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    Backplane transmission line system
    101.
    发明授权
    Backplane transmission line system 失效
    背板传输线系统

    公开(公告)号：US3992686A

    公开(公告)日：1976-11-16

    申请号：US598592

    申请日：1975-07-24

    Applicant: Tim W. Canning

    Inventor： Tim W. Canning

    IPC: H01P3/08 ,  H04B3/52 ,  H05K1/02 ,  H02B1/04

    CPC classification number: H01P3/081 ,  H04B3/52 ,  H05K1/0246 ,  H05K1/0231 ,  H05K2201/044 ,  H05K2201/10022

    Abstract: A backplane motherboard which mounts a plurality of printed circuit boards and which provides microstrip transmission lines to interconnect the components of an inserted PC board with any of the other inserted PC boards. All transmission lines are terminated at both ends with the characteristic impedance, and the plane of the motherboard is made of a sandwich construction having a ground plane, a Mylar insulating plane, a voltage plane, and outer epoxy surface insulators. The plane sandwich also carries terminal pins for holding additional printed circuit boards.

    Abstract translation: 背板母板，其安装多个印刷电路板，并且提供微带传输线以将插入的PC板的组件与任何其它插入的PC板相互连接。 所有传输线在两端以特征阻抗端接，母板的平面由具有接地平面的三明治结构，聚酯薄膜绝缘平面，电压平面和外环氧树脂表面绝缘体制成。 平面三明治还带有用于保持附加印刷电路板的端子引脚。

    Flat cable harness
    102.
    发明授权
    Flat cable harness 失效
    扁平电缆线束

    公开(公告)号：US3727168A

    公开(公告)日：1973-04-10

    申请号：US3727168D

    申请日：1971-11-08

    Applicant: AMP INC

    Inventor： HENSCHEN H ,  ZELL D

    IPC: H01B7/08 ,  H01R31/02 ,  H05K1/11 ,  H05K3/36 ,  H05K1/07

    CPC classification number: H05K1/118 ,  H01B7/08 ,  H01R31/02 ,  H05K3/361 ,  H05K2201/044 ,  H05K2201/055 ,  H05K2201/09445 ,  H05K2201/10189 ,  H05K2201/1034

    Abstract: Electrical harness for electrically commoning the corresponding positions of a first plurality of multi-row electrical connectors comprises flat cables, each of which contains a number of conductors equal to the number of positions in each connector row. The cables have at least one side edge which extends sinuously so that each cable has alternate wide and narrow portions. Terminals are crimped onto the conductors in the wide portions of the cables and, in one embodiment, the terminals are inserted into the rows of complementary connectors which can be mated with the first connectors whereby the corresponding positions of the first connectors are commonly connected. One alternative embodiment is disclosed which does not require the complementary connectors while another alternative embodiment does not require the first connectors.

    Abstract translation: 用于电共同第一多个多行电连接器的对应位置的电气线束包括扁平电缆，每个电缆包含多个等于每个连接器行中的位置数量的导体。 电缆具有至少一个侧边缘，该侧边缘呈正切延伸，使得每个电缆具有交替的宽而窄的部分。 端子被压接在电缆的宽部分中的导体上，并且在一个实施例中，端子被插入到可与第一连接器配合的互补连接器的行中，由此第一连接器的对应位置共同连接。 公开了一种替代实施例，其不需要互补连接器，而另一替代实施例不需要第一连接器。

    Back plane
    103.
    发明授权
    Back plane 失效
    后退平面

    公开(公告)号：US3663866A

    公开(公告)日：1972-05-16

    申请号：US3663866D

    申请日：1970-03-27

    Applicant: ROGERS CORP

    Inventor： IOSUE MICHAEL F ,  ROBINSON RONALD F ,  ANDERSON PAUL L ,  ZIOBROWSKI EDWIN P

    IPC: H01R12/51 ,  H05K1/18 ,  H05K3/22 ,  H05K3/46 ,  H05K1/04

    CPC classification number: H05K1/185 ,  H05K3/222 ,  H05K3/4641 ,  H05K2201/044 ,  H05K2201/09309 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10704

    Abstract: A back plane for use as a power bus which supports and electrically energizes microcircuit chips. The back plane is formed by a laminated structure in which are mounted wire wrap pins that form terminals for the microcircuits. The laminates are sheets of conductive material insulated from one another and the wrap pins are mounted in the laminated structure so that electrical contact for each pin is made with only one of the conductive laminates. There are sufficient wrap pins to provide electrical contact with each of the respective conductive laminates. The laminates also include channels in which microcircuit chips may be mounted. The leads from the chips can be wrapped around the terminal pins which are connected respectively to the laminates energized at appropriate voltage levels.

    Abstract translation: 用作电源总线的背板，支持微电路芯片的电能。 背板由层压结构形成，其中安装有形成用于微电路的端子的绕线销。 层压板是彼此绝缘的导电材料片，并且绕线销安装在层压结构中，使得每个销的电接触仅由一个导电层压板制成。 存在足够的缠绕销以与每个相应的导电层压板电接触。 层压板还包括可以安装微电路芯片的通道。 来自芯片的引线可以缠绕在分别连接到以适当电压电平激励的层压体的端子引脚上。

    COMPUTING SYSTEM WITH CONNECTING BOARDS
    105.
    发明公开
    COMPUTING SYSTEM WITH CONNECTING BOARDS 审中-公开

    公开(公告)号：US20240314930A1

    公开(公告)日：2024-09-19

    申请号：US18490678

    申请日：2023-10-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Alan GARA ,  Young-Jun HONG ,  Eric Richard BORCH ,  Casey THIELEN

    IPC: H05K1/14 ,  H04L49/00 ,  H05K7/14

    CPC classification number: H05K1/14 ,  H04L49/70 ,  H05K7/1445 ,  H05K2201/044

    Abstract: A computing system with connecting boards. In some embodiments, the computing system includes a first compute board, a second compute board, and a first connecting board connected to the first compute board and to the second compute board. The first compute board and the second compute board may include a plurality of compute elements. The first compute board, the second compute board, and the first connecting board may include a first plurality of switches including a first switch connected to a first compute element of the plurality of compute elements and a second switch connected to a second compute element of the plurality of compute elements. The first connecting board may include a first conductor, the first conductor being a conductor of a first data connection between the first switch and the second switch.

    High-speed performance electrical connector for modular electronics systems
    107.
    发明授权
    High-speed performance electrical connector for modular electronics systems 有权

    公开(公告)号：US11778768B2

    公开(公告)日：2023-10-03

    申请号：US17408312

    申请日：2021-08-20

    Applicant: NATIONAL INSTRUMENTS CORPORATION

    Inventor： Richard G. Baldwin, Jr. ,  Dennis Vance Toth

    IPC: H05K7/14 ,  G06F1/18 ,  H01R12/70

    CPC classification number: H05K7/1424 ,  G06F1/183 ,  H01R12/7005 ,  H05K7/1454 ,  H05K7/1488 ,  H05K2201/044

    Abstract: A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.

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