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    OPEN CAVITY PACKAGE USING CHIP-EMBEDDING TECHNOLOGY
    101.
    发明申请
    OPEN CAVITY PACKAGE USING CHIP-EMBEDDING TECHNOLOGY 有权
    使用芯片嵌入技术的开放封装

    公开(公告)号：US20170015548A1

    公开(公告)日：2017-01-19

    申请号：US14963362

    申请日：2015-12-09

    Applicant: Texas Instruments Incorporated

    Inventor： Jie Mao ,  Hau Nguyen ,  Luu Nguyen ,  Anindya Poddar

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81C1/00873 ,  B81B7/007 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/07 ,  B81B2207/098 ,  B81C1/00333 ,  B81C2201/0125 ,  B81C2201/0132 ,  B81C2201/0159 ,  B81C2201/0181 ,  B81C2201/0188 ,  B81C2203/0136 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/19 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/96 ,  H01L2924/3511

    Abstract: A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.

    Abstract translation: 一种以面板格式制造具有开口腔（110a）的封装半导体器件（100）的方法; 将具有平垫（230）和对称放置的垂直柱（231）的金属片的面板尺寸网格放置（处理201）在粘合剂载带上。 将具有传感器系统的半导体芯片（工艺202）面朝下地附接到带上; 层压（工艺203）和减薄（工艺204）低CTE绝缘材料（234）以填充芯片和网格之间的间隙; 翻转（过程205）组装以去除胶带; 等离子体清洁组件正面，溅射和图案化（工艺206）跨组合均匀的金属层和任选的电镀（工艺209）金属层以形成重新布线迹线和扩展的接触垫用于组装; 层压（工艺212）跨板的绝缘加强件; 在加强件中打开（过程213）空腔以接近传感器系统; 并通过切割金属片来分割（处理214）包装的装置。

    MICRO-SENSOR BODY AND METHOD FOR MANUFACTURING THE SAME, AS WELL AS MICRO-SENSOR
    105.
    发明申请
    MICRO-SENSOR BODY AND METHOD FOR MANUFACTURING THE SAME, AS WELL AS MICRO-SENSOR 有权
    微传感器体及其制造方法，作为微传感器

    公开(公告)号：US20160052775A1

    公开(公告)日：2016-02-25

    申请号：US14778721

    申请日：2014-04-30

    Applicant: XIAMEN HOPERGY PHOTOVOLTAIC TECHNOLOGY CO., LTD

    Inventor： Chunyan Ji ,  Tian Yang

    IPC: B81B3/00 ,  C23C14/14 ,  G01F1/56 ,  B81C1/00 ,  G01J1/42 ,  C23C14/34 ,  C23C14/06

    CPC classification number: B81B3/0021 ,  B81B2203/0109 ,  B81B2203/0127 ,  B81C1/00142 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2201/0176 ,  B81C2201/0181 ,  C23C14/0605 ,  C23C14/0617 ,  C23C14/14 ,  C23C14/34 ,  F24S25/30 ,  F24S25/636 ,  F24S2025/016 ,  F24S2025/801 ,  F24S2025/807 ,  G01F1/56 ,  G01J1/42 ,  H02S20/00 ,  Y02E10/47 ,  Y02E10/50

    Abstract: The present disclosure relates to the field of sensor manufacturing technology, particularly discloses a method for manufacturing a micro-sensor body, comprising the steps of S1: applying a wet colloidal material on a substrate to form a colloidal layer, and covering a layer of one-dimensional nanowire film on the surface of the colloidal layer to form a sensor embryo; S2: drying the colloidal layer of the sensor embryo to an extent that the colloidal layer cracks into a plurality of colloidal islands, a portion of the one-dimensional nanowire film contracting into a contraction diaphragm adhered to the surface of the colloidal islands while the other portion of the one-dimensional nanowire film being stretched into a connection structure connected between the adjacent contraction diaphragms. By the method for manufacturing a micro-sensor body of the present disclosure, the contraction diaphragms and connection structures formed by stretching the one-dimensional nanowire film are connected stably, which enhances the stability of the sensor devices; and the cracking manner renders it easy to obtain a large-scale of sensor bodies with connection structure arrays in stable suspension.

    Abstract translation: 本发明涉及传感器制造技术领域，特别是公开了一种微传感器体的制造方法，其特征在于，包括以下步骤：S1将湿胶体材料涂布于基板上，形成胶体层，并覆盖一层 胶体层表面的三维纳米线膜形成传感器胚胎; S2：将传感器胚胎的胶体层干燥到胶体层裂解成多个胶体岛的程度，一部分纳米线膜的一部分收缩到收缩膜中，粘附到胶体岛的表面，而另一个 一维纳米线膜的一部分被拉伸成连接在相邻收缩膜片之间的连接结构。 通过本公开的微传感器体的制造方法，通过拉伸一维纳米线膜而形成的收缩膜片和连接结构稳定连接，提高了传感器装置的稳定性; 并且裂解方式使得容易获得具有稳定悬浮的连接结构阵列的大规模传感器体。

    Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technology
    107.
    发明授权
    Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technology 有权
    用不扩散的贵金属或特殊金属及其合金构造三维元件，并采用溅射技术制成

    公开(公告)号：US09090975B2

    公开(公告)日：2015-07-28

    申请号：US13164305

    申请日：2011-06-20

    Applicant: Heiko Specht ,  Andreas Reisinger ,  Ulrich Hausch ,  Frank Krueger ,  Jens Troetzschel

    Inventor： Heiko Specht ,  Andreas Reisinger ,  Ulrich Hausch ,  Frank Krueger ,  Jens Troetzschel

    IPC: C23C28/02 ,  B81C1/00

    CPC classification number: C23C28/023 ,  B81C1/00619 ,  B81C2201/0107 ,  B81C2201/0181

    Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.

    Abstract translation: 一个方面是制造连续层的产生多个连续层的三维结构的方法，其中除了第一层之外，每个连续层被布置在前一层上。 每个连续层包括至少两种材料，其中一种材料是牺牲材料，一种材料是结构材料。 每个连续的层限定通过三维结构的连续横截面。 生产每个层包括通过电化学方法沉积牺牲材料并通过物理气相沉积沉积结构材料。 在已经生产了多个连续层之后，通过去除至少一部分牺牲材料来覆盖三维结构。 牺牲材料是由镍，银，钯和金组成的组中的至少一种。

    Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures
    109.
    发明申请
    Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures 审中-公开
    具有电介质或活性碱的电化学结构和用于生产这种结构的方法和装置

    公开(公告)号：US20140209470A1

    公开(公告)日：2014-07-31

    申请号：US14184362

    申请日：2014-02-19

    Applicant: Microfabrica Inc.

    Inventor： Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: C25D1/00

    CPC classification number: C25D1/003 ,  B81C1/00373 ,  B81C2201/0181 ,  B81C2201/019

    Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

    Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

    SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY
    110.
    发明申请
    SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY 审中-公开
    开关及其制造方法和继电器

    公开(公告)号：US20140034465A1

    公开(公告)日：2014-02-06

    申请号：US13961279

    申请日：2013-08-07

    Applicant: OMRON Corporation

    Inventor： Takahiro Masuda ,  Naoki Yoshitake ,  Kenichi Hinuma ,  Junya Yamamoto ,  Takashi Fujisawa ,  Takeshi Fujiwara

    IPC: H01H1/06

    CPC classification number: H01H1/06 ,  B81B2201/014 ,  B81C1/00166 ,  B81C2201/0177 ,  B81C2201/0181 ,  B81C2201/0184 ,  H01H1/0036 ,  H01H2001/0052 ,  Y10T29/49105

    Abstract: A switch and a relay include a contact with a smooth contacting surface. A side surface of a fixed contact faces a side surface of a movable contact. The fixed contact has an insulating layer and a base layer stacked on a fixed contact substrate, and a first conductive layer formed thereon through electrolytic plating. The side surface of the first conductive layer that faces the movable contact becomes the fixed contact (contacting surface). The movable contact has an insulating layer and a base layer stacked on the movable contact substrate, and a movable contact formed thereon through electrolytic plating. A side surface of a second conductive layer that faces the fixed contact becomes the movable contact (contacting surface). The fixed contact and the movable contact have surfaces that contact the side surfaces of the mold portion when growing the first and second conductive layers through electrolytic plating.

    Abstract translation: 开关和继电器包括具有光滑接触表面的触点。 固定触点的侧表面面对活动触点的侧表面。 固定触点具有层叠在固定接触基板上的绝缘层和基层，以及通过电解电镀形成在其上的第一导电层。 第一导电层的面对可动触点的侧表面成为固定触点（接触面）。 可动触头具有堆叠在可动触点基板上的绝缘层和基极层，以及通过电解电镀形成的可动触点。 面对固定触点的第二导电层的侧表面成为可动触头（接触面）。 固定触点和可动触点具有通过电解电镀生长第一和第二导电层时与模具部分的侧表面接触的表面。

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