公开(公告)号：US4037047A

公开(公告)日：1977-07-19

申请号：US537714

申请日：1974-12-31

Applicant: Glen J. Taylor

Inventor： Glen J. Taylor

IPC: H05K3/00 ,  H05K1/14 ,  H05K3/30

CPC classification number: H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09109

Abstract: Method and structure for creating multilayer printed circuit boards having integral flexible conductor appendages, involving the utilization of an array of flexible, circuit-containing layers bonded in properly aligned relationship between rigid layers equipped with suitable electrical connections. All of the layers are substantially larger than the size the finished circuit board is to be and selectively bonded and slotted in preselected locations, and maintained in this over-sized condition throughout the procedure in which holes for interconnections are drilled, and plated through with conductive material. Only after the plating procedure has been completed are the portions of the upper and lower rigid layers removed from locations above and below the appendage portions, thus allowing them to attain the desired, flexible condition. By keeping the rigid layers intact, the assemblage is maintained rigid during the plating procedure, thereby avoiding undesirable work hardening of the flexible portions even without tools for restraining the flexible portions. The selective bonding and preslotting permits the ready removal of the rigid material from certain portions of the assemblage to form the circuit board with integral flexible conductor appendages.

Abstract translation: 用于制造具有整体柔性导线附件的多层印刷电路板的方法和结构，涉及利用配备有适当电连接的刚性层之间以适当对准的关系结合的柔性电路层的阵列。 所有的层都大大地大于完成的电路板将被选择性地结合并且在预先选定的位置开槽的尺寸，并且在贯穿用于互连的孔的钻孔过程中保持在这种超大尺寸的状态，并且通过导电 材料。 只有在电镀步骤完成之后，上，下刚性层的部分从附件部分上方和下方的位置移除，从而使它们达到所需的柔性状态。 通过保持刚性层的完整性，组装在电镀过程中保持刚性，从而避免了柔性部分的不期望的加工硬化，甚至没有用于限制柔性部分的工具。 选择性粘合和预拉伸允许从组合件的某些部分准备去除刚性材料以形成具有整体柔性导体附件的电路板。

公开(公告)号：US3507176A

公开(公告)日：1970-04-21

申请号：US3507176D

申请日：1968-05-31

Applicant: RICHARD G HUGHES ,  BARNABY CO THE

Inventor： HUGHES RICHARD G

IPC: B26D3/06 ,  H05K3/00 ,  B26D3/14 ,  B26D3/18

CPC classification number: B26D3/06 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0228 ,  Y10T83/0304 ,  Y10T83/768 ,  Y10T83/7726 ,  Y10T83/7793

公开(公告)号：US20240057256A1

公开(公告)日：2024-02-15

申请号：US18268867

申请日：2021-05-19

Applicant: JCET GROUP CO., LTD.

Inventor： Yaojian LIN ,  Chenye HE ,  Shuo LIU ,  Danfeng YANG ,  Li ZOU

IPC: H05K1/16 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34 ,  H05K3/28 ,  H05K3/10

CPC classification number: H05K1/165 ,  H05K1/144 ,  H05K1/111 ,  H05K3/3457 ,  H05K3/284 ,  H05K3/103 ,  H05K2203/041 ,  H05K2201/0715 ,  H05K2201/0909

Abstract: The present invention provides a package structure with an inductor and a manufacturing method thereof, the inductor and the interconnection component are used as n second package module, and stacked with other components such as the first package module to form a stack-like package structure. The first package module is provided with other electronic elements. Then the first and second package modules can be synchronously subjected to package manufacturing, which improves the production efficiency. Additionally, the soldering balls with different heights are formed on the first faces of the interconnecting structural component and the inductive device by adjusting the consumption of soldering paste, which make the second faces of the inductor and the interconnection component are coplanar, then inductor with different heights can form a flat interconnecting plane, which makes the sequential process such as pasting and mounting can be conveniently performed. The process is simplified, and the reliability of the package structure is improved.

公开(公告)号：US09839135B2

公开(公告)日：2017-12-05

申请号：US14332652

申请日：2014-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa ,  Mitsuhide Kato

IPC: H05K3/00 ,  H01G2/06 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/0052 ,  H01G2/065 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

公开(公告)号：US09805235B2

公开(公告)日：2017-10-31

申请号：US15483908

申请日：2017-04-10

Applicant: NEOLOGY, INC.

Inventor： James Robert Kruest ,  Gary Bann

IPC: G06K7/10

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: RFID tags are used for many purpose including tracking. RFID interrogators are used to retrieve information from tags. In many applications, a plurality of RFID interrogators are required. Synchronization between interrogators in the same theatre of operation is critical to ensure that their broadcasts do not interfere with each other. In fixed RFID interrogator applications, RFID interrogators can be wired together allowing a channel to synchronize the transmissions of the RFID interrogators. Methods described herein can ensure that synchronization is maintained in the event of the failure of a synchronizing master. Furthermore, additional methods for synchronizing RFID interrogators in wireless applications are described allowing synchronization in the absence of wired connections between interrogators.

公开(公告)号：US09801278B2

公开(公告)日：2017-10-24

申请号：US14686743

申请日：2015-04-14

Applicant: Samsung Display Co., Ltd.

Inventor： Jae Sok Lee ,  Seung Chang Woo

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/147 ,  H05K1/0292 ,  H05K1/189 ,  H05K2201/0909 ,  H05K2201/10128

Abstract: A curved display device and method for manufacturing the same is provided. The method for manufacturing a curved display device may include providing a display panel, a plurality of signal transfer elements, and a plurality of printed circuit boards, connecting one end of each of the signal transfer elements to the display panel and connecting the other end of each of the signal transfer elements to one of the printed circuit boards, on which one or more division guide portions are formed, dividing each of the printed circuit board into a plurality of sub printed circuit boards through cutting of the division guide portions; and bending the display panel connected to the sub printed circuit boards so that the display panel has a curvature.

公开(公告)号：US09736927B2

公开(公告)日：2017-08-15

申请号：US14875241

申请日：2015-10-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Suk Hyeon Cho ,  Yoong Oh ,  Young Gwan Ko ,  Yong Ho Baek ,  Young Kuk Ko

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0271 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/15788 ,  H05K1/038 ,  H05K1/115 ,  H05K1/181 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0909 ,  H05K2201/09536 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10674

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.

公开(公告)号：US09635765B2

公开(公告)日：2017-04-25

申请号：US14465127

申请日：2014-08-21

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi

IPC: H05K3/00 ,  H05K3/34

CPC classification number: H05K3/0097 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/3494 ,  H05K2201/0909 ,  H05K2201/10424 ,  Y10T29/49126

Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.

公开(公告)号：US09626619B2

公开(公告)日：2017-04-18

申请号：US15007079

申请日：2016-01-26

Applicant: NEOLOGY, INC.

Inventor： James Robert Kruest ,  Gary Bann

IPC: G06K7/10 ,  G06K19/077 ,  H04J3/06 ,  G06K7/00 ,  G06K19/07 ,  G06Q10/08 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: RFID tags are used for many purpose including tracking. RFID interrogators are used to retrieve information from tags. In many applications, a plurality of RFID interrogators are required. Synchronization between interrogators in the same theatre of operation is critical to ensure that their broadcasts do not interfere with each other. In fixed RFID interrogator applications, RFID interrogators can be wired together allowing a channel to synchronize the transmissions of the RFID interrogators. Methods described herein can ensure that synchronization is maintained in the event of the failure of a synchronizing master. Furthermore, additional methods for synchronizing RFID interrogators in wireless applications are described allowing synchronization in the absence of wired connections between interrogators.

公开(公告)号：US20170079137A1

公开(公告)日：2017-03-16

申请号：US15358241

申请日：2016-11-22

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yukio MAEDA ,  Masashi MATSUBARA ,  Daigo MATSUBARA ,  Masatoshi KARIYA

IPC: H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K1/18 ,  H05K3/22

CPC classification number: H05K1/0306 ,  H05K1/14 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/22 ,  H05K3/4629 ,  H05K2201/04 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/1126

Abstract: Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

Abstract translation: 提供了一种母体陶瓷基板，当分割成单独的基板（陶瓷基板）时，可以分割成分开的端面垂直于各个基板的主表面，并且可以提供高形状精度的陶瓷基板; 从母体陶瓷基板获得的单个陶瓷基板; 包括陶瓷基板的模块部件; 以及母体陶瓷基板的制造方法。 在可以在预定位置分割并分离成多个单独基板的母陶瓷基板中，在一侧的主表面上形成限定分割位置的分隔槽，并且在主表面上形成突出螺纹 在与母陶瓷基板的厚度方向一侧的主面的形成的分隔槽的位置对应的位置的另一侧。