公开(公告)号：US20170257943A1

公开(公告)日：2017-09-07

申请号：US15510284

申请日：2015-09-03

Applicant: LEDIL OY

Inventor： Hannu HUKKANEN

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  G02B6/35

CPC classification number: H05K1/0274 ,  G02B6/3502 ,  H05K1/142 ,  H05K3/0008 ,  H05K3/0052 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/209 ,  H05K2203/167 ,  H05K2203/176

Abstract: A circuit board system includes a circuit board having a base part (101) and at least one changeable part (102) furnished with at least one electrical component (103) such as a light emitting diode. The base part includes an aperture for receiving the changeable part so that a perpendicular of the changeable part is parallel with a perpendicular of the base part. The aperture is shaped to allow the position of the changeable part to be changed with respect to the base part when the changeable part is in the aperture, and edges of the aperture and the changeable part have mutually cooperative connection portions (105, 106) which allow the changeable part to be introduced on the aperture when the changeable part is in a first position and which limit freedom of the changeable part to get away from the aperture when the changeable part is in a second position.

公开(公告)号：US20170148771A1

公开(公告)日：2017-05-25

申请号：US15226209

申请日：2016-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo CHA ,  Yong II KIM ,  Wan tae LIM

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  H05K1/00 ,  H05K1/181 ,  H05K1/183 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2201/209 ,  H05K2203/104 ,  H05K2203/168 ,  Y02P70/611

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

公开(公告)号：US20160220919A1

公开(公告)日：2016-08-04

申请号：US14917564

申请日：2014-09-03

Applicant: BRIXO SMART TOYS LTD.

Inventor： Boaz Almog ,  Amir Saraf

IPC: A63H33/04 ,  A63H33/08

CPC classification number: A63H33/042 ,  A63H33/086 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0999 ,  H05K2201/209

Abstract: The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

Abstract translation: 本发明涉及一种选择性导电的玩具构建元件，其包括：主体，其适于与至少一个其他玩具构建元件主体或相应的底板可释放地接合，所述主体包括至少一个导电部分，其具有适于 以在相邻的玩具构建元件主体的导电部分或接触区域上产生压力，以便确保所述玩具构建元件之间在期望的位置和方向上的电传导。

公开(公告)号：US09093767B2

公开(公告)日：2015-07-28

申请号：US13879883

申请日：2011-11-29

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H01R31/06 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H05K3/10 ,  H05K3/12 ,  H05K1/14

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。

公开(公告)号：US20140098544A1

公开(公告)日：2014-04-10

申请号：US13905977

申请日：2013-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Ho SHIN ,  Seok Chan HONG ,  Sung Oh AHN

IPC: F21K99/00

CPC classification number: F21V13/04 ,  F21K9/60 ,  F21V5/04 ,  F21V7/05 ,  G02F1/133611 ,  H01L33/60 ,  H05K3/0052 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/209

Abstract: A light emitting module includes a circuit board having a plurality of reflective portions arranged in one direction and connection portions connecting the plurality of reflective portions, light emitting devices mounted on the plurality of reflective portions, and lens units disposed to cover the light emitting devices within boundaries of surfaces, of the plurality of reflective portions, on which the light emitting devices are mounted. A width of each of the connection portions in the other direction, perpendicular to the one direction thereof, is smaller than a diameter of each of the lens units, thus reducing a generation of a dark portion.

Abstract translation: 发光模块包括电路板，其具有沿一个方向布置的多个反射部分和连接多个反射部分的连接部分，安装在多个反射部分上的发光器件以及设置成覆盖发光器件内部的透镜单元 在其上安装有发光装置的多个反射部分中的表面的边界。 每个连接部分在垂直于其一个方向的另一个方向上的宽度小于每个透镜单元的直径，从而减少了暗部分的产生。

公开(公告)号：US20120002427A1

公开(公告)日：2012-01-05

申请号：US13090702

申请日：2011-04-20

Applicant: Yontae MOON ,  Eunseon Lee

Inventor： Yontae MOON ,  Eunseon Lee

IPC: F21V21/00

CPC classification number: F21V19/0045 ,  F21K9/00 ,  F21K9/275 ,  F21V19/001 ,  F21V19/0015 ,  F21V19/003 ,  F21V21/35 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L33/486 ,  H01L2224/48091 ,  H05K1/182 ,  H05K3/30 ,  H05K2201/10106 ,  H05K2201/2027 ,  H05K2201/209 ,  H05K2203/167 ,  H01L2924/00014

Abstract: A light emitting device module is provided comprising a light emitting device package and a printed circuit board to which the light emitting device package is coupled, wherein the light emitting device package includes a sliding groove and a fixing groove, and wherein the printed circuit board includes a sliding protrusion coupled to the sliding groove to guide the light emitting device package to a predetermined position and a fixing protrusion coupled to the fixing groove at the predetermined position.

Abstract translation: 提供一种发光器件模块，包括发光器件封装和耦合发光器件封装的印刷电路板，其中发光器件封装包括滑动槽和固定槽，并且其中印刷电路板包括 滑动突起，其联接到所述滑动槽以将所述发光器件封装引导到预定位置;以及固定突起，其在所述预定位置处联接到所述固定槽。

公开(公告)号：US07830009B2

公开(公告)日：2010-11-09

申请号：US11898750

申请日：2007-09-14

Applicant: Yuji Awano ,  Masataka Mizukoshi

Inventor： Yuji Awano ,  Masataka Mizukoshi

IPC: H01L23/48

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13193 ,  H01L2224/13582 ,  H01L2224/13693 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/026 ,  H05K2201/09472 ,  H05K2201/209 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

Abstract translation: 公开了一种包括半导体器件的半导体封装; 电路板; 以及连接机构，其包括设置在所述半导体器件上的第一导电端子和设置在所述电路板侧的第二导电端子，所述连接机构经由所述第一导电端子和所述第二导电端子电连接所述半导体器件和所述电路板。 连接机构的第一导电端子和第二导电端子中的至少一个包括一个或多个碳纳米管，每个碳纳米管的一端固定到第一导电端子和第二导电端子中的至少一个的表面，并且延伸 在远离表面的方向上。 第一导电端子和第二导电端子通过碳纳米管彼此接合。

公开(公告)号：US20100183169A1

公开(公告)日：2010-07-22

申请号：US12376602

申请日：2007-09-19

Applicant: Mitsuru Kobayashi

Inventor： Mitsuru Kobayashi

IPC: H03G3/00

CPC classification number: H05K1/142 ,  H01R13/514 ,  H04B1/08 ,  H04R25/60 ,  H04R25/604 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/119 ,  H05K1/183 ,  H05K3/326 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/1059 ,  H05K2201/209

Abstract: The invention intends to provide an appliance which can be easily assembled, assure quality and reliability, and can be downsized. A voice output unit includes: a power source 5 supplying power; a signal processing module 3 which processes voice signals received from an external source as predetermined, and amplifies the processed voice signals processed; a speaker module 34 transmitting the amplified voice signals as voice signals; and a stereoscopic circuit board 10 on which the power source 5, signal processing module 3, and speaker module 4 are assembled, and includes electrodes which are in electric contact with electrodes of the foregoing components.

Abstract translation: 本发明旨在提供一种易于组装的设备，确保质量和可靠性，并且可以减小尺寸。 语音输出单元包括：供电的电源5; 信号处理模块3，其将预定的从外部源接收到的语音信号进行处理，并放大处理过的语音信号; 将放大的语音信号作为语音信号发送的扬声器模块34; 以及组装电源5，信号处理模块3和扬声器模块4的立体电路板10，并且包括与上述部件的电极电接触的电极。

公开(公告)号：US07753691B2

公开(公告)日：2010-07-13

申请号：US12406416

申请日：2009-03-18

Applicant: Thomas Michael Ales ,  Davis-Dang Hoang Nhan

Inventor： Thomas Michael Ales ,  Davis-Dang Hoang Nhan

IPC: H01R12/00

CPC classification number: H01R43/0256 ,  H01R13/03 ,  H05K3/308 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/209 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present disclosure is directed to conductive connector attachments for use in electrically connecting printed circuit boards to absorbent products such as diapers, training pants, incontinence products, feminine hygiene products, and the like. Specifically, various configurations and methods of securely attaching conventional conductive hook and loop attachments to printed circuit boards are disclosed.

Abstract translation: 本公开涉及用于将印刷电路板电连接到诸如尿布，训练裤，失禁产品，女性卫生产品等吸收产品的导电连接器附件。 具体地，公开了将常规导电钩和环附接件牢固地连接到印刷电路板的各种配置和方法。

公开(公告)号：US20100115766A1

公开(公告)日：2010-05-13

申请号：US12500041

申请日：2009-07-09

Applicant: Yasushi HASEGAWA

Inventor： Yasushi HASEGAWA

IPC: H05K3/36

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0169 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/166 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49789 ,  Y10T29/49895

Abstract: A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board.

Abstract translation: 一种具有框架部分和多片部分的多片板的制造方法，每个具有印刷线路板包括制造具有第一联接部分的框架部分，并且所述多片部件包括件部件，每个部件具有联接的第二联接部分 在至少框架部分和零件彼此分离的生产面板处的第一联接部分处，将框架部分和多件部件与生产面板分离，并将第一联接部分连接到第二联接器 联接框架部分和零件，并且组合框架部分和多件部件以产生多片板。