公开(公告)号：US11690174B2

公开(公告)日：2023-06-27

申请号：US17273593

申请日：2020-06-05

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ren Xiong ,  Fan Li ,  Qiang Tang ,  Fei Shang ,  Haijun Qiu ,  Yuanyuan Chai ,  Huiqiang Song

IPC: H05K1/11 ,  G06F3/044 ,  G06F3/041 ,  H01R12/61 ,  H05K3/36 ,  H05K1/18 ,  H10K59/131 ,  H10K59/179

CPC classification number: H05K1/118 ,  G06F3/0412 ,  G06F3/0443 ,  G06F3/0446 ,  H01R12/61 ,  H05K3/363 ,  G06F3/04164 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/0939 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/09481 ,  H05K2201/10128 ,  H10K59/131 ,  H10K59/179

Abstract: A display device and a manufacturing method thereof are provided. The display device includes a display panel and a flexible circuit board electrically connected with the display panel. The flexible circuit board includes a first circuit board, a second circuit board and a conductive portion; the first circuit board includes a first substrate, and a main contact pad, a first wire and a second wire provided on the first substrate; the second circuit board includes a second substrate, a relay contact pad and a third wire provided on the second substrate; and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

公开(公告)号：US20230171882A1

公开(公告)日：2023-06-01

申请号：US17921778

申请日：2021-04-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Hae Sik KIM ,  Jee Heum PAIK

IPC: H05K1/02 ,  H05K1/11 ,  H04N23/68

CPC classification number: H05K1/0296 ,  H04N23/687 ,  H05K1/116 ,  H05K2201/0939 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10287

Abstract: A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion disposed on the insulating layer, wherein the lead pattern portion includes: a first portion disposed on the insulating layer; and a second portion extending from one end of the first portion; wherein the first portion is disposed overlapping the insulating layer in a vertical direction, wherein the second portion is disposed in an outer region of the insulating layer and does not overlap the insulating layer; and wherein the lead pattern portion has a centerline average roughness in a range of 0.05 µm to 0.5 µm or a 10-point average roughness in a range of 1.0 µm to 5.0 µm.

公开(公告)号：US09831144B2

公开(公告)日：2017-11-28

申请号：US14428376

申请日：2013-08-28

Applicant: QUBEICON LTD.

Inventor： Shimon Podval

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/498 ,  H01L25/065 ,  H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L23/00 ,  H05K3/34

CPC classification number: H01L23/13 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/49113 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81385 ,  H01L2924/00014 ,  H01L2924/15162 ,  H01L2924/15192 ,  H05K1/0204 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/0939 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

公开(公告)号：US20170336584A1

公开(公告)日：2017-11-23

申请号：US15673484

申请日：2017-08-10

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko ARIGA ,  Etsuji KATAYAMA ,  Toshio SUGAYA

IPC: G02B6/42 ,  H05K1/11 ,  H05K1/02 ,  G02B6/27 ,  H01S5/0683 ,  H01S5/06

CPC classification number: G02B6/4281 ,  G02B6/2706 ,  G02B6/4246 ,  H01S5/0612 ,  H01S5/06837 ,  H05K1/028 ,  H05K1/115 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/10121

Abstract: A flexible substrate includes: an insulating base member; a plurality of lands formed aligned in a plurality of lines in a first direction on the base member; and a plurality of wirings formed on the base member, extending in a second direction intersecting the first direction, and connected to the plurality of lands on each line of the plurality of lines, wherein the plurality of wirings include a wiring extending between the lands aligned in the first direction, and wherein each of the plurality of lands has a planar shape longer in the second direction.

公开(公告)号：US09773761B2

公开(公告)日：2017-09-26

申请号：US14903858

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L33/62 ,  H01L25/075 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

公开(公告)号：US09577304B2

公开(公告)日：2017-02-21

申请号：US14637898

申请日：2015-03-04

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Chih-Heng Chuo ,  Gwun-Jin Lin ,  Kuo-Fu Su

IPC: H03H7/38 ,  H01P1/22 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01P1/227 ,  H03H7/38 ,  H05K1/0225 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09718 ,  H05K2201/10931

Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。

公开(公告)号：US20160329658A1

公开(公告)日：2016-11-10

申请号：US15146652

申请日：2016-05-04

Applicant: JoyLabz LLC

Inventor： Bryan Randall Wilcox ,  Todd Eddie ,  Jay Saul Silver

IPC: H01R13/62 ,  H01R12/75 ,  G06F1/16

CPC classification number: H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

Abstract translation: 用于磁耦合的系统和方法。 一个系统包括外部计算设备和具有导电端的连接器。 该系统还包括印刷电路板。 印刷电路板包括与背面相对的连接器侧。 连接器侧具有带孔的接触垫。 印刷电路板还包括位于印刷电路板背侧的磁体。 磁体提供磁场，其被配置为向接触接触垫的连接器提供磁力吸引力。 印刷电路板还包括通信终端。 该系统还包括通过连接器和接触垫与印刷电路板通信的电路。

公开(公告)号：US20160172339A1

公开(公告)日：2016-06-16

申请号：US14903834

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

Abstract translation: 提供了使用纳米级LED电极组件的LED灯。 使用纳米级LED电极组件的LED灯可以解决限制，其中当根据现有技术的纳米级LED器件立起并且三维耦合到电极时，难以允许纳米级 LED装置站起来，并且当纳米尺度的LED装置与一对一耦合对应于彼此不同的电极时，产品质量劣化。 因此，具有纳米单元的纳米级LED器件可以连接到彼此不同的两个电极而不引起缺陷，并且由于连接到电极的纳米级LED器件的方向性，可以提高光提取效率。 此外，由于LED灯中设置的纳米级LED的一部分的缺陷导致的LED灯的功能劣化可以最小化，并且LED灯可以通过使用纳米级LED电极而具有柔性的结构和形状 其组件根据LED灯的使用目的或位置可变形。

公开(公告)号：US20150237734A1

公开(公告)日：2015-08-20

申请号：US14429741

申请日：2012-09-26

Applicant: MEIKO ELECTRONICS CO., LTD.

Inventor： Ryoichi Shimizu ,  Mitsuo Iwamoto ,  Mitsuaki Toda

IPC: H05K1/18 ,  H05K1/09 ,  H05K1/02 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

Abstract: In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.

Abstract translation: 在其中电子部件相对于形成在铜层中的标记定位的部件结合基板的制造方法中的标记形成步骤中，当从传感器的搜索范围的搜索中心延伸到假想线时， 搜索范围的边缘侧被表示为搜索参考线，并且在标记中心与搜索中心匹配的状态下从与标记中心沿与搜索基准线相同的方向延伸的假想线延伸到 标记的外脊线被表示为标记参考线，标记形成为标记的外脊线存在于标记基准线的长度在30％以上的范围内的位置的形状 的搜索参考线。

公开(公告)号：US09011799B2

公开(公告)日：2015-04-21

申请号：US13572001

申请日：2012-08-10

Applicant: Burkhardt Reichmuth

Inventor： Burkhardt Reichmuth

IPC: G01F19/00 ,  G01L3/02 ,  H05K1/02 ,  G01F11/02 ,  B01L3/02 ,  G01N35/10 ,  H05K1/03

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument with a cable holding space in which a printed circuit board cable device is arranged. The printed circuit board cable device has at least one printed circuit board with first and second sides and, arranged in succession, at least one first circuit board section, at least one second circuit board section and at least one third circuit board section, and with a number of conductor tracks arranged in parallel with respect to one another and extending from a first track section arranged in the first circuit board section, via the second circuit board section to the third circuit board section, in which a second track section is arranged, wherein, in the second circuit board section, at least one conductor track is arranged on the first side of the board and at least one track is arranged on the second side.

Abstract translation: 本发明涉及具有电缆保持空间的实验室样品仪器，其中布置有印刷电路板电缆装置。 印刷电路板电缆装置具有至少一个具有第一和第二侧面的印刷电路板，并且连续地布置有至少一个第一电路板部分，至少一个第二电路板部分和至少一个第三电路板部分，并且具有 多个导体轨道相对于彼此平行布置并且从布置在第一电路板部分中的第一轨道部分经由第二电路板部分延伸到布置有第二轨道部分的第三电路板部分， 其中，在所述第二电路板部分中，至少一个导体轨道布置在所述板的第一侧上，并且至少一个轨道布置在所述第二侧上。