,  B81B2203/0361 ,  B81C1/00246 ,  G01L1/20 ,  G01P15/124

Abstract: A sensor device includes a semiconductor chip. The semiconductor chip has a sensing region sensitive to mechanical loading. A pillar is mechanically coupled to the sensing region.

公开(公告)号：US09718669B2

公开(公告)日：2017-08-01

申请号：US14984469

申请日：2015-12-30

Applicant: TAIWAN SEMICODUCTOR MANUFACTURING CO., LTD.

Inventor： Tung-Tsun Chen ,  Chia-Hua Chu

IPC: H01L29/84 ,  B81B1/00 ,  B81C1/00

CPC classification number: B81B1/004 ,  B81B2201/025 ,  B81B2201/0264 ,  B81C1/00087 ,  B81C1/00309 ,  B81C2201/019 ,  G01L9/00

Abstract: A micro-electro mechanical system (MEMS) pressure sensor includes a first substrate, a second substrate and a sensing structure. The second substrate is substantially parallel to the first substrate. The sensing structure is between the first substrate and the second substrate, and bonded to a portion of the first substrate and a portion of the second substrate, in which a first space between the first substrate and the sensing structure is communicated with outside, and a second space between the second substrate and the sensing structure is communicated with or isolated from the outside.