公开(公告)号：US20160309577A1

公开(公告)日：2016-10-20

申请号：US14704115

申请日：2015-05-05

Applicant: Laird Technologies, Inc.

Inventor： John Song ,  George William Rhyne

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

Abstract translation: 在示例性实施例中，电路组件可以设置在诸如板级屏蔽，中板，支架，精密金属部件等的导电结构上和/或由其支撑。例如，可以提供电路组件 在板级屏蔽的外顶表面上和/或支撑。 在示例性实施例中，组件通常包括被配置用于电子设备中的第一功能的导电结构。 导电层至少部分在导电结构上。 第一电气部件至少部分地在非导电层上并且被配置为限定用于与电子设备的一个或多个第二电气部件电连接的电路组件的至少一部分。 因此，导电结构可以被配置用于电子设备中的第二功能。

公开(公告)号：US09442539B2

公开(公告)日：2016-09-13

申请号：US14245343

申请日：2014-04-04

Applicant: PNY Technologies, Inc.

Inventor： Robert Stone ,  Joseph Pluchino

IPC: G06F1/18 ,  H05K3/36

CPC classification number: G06F1/185 ,  G06K19/07732 ,  H05K3/368 ,  H05K2201/09754 ,  H05K2201/0999

Abstract: A reduced length memory card is provided. The memory card, comprising a memory circuit, a housing for said memory circuit, said housing defining a first end, a second end opposite the first end and insertable into a port of a digital device, and opposing sidewalls between the first end and the second end, and a plurality of electrical contacts in electrical communication with said memory circuit, said contacts exposed through apertures formed in a bottom surface of the housing extending between the first end and the second end, wherein the memory card is electrically compatible with a Secure Digital (SD) standard, and wherein a length of the card extending between the first end and the second end is less than a width of the card extending between the opposing sidewalls. The memory could comprise an extraction ridge along the first end of the card and exposed when the card is inserted into the port of the digital device.

Abstract translation: 提供了缩小的存储卡。 所述存储卡包括存储器电路，用于所述存储器电路的外壳，所述壳体限定第一端，与所述第一端相对的第二端并可插入数字设备的端口中，以及所述第一端和所述第二端之间的相对的侧壁 端部以及与所述存储器电路电连通的多个电触头，所述触点通过形成在壳体的底表面中的孔在第一端和第二端之间暴露，其中存储卡与安全数字 （SD）标准，并且其中在第一端和第二端之间延伸的卡的长度小于在相对侧壁之间延伸的卡的宽度。 存储器可以包括沿着卡的第一端的提取脊，并且当卡被插入数字设备的端口时被暴露。

公开(公告)号：US20160192505A1

公开(公告)日：2016-06-30

申请号：US15060968

申请日：2016-03-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Sheng-Wei YEH ,  Chiu-Kung CHEN ,  Cheng-Chieh LIU ,  Shao-Chang TU

IPC: H05K3/18 ,  H05K3/34 ,  F04D29/28 ,  F04D29/62 ,  F04D19/00 ,  F04D25/06

CPC classification number: H05K3/182 ,  F04D17/16 ,  F04D19/002 ,  F04D25/0693 ,  F04D29/281 ,  F04D29/325 ,  F04D29/541 ,  F04D29/626 ,  H05K3/105 ,  H05K3/341 ,  H05K2201/0215 ,  H05K2201/0999 ,  Y10T29/49147

Abstract: A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic material to form a housing; removing a part surface of the housing and forming a layout area and an extended circuit on the housing, wherein one terminal of the extended circuit connects to the layout area; disposing a first signal connecting structure on the housing, wherein the first signal connecting structure connects to the other terminal of the extended circuit; and disposing a metal layer on the layout area and the extended circuit.

公开(公告)号：US09325060B2

公开(公告)日：2016-04-26

申请号：US14620108

申请日：2015-02-11

Applicant: Pulse Finland OY

Inventor： Esa Kalistaja ,  Elli Galla ,  Dan Kuehler ,  Winthrop Childers

IPC: H01Q9/04 ,  H05K3/32 ,  H01Q1/38 ,  H05K3/12

CPC classification number: H01Q1/38 ,  H05K3/125 ,  H05K2201/0245 ,  H05K2201/0999 ,  H05K2201/10098

Abstract: A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a “thick” antenna element can be formed in one pass of a dispensing head or nozzle, thereby reducing manufacturing cost and increasing manufacturing efficiency.

Abstract translation: 用于电子设备的诸如天线的导电元件，包括诸如蜂窝电话，智能电话，个人数字助理（PDA），笔记本电脑和无线平板电脑的移动设备。 在一个示例性方面，本公开涉及使用导电流体的沉积形成的导电天线以及用于形成导电流体的方法和设备。 在一个实施例中，可以在分配头或喷嘴的一次通道中形成“厚”天线元件，从而降低制造成本并提高制造效率。

公开(公告)号：US09291168B2

公开(公告)日：2016-03-22

申请号：US13447841

申请日：2012-04-16

Applicant: Chia-Yuan Chang ,  Han-Pei Wang ,  Cheng-Chieh Liu ,  Wen-Ping Teng

Inventor： Chia-Yuan Chang ,  Han-Pei Wang ,  Cheng-Chieh Liu ,  Wen-Ping Teng

IPC: F04B35/04 ,  B21D53/78 ,  H05K3/00 ,  F04D25/06 ,  H05K3/18 ,  F04D29/64 ,  H05K3/10 ,  H05K3/34

CPC classification number: F04D29/624 ,  F04D25/0606 ,  F04D25/0633 ,  F04D25/0693 ,  F04D29/424 ,  F04D29/646 ,  H05K3/105 ,  H05K3/182 ,  H05K3/341 ,  H05K2201/0215 ,  H05K2201/0999 ,  Y02P70/613 ,  Y10T29/49316

Abstract: A manufacturing method of a thin fan comprises the steps of: providing a plastic material containing a plurality of metal particles; molding the plastic material into a housing; removing a part of a surface of the housing to form a circuit layout area at the housing; and forming a metal layer in the circuit layout area.

Abstract translation: 薄风扇的制造方法包括以下步骤：提供含有多个金属颗粒的塑料材料; 将塑料材料成型为壳体; 移除所述壳体的表面的一部分以在所述壳体处形成电路布局区域; 以及在电路布局区域中形成金属层。

公开(公告)号：US09271400B2

公开(公告)日：2016-02-23

申请号：US14016415

申请日：2013-09-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Seiji Kai ,  Shintaro Nakatani ,  Mitsuyoshi Hira ,  Takao Mukai ,  Hisashi Yamazaki

IPC: H05K7/00 ,  H05K1/18 ,  H03H3/08 ,  H03H9/10 ,  H05K3/34

CPC classification number: H05K1/182 ,  H03H3/08 ,  H03H9/1071 ,  H05K3/3431 ,  H05K2201/0999 ,  H05K2201/10083 ,  H05K2201/2018 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.

Abstract translation: 电子部件包括：框状支撑体，其包括热固性树脂，并且在基板的一个主表面上包围功能单元，并且在内侧与基板的周边分离，并且盖部件 被固定到支撑体上，使得框状支撑体的开口被密封。 框状支撑体包括框架状支撑体主体，从支撑体主体向内侧突出的第一突起和从支撑体主体向外侧突出的第二突起， 支撑体主体和第一突起彼此连续。

公开(公告)号：US09254531B2

公开(公告)日：2016-02-09

申请号：US12356931

申请日：2009-01-21

Applicant: Duk-Yong Kim ,  Yoon-Yong Kim ,  Hee-Sung Go

Inventor： Duk-Yong Kim ,  Yoon-Yong Kim ,  Hee-Sung Go

IPC: B23K1/00 ,  H05K3/00 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/0999 ,  Y02P70/613

Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.

Abstract translation: 提供了一种用于安装印刷电路板（PCB）的方法。 该方法包括在PCB的底表面的预定区域上提供焊膏，除了需要绝缘的区域，将PCB安装在其上将要安装PCB的壳体的安装区域上，并将PCB固定到 通过熔化和硬化设置在PCB的底表面上的焊膏来形成壳体。

公开(公告)号：US20150249284A1

公开(公告)日：2015-09-03

申请号：US14433759

申请日：2014-01-16

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Akihiro Iriyama

IPC: H01Q1/24 ,  H05K1/02

CPC classification number: H01Q1/243 ,  H05K1/0296 ,  H05K1/165 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10265 ,  H05K2201/2072

Abstract: A first resin layer is provided with a step part formed in conformity with a shape of at least part of an electrically conductive pattern, and the first resin layer and a second resin layer closely adhere to each other in the step part.

Abstract translation: 第一树脂层设置有与导电图案的至少一部分的形状一致形成的台阶部，第一树脂层和第二树脂层在台阶部中彼此紧密粘合。

公开(公告)号：US20150249059A1

公开(公告)日：2015-09-03

申请号：US14430173

申请日：2013-09-23

Applicant: STORA ENSO OYJ

Inventor： Juha Maijala

IPC: H01L23/66 ,  H01L23/58 ,  H01L23/00 ,  H01L23/64

CPC classification number: H01L23/66 ,  A61J1/035 ,  A61J2200/30 ,  A61J2205/60 ,  B65D25/00 ,  B65D2203/10 ,  H01L23/4985 ,  H01L23/564 ,  H01L23/585 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0239 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0292 ,  H05K1/111 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

Abstract translation: 包装体包括主体和由所述主体支撑的导电图案。 接口部分被配置为将模块接收到具有包装的可移除附件。 所述导电图案至少部分地在所述接口部分内包括构成无线耦合装置的一半的无线耦合图案。

公开(公告)号：US20150243609A1

公开(公告)日：2015-08-27

申请号：US14190745

申请日：2014-02-26

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H01L23/64 ,  H01L23/367 ,  H01L23/498 ,  H01L23/36 ,  H01L23/552 ,  H01L23/50

CPC classification number: H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/1624 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H02J7/0042 ,  H02J7/0052 ,  H02J7/345 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/041 ,  H05K2201/0999 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/014 ,  H01L2924/00

Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

Abstract translation: 封装组件包括管芯堆叠和相关使用方法。 包装组件包括具有第一表面，第二表面和与从第一表面延伸到第二表面的通孔邻接的第三表面的基底。 组件还包括管芯叠层，导电层和盖。 芯片堆叠包括位于衬底中的通孔内的芯片。 导电层的一部分设置在基板的第三表面上。 盖的一部分设置在第一芯片和导电层的部分之间。 导电层被配置为与电力耦合，并且盖被配置为与地耦合。 盖的部分可以用作电容器的第一板，并且导电层的部分可以用作电容器的第二板。