公开(公告)号：US09775231B2

公开(公告)日：2017-09-26

申请号：US14947091

申请日：2015-11-20

Applicant: Amphenol Corporation

Inventor： Marc B. Cartier, Jr.

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H01R43/20

CPC classification number: H05K1/0222 ,  H01R43/205 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/025 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/07 ,  H05K2201/09063 ,  H05K2201/09318 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.

公开(公告)号：US20150285474A1

公开(公告)日：2015-10-08

申请号：US14435163

申请日：2013-10-09

Applicant: ZUMTOBEL LIGHTING GMBH

Inventor： Kenneth Martin ,  David Gajdos ,  Steffen Block ,  Christian Daniel

IPC: F21V21/00 ,  F21V23/06

CPC classification number: F21V21/00 ,  F21V23/06 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K3/222 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/173 ,  H01L2924/00

Abstract: A printed circuit board for populating with illumination bodies, in particular LEDs, the board having population regions with connection options for the illumination bodies. A number of the population regions are connected in series by conductor tracks to form a group. The printed circuit board is further provided with additional connection options for electrical connection elements, in particular for 0-ohm resistors, via which at least some of the groups can be connected either in parallel or in series.

Abstract translation: 一种用于填充照明体，特别是LED的印刷电路板，具有用于照明体的连接选项的具有群体区域的板。 多个人口区域通过导体轨迹串联连接，形成一组。 印刷电路板还具有用于电连接元件的附加连接选项，特别是用于0欧姆电阻器，通过该连接元件，至少一些组可并联或串联连接。

公开(公告)号：US08839513B2

公开(公告)日：2014-09-23

申请号：US13963463

申请日：2013-08-09

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hidehiro Nakamura

IPC: H05K13/00

CPC classification number: H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

Abstract: A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Abstract translation: 一种制造凹形连接器基板的方法包括：准备具有将板状连接器引导到连接位置和切割部分的引导/保持区域的引导基板的步骤; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。

公开(公告)号：US20140247574A1

公开(公告)日：2014-09-04

申请号：US14353185

申请日：2012-12-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroto Tamaki

IPC: H01L23/552 ,  H01L23/64 ,  H01L23/50

CPC classification number: H01L23/552 ,  H01L23/50 ,  H01L23/642 ,  H01L23/647 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/0227 ,  H05K1/0231 ,  H05K1/0234 ,  H05K2201/09318 ,  H01L2924/00

Abstract: A printed circuit board includes a printed circuit board, a semiconductor device mounted on the printed circuit board, a capacitor element mounted on the printed circuit board 2, a ground conductor plane to which a ground terminal of the semiconductor device is connected, and first and second power source conductor planes which are arranged so as not to contact with each other. The second power source conductor plane and the ground conductor plane are arranged so as to oppose to each other to form a planar capacitor. The printed circuit board has a first connecting conductor which connects a power source terminal of the semiconductor device with the second power source conductor plane, and a second connecting conductor which connects the first power source conductor plane with the second power source conductor plane through a first terminal of the capacitor element. Thereby, an electromagnetic radiation noise is reduced.

Abstract translation: 印刷电路板包括印刷电路板，安装在印刷电路板上的半导体器件，安装在印刷电路板2上的电容器元件，连接半导体器件的接地端子的接地导体平面，以及第一和 第二电源导体平面被布置为不彼此接触。 第二电源导体平面和接地导体平面被布置成彼此相对以形成平面电容器。 印刷电路板具有将半导体器件的电源端子与第二电源导体平面连接的第一连接导体和将第一电源导体平面与第二电源导体平面连接的第二连接导体， 端子。 由此，降低了电磁辐射噪声。

公开(公告)号：US08759846B2

公开(公告)日：2014-06-24

申请号：US12671179

申请日：2008-08-11

Applicant: Jun Seok Park

Inventor： Jun Seok Park

IPC: H01L29/18 ,  H01L33/64 ,  H05K1/02

CPC classification number: H01L33/641 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2924/00011 ,  H05K1/0206 ,  H05K1/0209 ,  H05K2201/0209 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

Abstract: A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor.

Abstract translation: 提供了一种发光器件。 发光器件包括衬底，衬底上的第一引线框和第二引线框，第一发光二极管，衬底上的导热体和传热垫。 第一引线框架上的第一发光二极管电连接到第一引线框架和第二引线框架。 热导体与第一引线框架电分离。 传热垫与第一引线框架和热导体热接触，以将第一引线框架连接到热导体。

公开(公告)号：US20120210564A1

公开(公告)日：2012-08-23

申请号：US13453814

申请日：2012-04-23

Applicant: Robert Tilman Worl

Inventor： Robert Tilman Worl

IPC: H05K3/22 ,  H01P11/00 ,  H01R43/00

CPC classification number: H05K1/024 ,  H01P1/00 ,  H05K1/0275 ,  H05K1/0306 ,  H05K3/10 ,  H05K2201/0187 ,  H05K2201/09318 ,  H05K2201/09727 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49155

Abstract: An obfuscated radio frequency circuit may include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having differing dielectric constants to obfuscate functions of the circuit.

Abstract translation: 混淆的射频电路可以包括金属化层和在金属化层下的介电层。 电介质层可以由具有不同介电常数的多个电介质基片构成以模糊电路的功能。

公开(公告)号：US20120146748A1

公开(公告)日：2012-06-14

申请号：US13400965

申请日：2012-02-21

Applicant: Mohammad Tabatabai

Inventor： Mohammad Tabatabai

IPC: H01P3/08

CPC classification number: H01P3/026 ,  H05K1/024 ,  H05K1/0245 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09318

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract translation: 根据一个示例性实施例，用于降低介质损耗，导体损耗和插入损耗的电路板包括一对传输线。 这对传输线具有足够的厚度，以在一对传输线之间产生实质的宽边电磁耦合，其中一对传输线与电路板的接地平面充分分离，从而使接地平面的电磁耦合可以忽略不计 到实质的宽边电磁耦合。 这对传输线因此减少了穿过传输线对的信号的介质损耗，导体损耗和插入损耗。 这对传输线可以通过例如至少50.0密耳从地平面分离。

公开(公告)号：US08076585B2

公开(公告)日：2011-12-13

申请号：US12251397

申请日：2008-10-14

Applicant: Yu-Hsu Lin

Inventor： Yu-Hsu Lin

IPC: H05K1/00

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K1/0237 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09681

Abstract: A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the grid.

Abstract translation: 印刷电路板包括接地层和信号层。 地层具有网格线形成的网格。 信号层上放置一对信号迹线。 一对信号迹线对称于网格的一个网格线或一条中心线。

公开(公告)号：US08044746B2

公开(公告)日：2011-10-25

申请号：US12762168

申请日：2010-04-16

Applicant: James Leroy Blair ,  Oswin M. Schreiber ,  Jeffrey Thomas Smith

Inventor： James Leroy Blair ,  Oswin M. Schreiber ,  Jeffrey Thomas Smith

IPC: H01P3/08

CPC classification number: H05K1/0219 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01P3/006 ,  H01P3/08 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/147 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/10492 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract translation: 用于电子组件的高速柔性互连电缆包括多个导电层和多个电介质层。 位于导电层上的导电信号迹线与电介质层结合形成一个或多个高速电传输线结构。 电缆可以使用各种连接技术耦合到电子元件。 电缆也可以用任何数量的已知或标准的连接器封装端接。

公开(公告)号：US20110139492A1

公开(公告)日：2011-06-16

申请号：US13033828

申请日：2011-02-24

Applicant: Mitsuhiko Sugane

Inventor： Mitsuhiko Sugane

IPC: H05K1/00

CPC classification number: H05K1/0218 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/148 ,  H05K3/3447 ,  H05K3/363 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/096 ,  H05K2201/10303

Abstract: A multilayer flexible printed circuit board includes a core material made of an insulating material having bendability. A solid layer is provided on one surface of the core material. The solid layer is made of an electrically conductive material to form a ground plane. A wiring layer is provided on the other surface of the core material. The wiring layer is made of an electrically conductive material having a controlled impedance. The core material, the solid layer and the wiring layer together form one set of lamination. A plurality of sets of the lamination are laminated via an insulation layer.

Abstract translation: 多层柔性印刷电路板包括由具有弯曲性的绝缘材料制成的芯材。 在芯材的一个表面上设置固体层。 固体层由导电材料制成以形成接地平面。 在芯材的另一个表面上设置布线层。 布线层由具有受控阻抗的导电材料制成。 核心材料，固体层和布线层一起形成一组层压。 通过绝缘层层叠多组层叠体。