公开(公告)号：US06499214B2

公开(公告)日：2002-12-31

申请号：US09812449

申请日：2001-03-20

Applicant: Delin Li ,  Richard Keith McMillan ,  Zhong-You Shi

Inventor： Delin Li ,  Richard Keith McMillan ,  Zhong-You Shi

IPC: H05K320

CPC classification number: H05K3/429 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract translation: 一种用于制造具有金属化孔38,40,130,132的多层电路板的方法10,110，其可以选择性地和电接地并且具有至少一个形成的空气桥92,178。

公开(公告)号：US06495053B1

公开(公告)日：2002-12-17

申请号：US09651765

申请日：2000-08-30

Applicant: Lawrence Leroy Kneisel ,  Mohan R. Paruchuri ,  Vivek Amir Jalrazbhoy ,  Vladimir Stoica

Inventor： Lawrence Leroy Kneisel ,  Mohan R. Paruchuri ,  Vivek Amir Jalrazbhoy ,  Vladimir Stoica

IPC: H01B124

CPC classification number: H05K3/4641 ,  H05K3/386 ,  H05K3/4038 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09581 ,  H05K2203/1438

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.

Abstract translation: 具有选择性地形成的孔或空腔26的多层电子电路板设计10，并且其包括槽或槽20,22，其有效地选择性地捕获液化的粘合剂材料，从而基本上防止粘合剂材料进入孔26。

公开(公告)号：US06482013B2

公开(公告)日：2002-11-19

申请号：US08802054

申请日：1997-02-18

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R1200

CPC classification number: G01R3/00 ,  B23K20/004 ,  B23K2101/38 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D7/123 ,  C25D21/02 ,  G01R1/06727 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/4951 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/1134 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R12/57 ,  H05K1/141 ,  H05K3/24 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: Spring contact elements having a base end portion, a contact end portion, and a central body portion. In a first embodiment, the spring contact elements provide for movement of a majority of the spring contact element characterized by a first spring constant. As the force and deflection increase, the movement of a rearward portion of the spring contact element will stop when a portion of the contact element abuts a portion of its mounting member while the movement of a forward portion will continue with a second and different spring constant. In a second embodiment, the spring contact elements include additional conductive and insulating layers formed about the contact element for controlling the impedance of the spring contact element throughout its range of motion. The additional conductive layer may be connected to ground. The spring contact elements may, in turn, be mounted on an electronic component, such as a space transformer or a semiconductor device to form a probe card assembly for effecting highly uniform pressure connections to corresponding terminals on another electronic component.

Abstract translation: 具有基端部分，接触端部分和中心体部分的弹簧接触元件。 在第一实施例中，弹簧接触元件提供弹簧接触元件的大部分的运动，其特征在于第一弹簧常数。 当力和偏转增加时，当接触元件的一部分抵靠其安装构件的一部分时，弹簧接触元件的后部的移动将停止，同时前部的移动将以第二和不同的弹簧常数继续 。 在第二实施例中，弹簧接触元件包括围绕接触元件形成的额外的导电和绝缘层，用于在整个运动范围内控制弹簧接触元件的阻抗。 附加的导电层可以连接到地面。 弹簧接触元件又可以安装在诸如空间变压器或半导体器件的电子部件上，以形成用于实现与另一电子部件上的相应端子的高度均匀的压力连接的探针卡组件。

公开(公告)号：US06467161B2

公开(公告)日：2002-10-22

申请号：US09812989

申请日：2001-03-20

Applicant: Achyuta Achari ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Richard Keith McMillan ,  Vivek A. Jairazbhoy

Inventor： Achyuta Achari ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Richard Keith McMillan ,  Vivek A. Jairazbhoy

IPC: H05K320

CPC classification number: H05K3/4685 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract translation: 一种用于制造具有金属化孔18,20,118,120的多层电子电路板82,148的方法10,110，其可以选择性地和电连接到地电位源。

公开(公告)号：US06399889B1

公开(公告)日：2002-06-04

申请号：US09394153

申请日：1999-09-13

Applicant: Kurt J. Korkowski ,  Kenneth R. Fastner ,  Adam K. Himes ,  Gregory P. Myers ,  Andrew R. Motzko

Inventor： Kurt J. Korkowski ,  Kenneth R. Fastner ,  Adam K. Himes ,  Gregory P. Myers ,  Andrew R. Motzko

IPC: H05K100

CPC classification number: G11B5/4853 ,  H05K3/366 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09645 ,  Y10T29/49023 ,  Y10T29/49025 ,  Y10T29/49027

Abstract: A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.

Abstract translation: 一种用于将数据头的换能器元件连接到驱动电路的头部互连电路，驱动电路包括在引线端上的对准指状物，用于将引线相对于用于将头部电连接到驱动电路的连接器或焊盘对准。 一种用于将头互连电路连接到支撑在头致动器上的印刷电路的方法，包括将引线尖端上的对准指针与驱动电路的印刷表面对准，用于将引线尖端上的引线焊接到驱动电路上的焊盘或连接器 。

公开(公告)号：US20020003377A1

公开(公告)日：2002-01-10

申请号：US09897906

申请日：2001-07-05

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Eriko Yuasa ,  Shuji Yamakawa ,  Shinshu Kato

IPC: B60L003/00

CPC classification number: H05K1/0256 ,  H01R9/226 ,  H01R2201/26 ,  H05K1/0284 ,  H05K3/28 ,  H05K7/026 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/10272

Abstract: An electrical connection box is provided for a vehicle which has a low-voltage battery of maximum output voltage selected from 14V and 28V, and a high-voltage battery of output voltage higher than that of said first battery structure. The electrical connection box has an insulation plate and, fixed on one face of said insulation plate, first bus bars connected in use to the first battery and second bus bars connected in use to the second battery so that the first and second bus bars are at different potentials. In order to reduce a risk of electrical leakage paths on the insulation plate, at least one of the following features is present: (i) the first bus bars and the second bus bars are separated on the face of the insulation plate by an air insulation zone of width in the range of from about 1 mm to about 30 mm, (ii) an insulation wall stands up on the insulation plate between the first bus bars and the second bus bars, (iii) the second bus bars are embedded in the insulating material.

Abstract translation: 为具有选自14V和28V的最大输出电压的低电压电池和高于所述第一电池结构的高压电池的车辆提供电接线盒。 电连接盒具有绝缘板，并且固定在所述绝缘板的一个面上，使用中连接到第一电池的第一母线和连接到第二电池的第二母线，使得第一和第二母线处于 不同的潜力。 为了减少绝缘板上的漏电路径的风险，存在以下特征中的至少一个：（i）第一母线和第二母线在绝缘板的表面上通过空气绝缘 宽度范围为约1mm至约30mm的区域，（ii）绝缘壁在第一母线和第二母线之间的绝缘板上竖起，（iii）第二母线嵌入 绝缘材料。

公开(公告)号：US06324754B1

公开(公告)日：2001-12-04

申请号：US09047638

申请日：1998-03-25

Applicant: Thomas H. DiStefano ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad

IPC: H05K334

CPC classification number: H01L24/81 ,  H01L23/49838 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19043 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0397 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and reflowed. The pad configuration helps to center the solder ball and keeps the solder ball down in the desired position thereby minimizing variations in height of the resulting solder bumps. Also, the solder pad may include non-wettable surfaces defined by a non-wettable metal, a metal compound or a dielectric material. The non-wettable areas on the pad confine the solder and avoid the need for a separate solder mask.

Abstract translation: 用于微电子连接的焊盘由一组从中心点径向向外延伸的可焊接润湿条形成。 固体芯焊球位于每个焊盘上并回流。 焊盘配置有助于使焊球居中，并将焊球保持在所需位置，从而最小化所得焊料凸块的高度变化。 此外，焊盘可以包括由非可润湿金属，金属化合物或电介质材料限定的不可润湿表面。 焊盘上的不可润湿区域限制焊料，并避免需要单独的焊接掩模。

公开(公告)号：US20010037898A1

公开(公告)日：2001-11-08

申请号：US09815234

申请日：2001-03-22

Inventor： Bharat Z. Patel ,  Jay D. Baker ,  Mohan R. Paruchuri

IPC: H05K001/11

CPC classification number: H05K3/462 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and adding additional electrically conductive layers of material 34, 56, 58, 104, 114, 138, 140 to the member 12, 92 while selectively extending the protuberance 15, 100 within the layers 82, 168, thereby forming a circuit board 82, 168. A portion of the formed circuit board may be etched in order to selectively create air-bridges 86 or interconnection portions 164.

Abstract translation: 一种用于制造多层电子电路板82,168的方法10,90，包括在导电构件12,92上形成至少一个突起15,100的步骤，并且添加另外的材料34,56,58的导电层 ，104,114,138,140连接到构件12,92，同时在层82,168内选择性地延伸突起15,100，从而形成电路板82,168。形成的电路板的一部分可以按顺序蚀刻 以选择性地产生空气桥86或互连部分164。

公开(公告)号：US20010011604A1

公开(公告)日：2001-08-09

申请号：US09829213

申请日：2001-04-09

Inventor： Kurt J. Korkowski ,  Kenneth R. Fastner ,  Adam K. Himes ,  Gregory P. Myers ,  Andrew R. Motzko

IPC: H05K001/11 ,  H05K001/14

CPC classification number: G11B5/4853 ,  H05K3/366 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09645 ,  Y10T29/49023 ,  Y10T29/49025 ,  Y10T29/49027

Abstract: A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.

Abstract translation: 一种用于将数据头的换能器元件连接到驱动电路的头部互连电路，驱动电路包括在引线端上的对准指状物，用于将引线相对于用于将头部电连接到驱动电路的连接器或焊盘对准。 一种用于将头互连电路连接到支撑在头致动器上的印刷电路的方法，包括将引线尖端上的对准指针与驱动电路的印刷表面对准，用于将引线尖端上的引线焊接到驱动电路上的焊盘或连接器 。

公开(公告)号：US06265765B1

公开(公告)日：2001-07-24

申请号：US08935962

申请日：1997-09-23

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Tony Faraci

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Tony Faraci

IPC: H01L2302

CPC classification number: H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2224/81904 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2224/48

Abstract: A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.