公开(公告)号：US20120236510A1

公开(公告)日：2012-09-20

申请号：US13051946

申请日：2011-03-18

Applicant: Chih Wei Wong

Inventor： Chih Wei Wong

IPC: H05K7/02 ,  H05K3/30

CPC classification number: H05K7/205 ,  H05K1/0201 ,  H05K1/185 ,  H05K2201/10068 ,  Y10T29/4913

Abstract: A system and method of making an apparatus for managing heat distribution in an oscillator system is disclosed. In an example embodiment, the apparatus includes a resonator configured to provide a periodic signal, a circuit coupled to the resonator configured to compensate for changes in the periodic signal due to variation in temperature, and further includes a heat source configured to generate heat that heats the resonator and the circuit. At least one of the resonator, circuit, and heat source is embedded in a substrate, and the resonator, circuit, and heat source are arranged to heat the resonator and circuit substantially the same amount.

Abstract translation: 公开了一种制造用于管理振荡器系统中的热分配的装置的系统和方法。 在一个示例性实施例中，该装置包括被配置为提供周期性信号的谐振器，耦合到谐振器的电路，被配置为补偿由温度变化引起的周期性信号的变化，并且还包括被配置为产生热量的热源 谐振器和电路。 谐振器，电路和热源中的至少一个嵌入在衬底中，并且谐振器，电路和热源被布置成加热谐振器和电路基本上相同的量。

公开(公告)号：US20120119868A1

公开(公告)日：2012-05-17

申请号：US13386835

申请日：2010-07-27

Applicant: Hitoshi Shimadu ,  Kazunori Kondou ,  Takehiko Sawada ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

Inventor： Hitoshi Shimadu ,  Kazunori Kondou ,  Takehiko Sawada ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H01F5/00 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/202 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/0263 ,  H05K1/111 ,  H05K1/181 ,  H05K3/341 ,  H05K3/386 ,  H05K2201/09745 ,  H05K2203/167 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.

Abstract translation: 公开了一种布线基板，其具有由金属板形成的布线图案，以及作为要固定布线图案的基材的绝缘层。 布线图案具有用于具有表面安装的电子部件（11）的安装垫。 电子部件通过将焊料倒入配线图案的安装焊盘而安装在布线图案的表面上。

公开(公告)号：US08148644B2

公开(公告)日：2012-04-03

申请号：US12528167

申请日：2008-02-18

Applicant: Stephane Ortet ,  Vincent Rebeyrotte ,  David Rousset

Inventor： Stephane Ortet ,  Vincent Rebeyrotte ,  David Rousset

IPC: H05K1/03

CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09709 ,  H05K2201/09781

Abstract: An electronic card that includes at least two superimposed conducting layers with an insulation layer between the two conducting layers, the two conducting layers each including a utility conducting portion and a conducting portion at the periphery of the utility conducting portion with an insulating portion between the conducting portions, the insulating portion of a first of the two layers being offset relative to the insulating portion of the second of the layers. An aircraft includes a housing in which at least one such card is provided.

Abstract translation: 一种电子卡，其包括在两个导电层之间具有绝缘层的至少两个重叠的导电层，所述两个导电层各自包括公用导电部分和在所述公用设施导电部分的周围的导电部分，所述绝缘部分在所述导电层之间具有绝缘部分 两层中的第一层的绝缘部分相对于第二层的绝缘部分偏移。 飞机包括其中提供至少一个这样的卡的壳体。

公开(公告)号：US20120068968A1

公开(公告)日：2012-03-22

申请号：US13306551

申请日：2011-11-29

Applicant: Joseph Kurth Reynolds ,  Shawn P. Day

Inventor： Joseph Kurth Reynolds ,  Shawn P. Day

IPC: G06F3/044 ,  G06F3/041

CPC classification number: G06F3/03547 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04107 ,  H03K17/962 ,  H03K2217/960765 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

Abstract translation: 提供一种触摸传感器装置，其使用柔性电路基板来提供改进的输入装置。 具体地说，本发明使用固定在柔性电路基板上的触摸传感器控制器，其耦合到传感器部件，以提供适用于各种应用的柔性，可靠和成本有效的触摸传感器。 在一个实施例中，触摸传感器使用提供相对高耐温性的柔性电路基板。 这允许使用可靠的技术来粘贴触摸传感器控制器，例如各种类型的焊接。 传感器组件可以包括相对低温的衬底，其可以提供成本有效的解决方案。 综合起来，触摸传感器的这个实施例以相对低的成本提供了可靠性和灵活性。

公开(公告)号：US08130499B2

公开(公告)日：2012-03-06

申请号：US12530277

申请日：2008-11-28

Applicant: Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

Inventor： Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

IPC: H05K7/20

CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/49861 ,  H01L23/645 ,  H01L25/162 ,  H01L2023/4025 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K7/1432 ,  H05K7/209 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

Abstract translation: 本发明涉及一种散热结构板和使用这种用于混合动力车辆或电动车辆等可靠性高的目的的散热结构的模块以及制造散热结构的方法。 树脂结构设置在安装在该引线框架等上的构成散热板和异型电子部件等的引线框架上以覆盖引线框架和异型电子部件等，以及 该树脂结构固定在金属板，装置的底盘等上，构成散热结构板整体，由此固定引线框和异型电子部件等的固定强度， 可以增强在引线框架和传热层之间的界面处的强度等。

公开(公告)号：US20120051008A1

公开(公告)日：2012-03-01

申请号：US12873315

申请日：2010-08-31

Applicant: Cheng-Yu Wang ,  Chang-Hsu Yen

Inventor： Cheng-Yu Wang ,  Chang-Hsu Yen

IPC: H05K5/00 ,  H05K1/16 ,  H05K1/11

CPC classification number: H05K1/0201 ,  G06F1/1658 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09854

Abstract: A circuit board includes a main body, an electronic component, a fixing portion and at least one via hole. The electronic component and the fixing portion are disposed on the main body. The at least one via hole is formed on the main body and adjacent to the fixing portion.

Abstract translation: 电路板包括主体，电子部件，固定部分和至少一个通孔。 电子部件和固定部分设置在主体上。 所述至少一个通孔形成在所述主体上并与所述固定部分相邻。

公开(公告)号：US08059425B2

公开(公告)日：2011-11-15

申请号：US12153907

申请日：2008-05-28

Applicant: Chung-Er Huang ,  Chien-Yu Huang

Inventor： Chung-Er Huang ,  Chien-Yu Huang

IPC: H03B1/00

CPC classification number: H05K9/0022 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0243 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2203/1316

Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

Abstract translation: 一种应用于电子设备的温度补偿晶体振荡器（TCXO）的集成电路模块包括：具有一个顶表面的一个基板; 一个温度补偿晶体振荡器（TCXO）设置在顶表面上; 至少一个芯片设置在顶表面上; 一个封装件形成在顶表面上，用于覆盖TCXO和芯片。 由于上述结构，TCXO由于温度差而不能进行热交换，所以TCXO的稳定性提高。

公开(公告)号：US20110252984A1

公开(公告)日：2011-10-20

申请号：US12759760

申请日：2010-04-14

Applicant: Terry Tae-Il Chung ,  Jeff Schroeder ,  Kerry Berland ,  Douglas Reinking

Inventor： Terry Tae-Il Chung ,  Jeff Schroeder ,  Kerry Berland ,  Douglas Reinking

IPC: A23C3/02 ,  G01K13/00 ,  H05K13/00 ,  G01K7/01

CPC classification number: G01K7/01 ,  G01K13/00 ,  G01K2207/02 ,  H05K1/0201 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10151 ,  Y02P70/611 ,  Y10T29/49002

Abstract: The temperature of shelves used in a food holding cabinet are measured using a transistor. The voltage across a PN junction being known to be temperature dependent, the shelf temperature can be inferred from a calculated temperature of a PN junction of a transistor thermally coupled to a heated or refrigerated shelf. No calibration of the measurement device is required since the PN junction voltage, current and temperature relationship is well known.

Abstract translation: 使用晶体管测量食品储藏柜中使用的货架的温度。 已知PN结上的电压与温度有关，搁架温度可以从热耦合到加热或冷藏架的晶体管的PN结的计算温度推断。 不需要校准测量装置，因为PN结电压，电流和温度关系是众所周知的。

公开(公告)号：US20110123838A1

公开(公告)日：2011-05-26

申请号：US12886509

申请日：2010-09-20

Applicant: Seongjoon Lee ,  Myungjun Lee

Inventor： Seongjoon Lee ,  Myungjun Lee

IPC: H01M10/02 ,  H01M10/50 ,  H05K1/16

CPC classification number: H01M2/348 ,  H01M2/0207 ,  H01M2/34 ,  H01M10/0525 ,  H01M10/425 ,  H01M2200/00 ,  H01M2200/10 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/183 ,  H05K2201/10022

Abstract: Disclosed are a secondary battery and a circuit board assembly suitable for the secondary battery. The secondary battery includes a bare cell including an electrode terminal, a circuit board electrically connected to the electrode terminal and arranged on a top surface of the bare cell. The circuit board includes an installation part having a smaller thickness than rest of the circuit board. The secondary battery further includes a temperature device installed on the installation part of the circuit board to sense temperature variation of the bare cell.

Abstract translation: 公开了适用于二次电池的二次电池和电路板组件。 二次电池包括具有电极端子的裸电池，与电极端子电连接并配置在裸电池的顶面上的电路基板。 电路板包括具有比电路板的其余部分更小的厚度的安装部分。 二次电池还包括安装在电路板的安装部分上的温度装置，以感测裸电池的温度变化。

公开(公告)号：US07929308B2

公开(公告)日：2011-04-19

申请号：US12535969

申请日：2009-08-05

Applicant: Sang Kuk Choi ,  Hyun Tak Kim ,  Byung Gyu Chae ,  Bong Jun Kim

Inventor： Sang Kuk Choi ,  Hyun Tak Kim ,  Byung Gyu Chae ,  Bong Jun Kim

IPC: H05K7/20 ,  H01L21/335

CPC classification number: H05K1/0201 ,  H01L2224/48091 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10522 ,  H01L2924/00014

Abstract: A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.

Abstract translation: 功率器件封装使用半永久性金属 - 绝缘体转换（MIT）装置代替保险丝来控制功率器件的发热，并通过仅在一个区域上提供的小型散热器发射由功率器件产生的热量 功率器件，从而确保良好的散热。 因此，功率器件封装可以有效地应用于使用功率器件的任何电/电子电路。