公开(公告)号：US08030767B2

公开(公告)日：2011-10-04

申请号：US11693741

申请日：2007-03-30

Applicant: Jing-Hong Yang

Inventor： Jing-Hong Yang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/4007 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0597

Abstract: A bump structure with an annular support suitable for being disposed on a substrate is provided. The substrate has at least one pad and a passivation layer that has at least one opening exposing a portion of the pad. The bump structure with the annular support includes an under ball metal (UBM) layer, a bump, and an annular support. The UBM layer is disposed on the passivation layer and covers the pad exposed by the passivation layer. The bump is disposed on the UBM layer over the pad, and a diameter of a lower surface of the bump is less than the diameter of an upper surface thereof. The annular support surrounds and contacts the bump, and a material of the annular support is photoresist. An under cut effect is not apt to happen on the bump structure.

Abstract translation: 提供了一种具有适于设置在基板上的环形支撑件的凸块结构。 衬底具有至少一个焊盘和钝化层，其具有暴露焊盘的一部分的至少一个开口。 具有环形支撑件的凸起结构包括底部球金属（UBM）层，凸块和环形支撑件。 UBM层设置在钝化层上并覆盖由钝化层暴露的焊盘。 凸块设置在衬垫上的UBM层上，并且凸块的下表面的直径小于其上表面的直径。 环形支撑件围绕并接触凸起，并且环形支撑件的材料是光致抗蚀剂。 凹凸结构上不易发生切割效应。

公开(公告)号：US20110232948A1

公开(公告)日：2011-09-29

申请号：US12954052

申请日：2010-11-24

Applicant: Hiroyuki Sato ,  Tomohiko Murata ,  Fusaji Nagaya

Inventor： Hiroyuki Sato ,  Tomohiko Murata ,  Fusaji Nagaya

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K3/42 ,  H05K3/0032 ,  H05K3/426 ,  H05K3/4661 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions.

Abstract translation: 印刷电路板包括具有贯通孔的芯基板，在基板的第一表面上的第一电路，在基板的第二表面上的第二电路，以及连接第一和第二电路的孔中的通孔导体 。 孔具有第一和第二开口部。 第一开口部朝向第二表面变薄。 第二开口部朝向第一表面变薄。 第一开口部分具有第一和第二部分。 第二开口部分具有第一和第二部分。 第一开口部的第一部分和第二部分形成在第一和第二部分之间的边界处向内弯曲的内壁。 第二开口部的第一部分和第二部分形成在第一和第二部分之间的边界处向内弯曲的内壁。

公开(公告)号：US20110201194A1

公开(公告)日：2011-08-18

申请号：US12706212

申请日：2010-02-16

Applicant: Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

Inventor： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/3205

CPC classification number: H05K3/3452 ,  H01L21/4853 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1131 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/742 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3468 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.

Abstract translation: 获得组装; 它包括一个基片; 形成在所述基板的表面上的多个可湿式焊盘; 以及沉积在基板的表面上并具有外表面的阻焊层。 至少阻焊层形成有限定与湿润垫相邻的体积的凹陷区域。 将熔融的焊料直接注入到与湿式焊盘相邻的体积中，使得与可湿性焊盘相邻的体积填充有焊料。 使焊料固化。 它形成粘附到湿润垫的多个焊料结构。 在固化之后，将基板和焊料重新加热，以将焊料重新流入延伸到阻焊层的外表面之上的大致球形的球体。 配置和设置相邻于湿式焊盘的体积，以便在注入步骤中接收足够的焊料，使得大致球形球由于再加热步骤而在阻焊层的外表面上方延伸。 在替代方法中，焊料注入和凝固在氮气环境或形成气体环境中进行，并且可以省略回流步骤。

公开(公告)号：US20110194262A1

公开(公告)日：2011-08-11

申请号：US12949078

申请日：2010-11-18

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K2201/09827 ,  H05K2201/09845 ,  Y10T29/49124 ,  Y10T29/49128

Abstract: A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer.

Abstract translation: 一种柔性刚性布线板，包括绝缘基板，位于绝缘基板旁边的柔性布线板，位于绝缘基板和柔性布线板之上的绝缘层，并使柔性布线板的一部分露出，并且布线层由 导体，形成在绝缘层上。 绝缘层具有锥形部分，其在由绝缘层暴露的柔性线路板的部分的方向上朝向绝缘层的端面变薄。 布线层具有形成在绝缘层的锥形部分上的倾斜部分。

公开(公告)号：US20110192634A1

公开(公告)日：2011-08-11

申请号：US13120421

申请日：2009-09-23

Applicant: Ping Wang

Inventor： Ping Wang

IPC: H05K1/00

CPC classification number: H05K3/3447 ,  H05K1/119 ,  H05K3/42 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10333 ,  H05K2201/10409

Abstract: A circuit board comprises at least one mounting hole for coupling a weld screw. At least one notch for receiving solder is formed in an inner wall of the mounting hole.

Abstract translation: 电路板包括用于联接焊接螺钉的至少一个安装孔。 用于接收焊料的至少一个凹口形成在安装孔的内壁中。

公开(公告)号：US07963776B1

公开(公告)日：2011-06-21

申请号：US12730004

申请日：2010-03-23

Applicant: Chad William Morgan

Inventor： Chad William Morgan

IPC: H01R9/09

CPC classification number: H01R12/52 ,  H01R12/585 ,  H01R12/724 ,  H01R13/514 ,  H01R13/6473 ,  H05K1/115 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/09845 ,  H05K2201/10189

Abstract: An electrical connector assembly includes a circuit board having vias extending at least partially through the circuit board along via axes. The circuit board has traces and mounting pads that are electrically connected to corresponding traces, and that are exposed within corresponding vias. The vias have a staged diameter along the via axis with a constricted region proximate to the mounting. An electrical connector is mounted on the circuit board. The electrical connector includes a housing and signal terminals held by the housing. The signal terminals include mounting contacts being received in respective vias of the circuit board that engage corresponding mounting pads in the constricted region.

Abstract translation: 电连接器组件包括电路板，该电路板具有至少部分地沿着电路板沿着电路板延伸的通孔。 电路板具有电连接到相应迹线的迹线和安装焊盘，并且暴露在相应的通孔内。 通孔具有沿着通孔轴线的分段直径，并且靠近安装件的收缩区域。 电连接器安装在电路板上。 电连接器包括壳体和由壳体保持的信号端子。 信号端子包括接收在电路板的相应通孔中的安装触点，其接合收缩区域中的对应安装焊盘。

公开(公告)号：US07948085B2

公开(公告)日：2011-05-24

申请号：US12016593

申请日：2008-01-18

Applicant: Chao-Wen Shih ,  Zhao-Chong Zeng

Inventor： Chao-Wen Shih ,  Zhao-Chong Zeng

IPC: H05K1/02 ,  H05K3/00 ,  B32B3/10

CPC classification number: H05K3/243 ,  H01L2224/05018 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0577 ,  Y10T428/24273

Abstract: A circuit board structure and a fabrication method of the same are disclosed according to the present invention. The circuit board structure includes: a carrier board with at least one surface formed with a circuit layer having electrically connecting pads; a first solder mask formed on the carrier board and the circuit layer and formed with first openings for exposing the electrically connecting pads; and a second solder mask formed on the first solder mask and formed with second openings for exposing the first openings and the electrically connecting pads. The first solder mask is made of a high-insulation photosensitive material characterized by presence or absence of impurities, such as microparticles, to have enhanced fluidity for being filled in the circuit layer, thereby preventing metal ions migration and subsequent metal hypha electricity discharge which might otherwise affect electrical performance, therefore the present invention is applicable to fine circuit fabrication.

Abstract translation: 根据本发明公开了一种电路板结构及其制造方法。 电路板结构包括：承载板，其至少一个表面形成有具有电连接焊盘的电路层; 形成在所述载体板和所述电路层上并形成有用于暴露所述电连接焊盘的第一开口的第一焊料掩模; 以及形成在第一焊料掩模上并形成有用于暴露第一开口和电连接焊盘的第二开口的第二焊料掩模。 第一焊料掩模由高绝缘感光材料制成，其特征在于存在或不存在诸如微粒之类的杂质，以提高填充在电路层中的流动性，从而防止金属离子迁移和随后的金属菌丝放电，这可能 否则会影响电气性能，因此本发明适用于精细电路制造。

公开(公告)号：US20110069448A1

公开(公告)日：2011-03-24

申请号：US12736942

申请日：2009-05-29

Applicant: Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

Inventor： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract translation: 该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。 根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

公开(公告)号：US07911038B2

公开(公告)日：2011-03-22

申请号：US12306987

申请日：2007-06-29

Applicant: Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

Inventor： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC: H01L23/495

CPC classification number: H05K3/205 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/423 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

Abstract translation: 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。

公开(公告)号：US07833026B1

公开(公告)日：2010-11-16

申请号：US12729889

申请日：2010-03-23

Applicant: Chad William Morgan ,  David Wayne Helster ,  Michael William Woodford

Inventor： Chad William Morgan ,  David Wayne Helster ,  Michael William Woodford

IPC: H01R4/66

CPC classification number: H01R13/6474 ,  H01R12/52 ,  H01R12/585 ,  H01R12/722 ,  H01R12/724 ,  H01R13/514 ,  H01R13/6477 ,  H01R13/6587 ,  H05K1/0245 ,  H05K3/308 ,  H05K3/429 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2203/0242 ,  Y10S439/941

Abstract: An electrical connector assembly includes a circuit board having vias each extending at least partially through the circuit board along parallel via axes and an electrical connector configured to be mounted on the circuit board. The electrical connector includes a plurality of variable depth signal terminals configured to extend different depths into respective vias of the circuit board. The signal terminals each have a terminal axis, and the signal terminals are arranged in pairs carrying differential pair signals. The signal terminals of each pair extend to the same depth in the respective vias of the circuit board. The terminal axes of the signal terminals of each pair are offset with respect to the corresponding via axes along a majority of the signal terminals within the vias.

Abstract translation: 电连接器组件包括电路板，电路板具有通孔，每个通路至少部分地沿着平行的经由轴线延伸通过电路板，以及电连接器，其构造成安装在电路板上。 电连接器包括多个可变深度信号端子，其被配置为将不同深度延伸到电路板的相应通孔中。 信号端子各自具有端子轴，并且信号端子成对地布置成携带差分对信号。 每对信号端子在电路板的相应通路中延伸到相同的深度。 每对信号端子的端子轴相对于通孔内大部分信号端子相应的通孔轴偏移。