公开(公告)号：US20090039262A1

公开(公告)日：2009-02-12

申请号：US12188567

申请日：2008-08-08

Applicant: Mamoru NAKASUJI ,  Nobuharu NOJI ,  Tohru SATAKE ,  Masahiro HATAKEYAMA ,  Kenji WATANABE ,  Takao KATO ,  Hirosi SOBUKAWA ,  Tsutomu KARIMATA ,  Shoji YOSHIKAWA ,  Toshifumi KIMBA ,  Shin OOWADA ,  Mutsumi SAITO ,  Muneki HAMASHIMA

Inventor： Mamoru NAKASUJI ,  Nobuharu NOJI ,  Tohru SATAKE ,  Masahiro HATAKEYAMA ,  Kenji WATANABE ,  Takao KATO ,  Hirosi SOBUKAWA ,  Tsutomu KARIMATA ,  Shoji YOSHIKAWA ,  Toshifumi KIMBA ,  Shin OOWADA ,  Mutsumi SAITO ,  Muneki HAMASHIMA

IPC: G01N23/225

CPC classification number: B82Y10/00 ,  B82Y40/00 ,  G01N23/225 ,  H01J37/06 ,  H01J37/063 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/0435 ,  H01J2237/0635 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

Abstract: The present invention provides an electron beam apparatus for irradiating a sample with primary electron beams to detect secondary electron beams generated from a surface of the sample by the irradiation for evaluating the sample surface. In the electron beam apparatus, an electron gun has a cathode for emitting primary electron beams. The cathode includes a plurality of emitters for emitting primary electron beams, arranged apart from one another on a circle centered at an optical axis of a primary electro-optical system. The plurality of emitters are arranged such that when the plurality of emitters are projected onto a straight line parallel with a direction in which the primary electron beams are scanned, resulting points on the straight line are spaced at equal intervals.

Abstract translation: 本发明提供了一种用于用一次电子束照射样品的电子束装置，以通过用于评估样品表面的照射来检测从样品表面产生的二次电子束。 在电子束装置中，电子枪具有用于发射一次电子束的阴极。 阴极包括用于发射一次电子束的多个发射器，其以在主电光系统的光轴为中心的圆周彼此分开布置。 多个发射器被布置成使得当多个发射器投射到与一次电子束扫描的方向平行的直线上时，直线上的所得点以相等的间隔隔开。

公开(公告)号：US20080265159A1

公开(公告)日：2008-10-30

申请号：US12153397

申请日：2008-05-19

Applicant: Masahiro Hatakeyama ,  Kenji Watanabe ,  Takeshi Murakami ,  Tohru Satake ,  Nobuharu Noji

Inventor： Masahiro Hatakeyama ,  Kenji Watanabe ,  Takeshi Murakami ,  Tohru Satake ,  Nobuharu Noji

IPC: G01N23/00 ,  H01L21/66

CPC classification number: G03F7/162 ,  G01N23/225 ,  H01J37/285 ,  H01J2237/204 ,  H01J2237/2812 ,  H01J2237/2814 ,  H01J2237/2855 ,  H01J2237/2857

Abstract: The present invention provides a surface inspection method and apparatus for inspecting a surface of a sample, in which a resistive film is coated on the surface, and a beam is irradiated to the surface having the resistive film coated thereon, to thereby conduct inspection of the surface of the sample. In the surface inspection method of the present invention, a resistive film having an arbitrarily determined thickness t1 is first coated on a surface of a sample. Thereafter, a part of the resistive film having the arbitrarily determined thickness t1 is dissolved in a solvent, to thereby reduce the thickness of the resistive film to a desired level. This enables precise control of a value of resistance of the resistive film and suppresses distortion of an image to be detected.

Abstract translation: 本发明提供了一种表面检查方法和装置，用于检查表面上涂覆有电阻膜的样品的表面，并且将光束照射到其上涂覆有电阻膜的表面，从而进行 样品表面。 在本发明的表面检查方法中，首先将具有任意确定的厚度t 1的电阻膜涂覆在样品的表面上。 此后，将具有任意确定的厚度t 1的电阻膜的一部分溶解在溶剂中，从而将电阻膜的厚度减小到期望的水平。 这能够精确地控制电阻膜的电阻值并抑制要检测的图像的失真。

公开(公告)号：US20080093565A1

公开(公告)日：2008-04-24

申请号：US11976240

申请日：2007-10-23

Applicant: Toshie Yaguchi ,  Takeo Kamino ,  Takahito Hashimoto

Inventor： Toshie Yaguchi ,  Takeo Kamino ,  Takahito Hashimoto

IPC: H01J37/26 ,  H01J37/20 ,  H01J37/32

CPC classification number: H01J37/20 ,  H01J37/16 ,  H01J37/26 ,  H01J37/3056 ,  H01J2237/006 ,  H01J2237/2001 ,  H01J2237/2002 ,  H01J2237/204 ,  H01J2237/2065 ,  H01J2237/2067 ,  H01J2237/31749

Abstract: In a charged particle beam device and a specimen holder for the charged particle beam device each of which comprises a mechanism for blowing with a gas at least partially a specimen to be observed, the mechanism includes small flow rate gas spout openings arranged opposed to each other through the specimen with a small distance between the specimen and each of the small flow rate gas spout openings.

Abstract translation: 在带电粒子束装置和用于带电粒子束装置的样本保持器中，每个包括用于至少部分地用待观察的样本吹送气体的机构，该机构包括彼此相对布置的小流量气体喷口 通过样品与样品与每个小流量气体出口之间的距离小。

公开(公告)号：US07297965B2

公开(公告)日：2007-11-20

申请号：US11119207

申请日：2005-04-28

Applicant: Eitan Kidron ,  Dror Shemesh

Inventor： Eitan Kidron ,  Dror Shemesh

IPC: G21K5/10

CPC classification number: G01N1/32 ,  H01J37/185 ,  H01J37/20 ,  H01J37/28 ,  H01J37/3056 ,  H01J2237/20278 ,  H01J2237/20292 ,  H01J2237/204 ,  H01J2237/208 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: Methods and apparatus are disclosed for forming a sample of an object, extracting the sample from the object, and subjecting this sample to microanalysis including surface analysis and electron transparency analysis in a vacuum chamber. In some embodiments, a method is provided for imaging an object cross section surface of an extracted sample. Optionally, the sample is iteratively thinned and imaged within the vacuum chamber. In some embodiments, the sample is situated on a sample support including an optional aperture. Optionally, the sample is situated on a surface of the sample support such that the object cross section surface is substantially parallel to the surface of the sample support. Once mounted on the sample support, the sample is either subjected to microanalysis in the vacuum chamber, or loaded onto a loading station. In some embodiments, the sample is imaged with an electron beam substantially normally incident to the object cross section surface.

Abstract translation: 公开了用于形成物体样品的方法和装置，从物体中提取样品，并对该样品进行微量分析，包括真空室中的表面分析和电子透过性分析。 在一些实施例中，提供了用于对提取的样品的物体横截面进行成像的方法。 任选地，将样品迭代地稀释并在真空室内成像。 在一些实施例中，样品位于包括任选孔的样品支架上。 可选地，样品位于样品载体的表面上，使得物体横截面基本上平行于样品载体的表面。 一旦安装在样品支架上，样品就可以在真空室中进行微量分析，或者加载到装载站上。 在一些实施例中，用基本上正常地入射到物体横截面表面的电子束成像样品。

公开(公告)号：US07297949B2

公开(公告)日：2007-11-20

申请号：US11528595

申请日：2006-09-28

Applicant: Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

Inventor： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

IPC: H01J37/26 ,  H01J37/28

CPC classification number: G03F7/70616 ,  G01N23/225 ,  H01J37/05 ,  H01J37/06 ,  H01J37/073 ,  H01J37/075 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/226 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0435 ,  H01J2237/057 ,  H01J2237/06316 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/248 ,  H01J2237/2482 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

Abstract: An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.

Abstract translation: 检查装置及使用该检查装置的半导体装置的制造方法。 检查装置用于诸如晶片的样品的缺陷检查，线宽测量，表面电位测量等。 在检查装置中，多个带电粒子从初级光学系统传送到样品，从样品发射的二次带电粒子与主光学系统分离，并通过二次光学系统引入到检测器。 在移动样品的同时进行带电粒子的照射。 带电粒子的照射点沿着样品的移动方向排列成N行，沿着与其垂直的方向排列成M列。 带电粒子的每一列照射点在垂直于样品的移动方向的方向上连续移动预定量。

公开(公告)号：US20070210261A1

公开(公告)日：2007-09-13

申请号：US11699066

申请日：2007-01-29

Applicant: Susumu Kato

Inventor： Susumu Kato

IPC: G21K7/00 ,  G01N21/00 ,  G01N23/00

CPC classification number: G01N23/04 ,  H01J37/09 ,  H01J37/185 ,  H01J37/20 ,  H01J2237/026 ,  H01J2237/204 ,  H01L21/68742 ,  H01L21/6875

Abstract: A specimen holding device has a plurality of electrodes, and a moving mechanism for moving upward and downward a part of the plurality of electrodes. Further, the moving mechanism moves the part of the plurality of electrodes downward to evacuate from a path through which a specimen is introduced. Further, the specimen holding device has a positioning member for the specimen so that the specimen is positioned after being mounted.

Abstract translation: 试样保持装置具有多个电极和用于使多个电极的一部分上下移动的移动机构。 此外，移动机构将多个电极的一部分向下移动，以从被引入样本的路径排出。 此外，试样保持装置具有用于试样的定位构件，使得试样在安装之后定位。

公开(公告)号：US20070194235A1

公开(公告)日：2007-08-23

申请号：US11783780

申请日：2007-04-12

Applicant: Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

Inventor： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

IPC: G01N23/00

CPC classification number: H01J37/222 ,  G01N23/225 ,  G01N23/2251 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0216 ,  H01J2237/082 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2813 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.

Abstract translation: 本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过至少一个自由度的阶段26-1连续地移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。 因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

公开(公告)号：US20070120068A1

公开(公告)日：2007-05-31

申请号：US11305109

申请日：2005-12-19

Applicant: Hiroaki Mito ,  Katsuhiro Sasada ,  Kazuo Kato ,  Tomohiro Kudo ,  Tomonori Saeki

Inventor： Hiroaki Mito ,  Katsuhiro Sasada ,  Kazuo Kato ,  Tomohiro Kudo ,  Tomonori Saeki

IPC: H01J37/18

CPC classification number: H01J37/185 ,  H01J37/20 ,  H01J2237/18 ,  H01J2237/2001 ,  H01J2237/204 ,  H01J2237/2817 ,  H01L21/67028 ,  H01L21/67213 ,  H01L21/67248

Abstract: A sample measuring method and a charged particle beam apparatus are provided which remove contaminants, that have adhered to a sample in a sample chamber of an electron microscope, to eliminate adverse effects on the subsequent manufacturing processes. To achieve this objective, after the sample measurement or inspection is made by using a charged particle beam, contaminants on the sample are removed before the next semiconductor manufacturing process. This allows the contaminants adhering to the sample in the sample chamber to be removed and therefore failures or defects that may occur in a semiconductor fabrication process following the measurement and inspection can be minimized.

Abstract translation: 提供了样品测量方法和带电粒子束装置，其去除了附着在电子显微镜的样品室中的样品的污染物，以消除对后续制造工艺的不利影响。 为了达到这个目标，在通过使用带电粒子束进行样品测量或检查之后，在下一个半导体制造过程之前去除样品上的污染物。 这允许去除样品室中附着在样品上的污染物，因此可以使在测量和检查之后的半导体制造过程中可能发生的故障或缺陷被最小化。

公开(公告)号：US20070057186A1

公开(公告)日：2007-03-15

申请号：US11528595

申请日：2006-09-28

Applicant: Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

Inventor： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

IPC: G21K7/00

CPC classification number: G03F7/70616 ,  G01N23/225 ,  H01J37/05 ,  H01J37/06 ,  H01J37/073 ,  H01J37/075 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/226 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0435 ,  H01J2237/057 ,  H01J2237/06316 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/248 ,  H01J2237/2482 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

Abstract: An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.

公开(公告)号：US07135676B2

公开(公告)日：2006-11-14

申请号：US09891611

申请日：2001-06-27

Applicant: Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

Inventor： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

IPC: H01J37/28

CPC classification number: G03F7/70616 ,  G01N23/225 ,  H01J37/05 ,  H01J37/06 ,  H01J37/073 ,  H01J37/075 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/226 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0435 ,  H01J2237/057 ,  H01J2237/06316 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/248 ,  H01J2237/2482 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

Abstract: An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.