公开(公告)号：US20090218121A1

公开(公告)日：2009-09-03

申请号：US12393642

申请日：2009-02-26

Applicant: Norihiro ISHII

Inventor： Norihiro ISHII

IPC: H05K1/16 ,  H05K3/20

CPC classification number: H05K3/305 ,  H01L2224/32225 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/09772 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A method for manufacturing a printed circuit board. The method includes: preparing a printed wiring board, the printed wiring board comprising through holes and a plurality of electrode pads; coating surfaces of the plurality of electrode pads and surfaces of the through holes on an one side of the printed wiring board with a bonding material; mounting a semiconductor package on the printed wiring board such that a plurality of bumps on a surface of the semiconductor package corresponds to the plurality of electrode pads; bonding the bumps to the electrode pads by heating the printed wiring board on which the semiconductor package is mounted; and filling a space between the semiconductor package and the printed wiring board with a filler material.

Abstract translation: 一种印刷电路板的制造方法。 该方法包括：制备印刷线路板，印刷线路板包括通孔和多个电极焊盘; 在印刷电路板的一侧用接合材料涂覆多个电极焊盘的表面和通孔的表面; 将半导体封装安装在所述印刷电路板上，使得所述半导体封装的表面上的多个凸块对应于所述多个电极焊盘; 通过加热其上安装有半导体封装的印刷线路板将凸块接合到电极焊盘; 以及用填充材料填充半导体封装和印刷线路板之间的空间。

公开(公告)号：US07425762B2

公开(公告)日：2008-09-16

申请号：US11607910

申请日：2006-12-04

Applicant: Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

Inventor： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC: H01L23/34

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Abstract translation: 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。

公开(公告)号：US20080057691A1

公开(公告)日：2008-03-06

申请号：US11511619

申请日：2006-08-29

Applicant: Ross S. Dando ,  Steven Oliver ,  Swarnal Borthakur ,  Kevin Hutto

Inventor： Ross S. Dando ,  Steven Oliver ,  Swarnal Borthakur ,  Kevin Hutto

IPC: H01L21/44

CPC classification number: H01L21/76898 ,  H05K3/3468 ,  H05K2201/09572 ,  H05K2203/0763 ,  H05K2203/082

Abstract: Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the aperture with a vacuum. The wave may be formed by flowing the liquid material out from an outlet in a direction generally against the gravitational field. The liquid material may be solidified to form an electrically conductive structure. A plurality of apertures may be selectively filled with the liquid material one at a time, and liquids having different compositions may be used to provide conductive vias having different compositions in the same substrate. Systems for forming conductive vias include a substrate fixture, a vacuum device having a vacuum fixture, and a solder dispensing device configured to provide a wave of molten solder material. Relative lateral and vertical movement is provided between the wave of molten solder and a substrate supported by the substrate fixture.

Abstract translation: 在衬底中形成导电通孔的方法包括使衬底与诸如熔融焊料的导电液体材料的波接触，并且用真空将液体材料拉入孔中。 该波浪可以通过使液体材料沿着通常抵靠重力场的方向从出口流出而形成。 液体材料可以被固化以形成导电结构。 可以一次一个地选择性地填充多个孔，并且可以使用具有不同组成的液体来在同一基底中提供具有不同组成的导电通孔。 用于形成导电通孔的系统包括衬底夹具，具有真空夹具的真空装置以及被配置为提供熔融焊料材料波的焊料分配装置。 在熔融焊料的波浪和由基板夹具支撑的基板之间提供相对的横向和垂直运动。

公开(公告)号：US07293999B2

公开(公告)日：2007-11-13

申请号：US11479474

申请日：2006-06-30

Applicant: Keith Everett ,  Kevin Paul Little ,  Jamie Anderson

Inventor： Keith Everett ,  Kevin Paul Little ,  Jamie Anderson

IPC: H01R12/00

CPC classification number: H05K1/0218 ,  H05K3/325 ,  H05K9/0058 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: A fiber optic module has a PCB with high frequency tracks. The PCB is housed within a housing having top and bottom parts, each having a series of metallized ridges. The PBC has through holes filled with solder. Thus, there is a series of electrical interconnections through the PBC, and the total length of any enclosed periphery is much shorter than the full periphery of the board so that high frequencies are attenuated.

Abstract translation: 光纤模块具有高频轨迹的PCB。 PCB被容纳在具有顶部和底部部分的壳体中，每个具有一系列金属化的脊。 PBC具有填充有焊料的通孔。 因此，通过PBC存在一系列电互连，并且任何封闭周边的总长度比板的整个周边短得多，使得高频衰减。

公开(公告)号：US07291922B2

公开(公告)日：2007-11-06

申请号：US11207715

申请日：2005-08-22

Applicant: Hokichi Yoshioka ,  Kazuhiko Ito

Inventor： Hokichi Yoshioka ,  Kazuhiko Ito

IPC: H01L23/48

CPC classification number: H05K3/4046 ,  H01L23/10 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/0306 ,  H05K3/388 ,  H05K2201/09572 ,  H05K2201/10242 ,  H01L2924/00

Abstract: A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

Abstract translation: 具有设置在其中的许多通孔接触装置的基板。 每个通孔接触装置由形成在基板中的作为通孔的通孔，设置在通孔的内周面上的金属膜和填充到由金属膜限定的空腔中的焊料构成 。

公开(公告)号：US20070158843A1

公开(公告)日：2007-07-12

申请号：US11621042

申请日：2007-01-08

Applicant: Shin Kim ,  Se-Yong OH

Inventor： Shin Kim ,  Se-Yong OH

IPC: H01L23/48

CPC classification number: H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/1394 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package with improved solder joint reliability, and a method of fabricating the same are provided. The semiconductor package comprises a printed circuit board (PCB) having a plurality of interconnection layers formed on its surface, and having a plurality of through holes connected to the interconnection layers. An adhesive member is attached to an upper surface of the PCB, and a semiconductor chip is electrically connected to the interconnection layers and mounted on an upper surface of the adhesive member. A solder connecting part fills each through hole so as to form a mechanically strong connection that is resistant to breakage during thermal transients and physical impacts.

Abstract translation: 提供了具有改进的焊点可靠性的半导体封装及其制造方法。 半导体封装包括印刷电路板（PCB），其具有在其表面上形成的多个互连层，并且具有连接到互连层的多个通孔。 粘合剂部件附着到PCB的上表面，并且半导体芯片电连接到互连层并且安装在粘合部件的上表面上。 焊接连接部分填充每个通孔，以便形成机械强连接，其在热瞬变和物理冲击期间耐断裂。

公开(公告)号：US20070080447A1

公开(公告)日：2007-04-12

申请号：US11607910

申请日：2006-12-04

Applicant: Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

Inventor： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC: H01L23/34 ,  H01L21/00

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Abstract translation: 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。

公开(公告)号：US20070069834A1

公开(公告)日：2007-03-29

申请号：US11335195

申请日：2006-01-19

Applicant: Takanori Ikuta ,  Wataru Koga ,  Hiroki Kan ,  Yuuko Yokota

Inventor： Takanori Ikuta ,  Wataru Koga ,  Hiroki Kan ,  Yuuko Yokota

IPC: H03H9/70

CPC classification number: H05K1/0243 ,  H01L21/4853 ,  H01L2224/16225 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K3/429 ,  H05K2201/09281 ,  H05K2201/09418 ,  H05K2201/09572 ,  H05K2201/09618 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10189 ,  Y02P70/611

Abstract: Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.

Abstract translation: 用于承载高频器件3的端子电极9形成在电路板的表面，其表面覆盖有反面导体层6，并且多个信号线2用于在高频器件3和 在其上形成外部电路。 端子电极9布置在电路板的中心，信号线2从端子电极9径向延伸。 可以减小信号线2之间的电磁干扰，从而在高频装置3为双工器的情况下，可以令人满意地表现出带外衰减特性和隔离特性。

公开(公告)号：US20070068701A1

公开(公告)日：2007-03-29

申请号：US11235728

申请日：2005-09-26

Applicant: Chee Fong ,  Harjit Singh ,  Jelena Larsen ,  Raul Rodriguez-Montanez ,  Rodney Amen

Inventor： Chee Fong ,  Harjit Singh ,  Jelena Larsen ,  Raul Rodriguez-Montanez ,  Rodney Amen

IPC: H05K1/11 ,  H01R12/04

CPC classification number: G01R31/2818 ,  H05K1/0268 ,  H05K3/0094 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2203/043 ,  H05K2203/1394 ,  Y10T29/49151

Abstract: A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end.

Abstract translation: 可以根据以下方法制造适合用作测试焊盘的通孔的电路板，其中在加热覆盖通孔的相对端的焊膏之前，通孔的第一端被阻挡。 结果，当焊膏被加热时，空气被捕获在通孔中，这防止熔化的焊膏流入。替代地，焊膏在通孔上形成圆顶形的测试焊盘，这便于与测试探针接触。 当应用于OSP电路板时，其结果是具有至少通孔的OSP板，其一端具有阻挡材料，在另一端具有焊料圆顶。

公开(公告)号：US20060290742A1

公开(公告)日：2006-12-28

申请号：US11472523

申请日：2006-06-22

Applicant: Koji Imai

Inventor： Koji Imai

IPC: B41J2/14

CPC classification number: B41J2/14201 ,  B41J2002/14491 ,  H05K1/112 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572

Abstract: Second individual electrodes are formed and arranged in zigzag in two rows on one surface of a flexible sheet, and wirings connected to the second individual electrodes are arranged to pass between adjacent second individual electrodes of the other row. Formed on the other surface of the flexible sheet are electrode connection sections to be connected to the second individual electrodes through through-holes going through the flexible sheet. The electrode connection section has an area larger than the second individual electrode and is connected to an external electrode through solder.

Abstract translation: 第二单独电极在柔性片的一个表面上以锯齿形成并布置成两排，并且连接到第二单独电极的布线被布置成在另一行的相邻的第二单独电极之间通过。 形成在柔性片的另一个表面上的电极连接部分通过穿过柔性片的通孔连接到第二个别电极。 电极连接部具有大于第二单独电极的面积，并且通过焊料与外部电极连接。