公开(公告)号：US20180316375A1

公开(公告)日：2018-11-01

申请号：US15769723

申请日：2015-12-08

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Richard J. DISCHLER

IPC: H04B1/18 ,  H01L23/498 ,  H01L25/16 ,  H01P5/08 ,  H01P3/16 ,  H01L23/66 ,  H01P1/24 ,  H01L23/367 ,  H01L25/065 ,  H05K1/18 ,  H05K1/14

CPC classification number: G06F1/16 ,  H05K1/0274 ,  H05K1/147 ,  H05K2201/045 ,  H05K2201/046

Abstract: Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.

公开(公告)号：US20180220536A1

公开(公告)日：2018-08-02

申请号：US15506035

申请日：2015-09-24

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： RALF GORDON CONRADS ,  HENDRIK HUISMAN ,  CARSTEN DEPPE ,  XI GU ,  GERO HEUSLER

IPC: H05K3/36 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K3/366 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/046 ,  H05K2203/049

Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) is adapted to be coupled to a bond wire (460a, 460b) independently from the other electrically conductive layer (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.

公开(公告)号：US20180205166A1

公开(公告)日：2018-07-19

申请号：US15859906

申请日：2018-01-02

Applicant: Methode Electronics, Inc.

Inventor： Robert Skepnek ,  Joseph Llorens ,  Alexandros Pirillis

IPC: H01R12/81 ,  H01R12/77 ,  H01R12/82

CPC classification number: H01R12/81 ,  G02B6/4281 ,  G06F1/1632 ,  H01R12/62 ,  H01R12/772 ,  H01R12/82 ,  H01R35/02 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/046 ,  H05K2201/2018

Abstract: A transceiver assembly is provided that includes a transceiver housing having first end, having a connector and an opposite second end having a passage in communication with a printed circuit board mounted in the housing. A peripheral connector having a first end and opposite second end includes a receptacle opening at the second end. A flex circuit is disposed between the first end of the peripheral connector and the second end of the transceiver housing. The peripheral connector is capable of being displaced with respect to the transceiver housing via the flex circuit.

公开(公告)号：US20170213923A1

公开(公告)日：2017-07-27

申请号：US15325045

申请日：2015-07-06

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami ,  Takeshi Yamana

IPC: H01L31/0392 ,  H02S40/34 ,  H05K1/18 ,  H01L31/02 ,  H05K1/02 ,  H02S40/22 ,  H02S20/32

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/42 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09263 ,  H05K2201/10121 ,  Y02E10/52

Abstract: This power generation module includes: a power generating portion (30) including a power generating element (19); and a wiring substrate. The wiring substrate includes: a reinforcement plate; and a flexible printed circuit (79) provided above the reinforcement plate. The flexible printed circuit (79) has: an FPC land portion (70) configured to have the power generating portion (30) mounted thereto; and a FPC wire portion (73) connected to the FPC land portion (70). The width of the FPC wire portion (73) is smaller than the width of the FPC land portion (70).

公开(公告)号：US20170212317A1

公开(公告)日：2017-07-27

申请号：US15328472

申请日：2015-07-22

Applicant: FCI USA LLC

Inventor： Alexander Eichler-Neumann ,  Michael Richter

IPC: G02B6/42

CPC classification number: G02B6/4281 ,  G02B6/4206 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4257 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/046 ,  H05K2201/056 ,  H05K2201/10121

Abstract: The present disclosure relates to an optoelectrical connector module comprising a flexible circuit board (10) having a first region and a second region and a printed circuit board (PCB) (20) that is attached to the first region of the flexible circuit board, and an optical module (30) that is attached to the second region of the flexible circuit board. The optical module is configured to transmit and/or receive light signals. The optoelectrical connector module comprises further a rigid support structure (40) having a first and a second surface that enclose a defined angle. The first surface of the rigid support structure is thereby arranged in parallel to the PCB and the second surface of the rigid support structure is connected to the flexible circuit board opposite the second region.

公开(公告)号：US20160227652A1

公开(公告)日：2016-08-04

申请号：US14999145

申请日：2016-04-01

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K3/36 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/141 ,  H05K3/32 ,  H05K3/366 ,  H05K3/40 ,  H05K2201/046 ,  H05K2201/048 ,  H05K2201/052 ,  Y10T29/49126 ,  Y10T156/1002

Abstract: A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a second rigid printed circuit board having a plurality of electrical components on at least one surface, and further having two flexible circuits area along one edge; forming electrode pads on the surfaces of the flexible circuits that are alignable respectively with the electrical contacts on the rigid circuit board when the two flexible circuits are spread apart by about 180°; spreading the flexible circuits apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Abstract translation: 一种制造电路的方法包括以下步骤：在至少一个表面上形成具有多个电触点的刚性印刷电路板; 在至少一个表面上形成具有多个电气部件的第二刚性印刷电路板，并且还沿着一个边缘具有两个柔性电路区域; 当两个柔性电路分开约180°时，在柔性电路的表面上分别形成可与电路板上的电触点对准的电极焊盘; 将柔性电路分开并将电极焊盘对准电触头; 以及在电极焊盘和电触点之间形成电连接。

公开(公告)号：US20150369457A1

公开(公告)日：2015-12-24

申请号：US14312377

申请日：2014-06-23

Applicant: EPISTAR CORPORATION

Inventor： Keng-Chuan CHANG ,  Chiu-Lin YAO

IPC: F21V19/00 ,  F21V23/00 ,  F21V3/00 ,  F21V5/04 ,  F21V23/06

CPC classification number: F21K9/23 ,  F21K9/238 ,  F21V23/006 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10106

Abstract: A light-emitting device disclosed herein comprises an integrated board having a first part and a second part form an angle other than zero with the first part and a light-emitting element disposed on the first part.

Abstract translation: 本文公开的发光装置包括具有第一部分和第二部分的集成板，其中第一部分和第二部分形成与第一部分不同于零的角度，并且发光元件设置在第一部分上。

公开(公告)号：US09170000B2

公开(公告)日：2015-10-27

申请号：US13653282

申请日：2012-10-16

Applicant: The Sloan Company, Inc.

Inventor： Bruce Quaal ,  Timothy Drew Ferrie ,  Aaron Meyer

IPC: F21V19/00 ,  F21V31/04 ,  F21S4/00 ,  F21V15/01 ,  F21V21/08 ,  F21V23/00 ,  G09F13/04 ,  G09F13/22 ,  H05K1/02 ,  F21V29/00 ,  H05K1/05 ,  H05K1/18 ,  F21Y101/02

CPC classification number: F21V29/508 ,  F21S4/10 ,  F21S4/20 ,  F21V15/01 ,  F21V19/001 ,  F21V19/003 ,  F21V21/0808 ,  F21V23/001 ,  F21V23/004 ,  F21V23/005 ,  F21V29/70 ,  F21V29/89 ,  F21V31/04 ,  F21Y2107/70 ,  F21Y2115/10 ,  G09F13/0404 ,  G09F13/22 ,  G09F2013/222 ,  H05K1/0278 ,  H05K1/05 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09081 ,  H05K2201/10106

Abstract: The present embodiments provide channel letter lighting devices and/or systems. A lighting system, comprising a plurality of electrically connected lighting units, comprising conductors to provide an electrical signal to each of the units. Each of the lighting units comprise a housing, a printed circuit board (PCB) mounted within the housing and having a plurality of tabs and a plurality light emitting elements on the tabs. The tabs are angled in relation of the remainder of the PCB or housing. The electrical signal applied to the light emitting elements causes them to emit light substantially away from said housing. The lighting system further comprises a sealant within the housing filling cavities around the light emitting elements and the cavity around said PCB and a mounting mechanism for mounting the unit to a structure.

Abstract translation: 本实施例提供了通道字母照明设备和/或系统。 一种照明系统，包括多个电连接的照明单元，包括用于向每个单元提供电信号的导体。 每个照明单元包括壳体，安装在壳体内的印刷电路板（PCB），并且在突片上具有多个突片和多个发光元件。 突片与PCB或外壳的其余部分有关。 施加到发光元件的电信号使得它们基本上远离所述壳体发光。 照明系统还包括在壳体内的密封剂，围绕发光元件和围绕所述PCB的空腔填充空腔以及用于将该单元安装到结构的安装机构。

公开(公告)号：US09080745B2

公开(公告)日：2015-07-14

申请号：US13010703

申请日：2011-01-20

Applicant: Bruce Quaal ,  Drew Ferrie ,  Aaron Meyer

Inventor： Bruce Quaal ,  Drew Ferrie ,  Aaron Meyer

IPC: F21V19/00 ,  F21S4/00 ,  F21V15/01 ,  F21V21/08 ,  F21V23/00 ,  F21V31/04 ,  G09F13/04 ,  G09F13/22 ,  H05K1/02 ,  F21V29/00 ,  F21Y101/02 ,  H05K1/18 ,  H05K1/05

CPC classification number: F21S4/28 ,  F21S4/20 ,  F21V15/01 ,  F21V19/001 ,  F21V19/003 ,  F21V21/0808 ,  F21V23/005 ,  F21V29/508 ,  F21V29/71 ,  F21V31/04 ,  F21Y2107/70 ,  F21Y2115/10 ,  G09F13/0404 ,  G09F13/22 ,  G09F2013/222 ,  H05K1/0278 ,  H05K1/05 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09081 ,  H05K2201/10106 ,  Y10T29/49165 ,  Y10T29/49993

Abstract: The present embodiments provide channel letter lighting devices and/or systems. A lighting system, comprising a plurality of electrically connected lighting units, comprising conductors to provide an electrical signal to each of the units. Each of the lighting units comprise a housing, a printed circuit board (PCB) mounted within the housing and having a plurality of tabs and a plurality light emitting elements on the tabs. The tabs are angled in relation of the remainder of the PCB or housing. The electrical signal applied to the light emitting elements causes them to emit light substantially away from said housing. The lighting system further comprises a sealant within the housing filling cavities around the light emitting elements and the cavity around said PCB and a mounting mechanism for mounting the unit to a structure.

公开(公告)号：US20150022978A1

公开(公告)日：2015-01-22

申请号：US13946359

申请日：2013-07-19

Applicant: Motorola Mobility LLC

Inventor： Paul R. Steuer ,  Patrick J. Cauwels

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1688 ,  H04M1/026 ,  H04M1/035 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/145 ,  H05K3/3494 ,  H05K3/366 ,  H05K9/0035 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2203/1105 ,  H05K2203/1115

Abstract: A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members (1301,1302,1303,1304) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate.