公开(公告)号：US09574945B2

公开(公告)日：2017-02-21

申请号：US15067521

申请日：2016-03-11

Applicant: University of Rochester

Inventor： Zeljko Ignjatovic ,  Hanan Dery

IPC: G01J5/00 ,  G01J5/08 ,  H01L31/112 ,  G01J5/22 ,  G01J5/20 ,  G01J5/10

CPC classification number: G01J5/0837 ,  G01J1/42 ,  G01J3/42 ,  G01J5/00 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/106 ,  H01L31/112 ,  H01L31/1136

Abstract: A detector of terahertz (THz) energy includes a MOSFET having an extended source region, and a channel region depleted of free carriers, which MOSFET operates in a sub-threshold voltage state and has an output that is an exponential function of THz energy supplied to the gate.

Abstract translation: 太赫兹（THz）能量的检测器包括具有扩展源极区域的MOSFET和耗尽自由载流子的沟道区域，该MOSFET工作在亚阈值电压状态，并且具有作为提供给...的THz能量的指数函数的输出 大门。

公开(公告)号：US20160290868A1

公开(公告)日：2016-10-06

申请号：US15035182

申请日：2014-11-04

Applicant: THE UNIVERSITY OF WARWICK ,  VTT TECHNICAL RESEARCH CENTRE OF FINLAND

Inventor： David Gunnarsson ,  Evan Parker ,  Martin Prest ,  Mika Prunnila ,  Terence Whall

IPC: G01J5/04 ,  G01J5/02 ,  G01J5/20 ,  H01L39/22 ,  H01L31/09

CPC classification number: G01J5/046 ,  G01J5/024 ,  G01J5/20 ,  G01J2005/106 ,  G01J2005/208 ,  H01L31/09 ,  H01L39/22 ,  H01L39/24

Abstract: A bolometer is described. A bolometer includes a superconductor-insulator-semiconductor-superconductor structure or a superconductor-insulator-semiconductor-insulator-superconductor structure. The semiconductor comprises an electron gas in a layer of silicon, germanium or silicon-germanium alloy in which valley degeneracy is at least partially lifted. The insulator or a one or both of the insulators may comprise a layer of dielectric material. The insulator or a one or both of the insulators may comprise a layer of non-degenerately doped semiconductor.

Abstract translation: 描述了测辐射热谱仪。 测辐射热计包括超导体 - 绝缘体 - 半导体 - 超导体结构或超导体 - 绝缘体 - 半导体 - 绝缘体 - 超导体结构。 半导体包括硅，锗或硅 - 锗合金层中的电子气，其中谷简并性至少部分地被提升。 绝缘体或一个或两个绝缘体可以包括电介质材料层。 绝缘体或一个或两个绝缘体可以包括非简并掺杂的半导体层。

公开(公告)号：US09448328B2

公开(公告)日：2016-09-20

申请号：US14453711

申请日：2014-08-07

Applicant: Brian McLaughlin

Inventor： Brian McLaughlin

IPC: G01J5/02 ,  G01V8/20 ,  G08B13/183 ,  G01J5/10 ,  G07C9/00

CPC classification number: G01V8/20 ,  G01J5/027 ,  G01J5/10 ,  G01J2005/106 ,  G07C9/00 ,  G08B13/183

Abstract: A system, for calculating an object location within a portal, includes a portal map formed by a plurality of infra-red beams. The system further includes a broken beam detector for detecting and recording, in response to an object moving through the portal map, data indicative of one or more broken beams of the plurality of infra-red beams. The data includes first data indicative of an initial position of the object within the portal, second data indicative of a subsequent position of the object within the portal, and third data including one or more time records. The system also includes at least one broken beam analyzer for obtaining the data from the broken beam detector, the broken beam analyzer calculating the object location based on at least one of the first data, the second data, and the third data.

Abstract translation: 用于计算门户内的对象位置的系统包括由多个红外线束形成的门户地图。 该系统还包括一个破碎的光束检测器，用于响应于移动通过门禁图的物体，检测和记录指示多个红外线束中的一个或多个断裂光束的数据。 数据包括指示门户内的对象的初始位置的第一数据，指示对象在门户内的后续位置的第二数据，以及包括一个或多个时间记录的第三数据。 该系统还包括至少一个用于从破碎光束检测器获得数据的断裂光束分析器，该破碎光束分析仪基于第一数据，第二数据和第三数据中的至少一个来计算对象位置。

公开(公告)号：US09426388B2

公开(公告)日：2016-08-23

申请号：US14344790

申请日：2012-08-23

Applicant: Kuniyuki Okuyama

Inventor： Kuniyuki Okuyama

IPC: H04N5/33 ,  H04N5/359 ,  G01J1/46 ,  G01J5/22 ,  G01J5/24 ,  H01L27/146 ,  G01J5/00 ,  G01J5/10

CPC classification number: H04N5/33 ,  G01J1/46 ,  G01J5/22 ,  G01J5/24 ,  G01J2005/0077 ,  G01J2005/106 ,  H01L27/14669 ,  H04N5/359

Abstract: Provided is an infrared image pickup device, including: a plurality of bolometer elements that receive light from a subject; and a plurality of readout circuits respectively connected to the plurality of bolometer elements, the plurality of bolometer elements and the plurality of readout circuits being connected to a first input voltage wiring and a second input voltage wiring. Each of the plurality of readout circuits includes: a bias circuit that applies a bias voltage to corresponding one of the plurality of bolometer elements; a bias-canceling circuit that removes an offset current of the corresponding one of the plurality of bolometer elements; an integration circuit connected to a connection point between the bias circuit and the bias-canceling circuit, that integrates a differential current between the bias circuit and the bias-canceling circuit; and a saturation-prevention circuit that prevents saturation of an output voltage of the integration circuit.

Abstract translation: 提供了一种红外图像拾取装置，包括：多个测辐射热计元件，其接收来自被摄体的光; 以及分别连接到多个测辐射热计元件的多个读出电路，多个测辐射热计元件和多个读出电路连接到第一输入电压布线和第二输入电压布线。 多个读出电路中的每一个包括：向多个测辐射热计元件中的相应一个辐射热计元件施加偏置电压的偏置电路; 偏移消除电路，其去除所述多个测辐射热计元件中的相应一个测辐射热计元件的偏移电流; 连接到偏置电路和偏置消除电路之间的连接点的积分电路，其对偏置电路和偏置消除电路之间的差分电流进行积分; 以及防止积分电路的输出电压饱和的饱和防止电路。

公开(公告)号：US20160161339A1

公开(公告)日：2016-06-09

申请号：US14562391

申请日：2014-12-05

Applicant: Intel Corporation

Inventor： Flora Tan

IPC: G01J5/00

CPC classification number: G01J5/0025 ,  G01J5/026 ,  G01J5/0275 ,  G01J2005/106

Abstract: A system configured to collect sensor data and compare the sensor data to a first template profile comprising data indicative of an approach of a user or compare the sensor data to a second template profile comprising data indicative of a departure of a user, or a combination thereof to determine whether the sensor data indicates the approach of a user or a departure of a user.

Abstract translation: 一种被配置为收集传感器数据并将传感器数据与第一模板简档进行比较的系统，该第一模板简档包括指示用户接近的数据或将传感器数据与包括指示用户偏离的数据的第二模板简档或其组合 以确定传感器数据是指示用户的接近还是用户的离开。

公开(公告)号：US20160109393A1

公开(公告)日：2016-04-21

申请号：US14518984

申请日：2014-10-20

Applicant: Andreas MANDELIS ,  Sreekumar KAIPLAVIL

Inventor： Andreas MANDELIS ,  Sreekumar KAIPLAVIL

IPC: G01N25/72 ,  G01N29/06 ,  G01J5/10

CPC classification number: G01N25/72 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/106 ,  G01N29/0672 ,  G01N29/2418 ,  G01N29/343

Abstract: Photothermal imaging systems and methods are disclosed that employ truncated-correlation photothermal coherence tomography (TC-PCT). According to the example methods disclosed herein, photothermal radiation is detected with an infrared camera while exciting a sample with the chirped delivery of incident laser pulses (where the pulses have a fixed width), and time-dependent photothermal signal data is obtained from the infrared camera and processed using a time-evolving filtering method employing cross-correlation truncation. The cross-correlation truncation method results in pulse-compression-linewidth-limited depth-resolved images with axial and lateral resolution well beyond the well-known thermal-diffusion-length-limited, depth-integrated nature of conventional thermographic and thermophotonic modalities. As a consequence, an axially resolved layer-by-layer photothermal image sequence can be obtained, capable of reconstructing three-dimensional visualizations (tomograms) of photothermal features in wide classes of materials. Additional embodiments are disclosed in which the aforementioned systems and methods are adapted to photo-acoustic and acousto-thermal imaging.

Abstract translation: 公开了采用截断相关光热相干断层扫描（TC-PCT）的光热成像系统和方法。 根据本文公开的示例方法，用红外照相机检测光热辐射，同时用激光脉冲（其中脉冲具有固定宽度）的啁啾传递激发样品，并且从红外线获得时间依赖的光热信号数据 摄像机，并使用采用互相关截断的时变演进滤波方法进行处理。 互相关截断法导致脉冲压缩 - 线宽限制的深度分辨图像，其轴向和横向分辨率远远超出了常规热成像和热光学模式的公知的热扩散长度限制的深度集成性质。 因此，可以获得轴向分辨的逐层光热图像序列，能够重建宽范围材料中光热特征的三维可视化（断层图）。 公开了另外的实施例，其中上述系统和方法适用于光声和声 - 热成像。

公开(公告)号：US20160104696A1

公开(公告)日：2016-04-14

申请号：US14887294

申请日：2015-10-19

Applicant: Joseph Donald LaVeigne

Inventor： Joseph Donald LaVeigne

IPC: H01L25/16 ,  H01L33/62 ,  H01L31/18 ,  H01L33/00 ,  G01J1/44 ,  H01L27/146

CPC classification number: H01L25/167 ,  G01J1/44 ,  G01J5/02 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  G01J2005/106 ,  G01J2005/202 ,  H01L27/14649 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  Y10T29/49002 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.

Abstract translation: 具有发射器或检测器阵列的第一衬底可以通过与具有读入（RIIC）或读出（ROIC）电路的第二衬底的凸起接合来连接。 在两个基板接合之后，所得到的组件可以被单个化以形成子阵列，例如具有像素元件的瓦片子阵列，其可以布置在布线层或载体上以形成更大的阵列。 瓦片的边缘特征可以提供物理对准，机械连接和芯片到芯片通信。 像素元件可以是用于IR图像投影仪的热发射元件，用于微测辐射热计的热检测器元件，基于LED的发射器，或诸如在可见光，红外和紫外线FPAs（焦平面阵列）中发现的量子光子检测器等）。

公开(公告)号：US20160011054A1

公开(公告)日：2016-01-14

申请号：US14329230

申请日：2014-07-11

Applicant: OmniVision Technologies, Inc.

Inventor： Dominic Massetti

IPC: G01J5/08 ,  G01J5/10 ,  H05K3/30 ,  H04N5/33

CPC classification number: G01J5/0806 ,  G01J5/045 ,  G01J5/08 ,  G01J5/10 ,  G01J5/20 ,  G01J2005/0081 ,  G01J2005/106 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14649 ,  H04N5/33

Abstract: A thermal imaging system with a vacuum-sealing lens cap, includes (a) a thermal image sensor having an array of temperature sensitive pixels for detecting thermal radiation, and (b) a lens sealed to the thermal image sensor for imaging thermal radiation from a scene onto the array of temperature sensitive pixels and sealing a vacuum around the temperature sensitive pixels. A wafer-level method for manufacturing a thermal imaging system with a vacuum-sealing lens cap includes sealing a lens wafer, having a plurality of lenses, to a sensor wafer having a plurality of thermal image sensors each having an array of temperature sensitive pixels, to seal, for each of the plurality of thermal image sensors, a vacuum around the temperature sensitive pixels.

Abstract translation: 具有真空密封透镜盖的热成像系统包括（a）具有用于检测热辐射的温度敏感像素阵列的热图像传感器，以及（b）密封到热图像传感器的透镜，用于对来自 将场景放在温度敏感像素阵列上，并围绕温度敏感像素密封真空。 用于制造具有真空密封透镜盖的热成像系统的晶片级方法包括将具有多个透镜的透镜晶片密封到具有多个具有温度敏感像素阵列的多个热图像传感器的传感器晶片， 对于多个热图像传感器中的每一个，密封围绕温度敏感像素的真空。

公开(公告)号：US20150350571A1

公开(公告)日：2015-12-03

申请号：US14758251

申请日：2013-12-26

Applicant: Hao Wang

Inventor： Hao Wang

IPC: H04N5/33 ,  H04N5/376 ,  H04N5/378 ,  H04N5/232 ,  G06T7/00

CPC classification number: H04N5/33 ,  G01J2005/106 ,  G06T2207/10048 ,  H04N5/23206 ,  H04N5/23222 ,  H04N5/23229 ,  H04N5/3765 ,  H04N5/378

Abstract: This invention provides a device and method for selecting thermal images, which relates to infrared thermal imaging detection. The conventional thermal imaging device is excessively dependent on subjective experience of users to photograph a thermal image of a body, causing great workload and failing to ensure the quality of the thermal image. In the invention, specified information of a specified body thermal image can be automatically detected from the acquired thermal imaging data frame, or auxiliary information is considered. Thus, the thermal imaging data frame satisfying a specified condition can be automatically selected, thereby facilitating subsequent processing or operation, such as inform, analysis, or storage, simplifying photographing operation, and improving the photographing speed and the quality of the thermal image.

Abstract translation: 本发明提供了一种用于选择热图像的装置和方法，其涉及红外热成像检测。 常规的热成像装置过度依赖于用户拍摄身体的热图像的主观体验，造成很大的工作量并且不能确保热图像的质量。 在本发明中，可以从获取的热成像数据帧中自动检测指定体热图像的指定信息，或考虑辅助信息。 因此，可以自动选择满足特定条件的热成像数据帧，从而有助于随后的处理或操作，例如通知，分析或存储，简化拍摄操作，以及提高拍摄速度和热图像的质量。

公开(公告)号：US20150346032A1

公开(公告)日：2015-12-03

申请号：US14294530

申请日：2014-06-03

Applicant: Siemens Energy, Inc.

Inventor： Erwan Baleine ,  Christine P. Spiegelberg

IPC: G01J5/00 ,  G02B6/42 ,  G02B6/32 ,  G01J5/10 ,  G01J5/08

CPC classification number: G01J5/0088 ,  G01J5/046 ,  G01J5/0818 ,  G01J5/0821 ,  G01J5/0846 ,  G01J5/10 ,  G01J5/602 ,  G01J2005/0077 ,  G01J2005/0081 ,  G01J2005/106 ,  G02B6/102 ,  G02B6/3624 ,  G02B6/4215

Abstract: Apparatus and method for thermally mapping a component in a high temperature environment. An optical probe (10) has a field of view (14) arranged to encompass a surface of a component (15) to be mapped. The probe (10) captures infrared (IR) emissions in the near or mid IR band. An optical fiber (16) has a field of view to encompass a spot location (18) on the surface of the component within the field of view (14) of the probe (12). The fiber (16) captures emissions in the long IR band. The emissions in the long IR band are indicative of an emittance value at the spot location. This information may be used to calibrate a radiance map of the component generated from the emissions in the near or mid IR band and thus map the absolute temperature of the component regardless of whether the component includes a TBC.

Abstract translation: 用于在高温环境中热成像的装置和方法。 光学探针（10）具有布置成包围待映射的部件（15）的表面的视场（14）。 探头（10）捕获近红外或中红外波段的红外（IR）发射。 光纤（16）具有包围探针（12）的视场（14）内的部件的表面上的光点位置（18）的视场。 光纤（16）捕获长IR波段的发射。 长IR波段中的发射指示在现场位置的发射值。 该信息可以用于校准从近红外或中红外波段的发射产生的分量的辐射度图，并且因此映射组件的绝对温度，而不管该组件是否包括TBC。