公开(公告)号：US20170094810A1

公开(公告)日：2017-03-30

申请号：US15266624

申请日：2016-09-15

Applicant: Semblant Limited

Inventor： Gianfranco Aresta ,  Gareth Hennighan ,  Andrew Simon Hall Brooks ,  Shailendra Vikram Singh

IPC: H05K3/46 ,  C23C16/505 ,  H05K1/18

CPC classification number: H05K3/467 ,  C23C16/30 ,  C23C16/505 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/0104 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2203/095 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338

Abstract: An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

公开(公告)号：US09585245B2

公开(公告)日：2017-02-28

申请号：US15171510

申请日：2016-06-02

Applicant: VivaLnk, Inc.

Inventor： Jiang Li ,  Junfeng Mei

IPC: G06K7/08 ,  G06K19/06 ,  H05K1/02 ,  A61B5/00 ,  H04B1/3827 ,  H05K3/30 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0283 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6825 ,  A61B5/6828 ,  A61B5/6829 ,  A61B5/6833 ,  A61B2562/046 ,  H04B1/385 ,  H04B2001/3866 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1316

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Abstract translation: 电子贴片包括可折叠电路层，其包括可折叠网络，其包括：包括多个电子部件的多个电子模块和连接多个电子模块的柔性带，其中柔性带包括导电的导电电路 与多个电子模块中的多个电子部件连接。 相邻的电子模块可以垂直于可折叠电路层的相反方向波动。 电子贴片还包括包围可折叠电路层的弹性层。

公开(公告)号：US20160330837A1

公开(公告)日：2016-11-10

申请号：US15105350

申请日：2014-12-19

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

Inventor： Todd Prentice Coleman ,  Yun Soung Kim ,  Michael Bajema ,  Robert N. Weinreb

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/538 ,  H05K3/46 ,  H05K3/30 ,  H01L21/56 ,  H05K1/03 ,  H01L23/14 ,  H05K1/18

CPC classification number: H05K1/118 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/145 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/25175 ,  H01L2224/82005 ,  H01L2224/82051 ,  H01L2224/82106 ,  H01L2224/82951 ,  H01L2224/97 ,  H01L2933/0066 ,  H05K1/025 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/303 ,  H05K3/4644 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0173 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/467 ,  H01L2224/82

Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

Abstract translation: 公开了用于生产电子电路，设备和系统的高度可扩展的制造方法。 一方面，一种制造方法，包括在包括柔性和电绝缘材料的基板上的位置处附接电子部件; 形成模板以通过在相位上沉积材料以使电子部件和基板的表面相符合并使材料变为固体形式来包住电子部件; 以及通过在所述衬底中形成开口以暴露所述电子部件的导电部分来产生电路或电子器件，从而在所述衬底上以所选择的布置形成耦合到至少一些所述导电部分的电互连，以及沉积电绝缘层 以及在基板上的电互连上的柔性材料以形成电路的柔性基座，其中所生产的电路或电子设备被封装在该基板中。

公开(公告)号：US20160329903A1

公开(公告)日：2016-11-10

申请号：US15109857

申请日：2015-01-26

Applicant: Kazuhiko ADACHI ,  Kazuhiro HARASAKA ,  Akihiro ITOH

Inventor： Kazuhiko ADACHI ,  Kazuhiro HARASAKA ,  Akihiro ITOH

IPC: H03L7/26 ,  H01S5/00 ,  H01S5/183 ,  H01S5/024 ,  H05K1/02 ,  H05K1/11

CPC classification number: H03L7/26 ,  G04F5/14 ,  H01L23/345 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02453 ,  H01S5/183 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/10075 ,  H05K2201/10174 ,  H05K2201/2018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An atomic oscillator includes a gas cell and a plurality of components. The plurality of components includes a temperature control device for the gas cell; an excitation light source that emits excitation light to excite atoms enclosed in the gas cell; a temperature control device for the excitation light source; and a light receiving element that detects the excitation light that passes through the gas cell. The plurality of components is mounted on an insulating film having wiring.

Abstract translation: 原子振荡器包括气室和多个部件。 多个部件包括用于气室的温度控制装置; 激发光源，其发射激发光以激发包围在气室中的原子; 用于激发光源的温度控制装置; 以及检测通过气室的激发光的受光元件。 多个部件安装在具有布线的绝缘膜上。

公开(公告)号：US20160165719A1

公开(公告)日：2016-06-09

申请号：US14644183

申请日：2015-03-10

Applicant: VivaLnk Limited (Cayman Islands)

Inventor： Jiang Li ,  Junfeng Mei

IPC: H05K1/02 ,  H05K1/18 ,  H04B5/00 ,  A61B5/00 ,  H04B1/3827 ,  H05K1/03 ,  H05K1/14

CPC classification number: H05K1/0283 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6825 ,  A61B5/6828 ,  A61B5/6829 ,  A61B5/6833 ,  A61B2562/046 ,  H04B1/385 ,  H04B2001/3866 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1316

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Abstract translation: 电子贴片包括可折叠电路层，其包括可折叠网络，其包括：包括多个电子部件的多个电子模块和连接多个电子模块的柔性带，其中柔性带包括导电的导电电路 与多个电子模块中的多个电子部件连接。 相邻的电子模块可以在垂直于可折叠电路层的相反方向波动。 电子贴片还包括包围可折叠电路层的弹性层。

公开(公告)号：US20150357511A1

公开(公告)日：2015-12-10

申请号：US14792092

申请日：2015-07-06

Applicant: YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM

Inventor： Shlomo MAGDASSI ,  Michael GROUCHKO ,  Michael LAYANI

IPC: H01L31/18 ,  H01B1/10 ,  H05K3/12 ,  H05K1/03 ,  H05K1/09 ,  H01B1/02 ,  H01L31/0224

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Abstract translation: 本发明提供了用于制造导电透明膜的方法和包括其的电子或光电子器件。

公开(公告)号：US09146368B2

公开(公告)日：2015-09-29

申请号：US13600334

申请日：2012-08-31

Applicant: Seng-Kum Chan ,  David J. K. Meadowcroft

Inventor： Seng-Kum Chan ,  David J. K. Meadowcroft

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/00 ,  H05K7/20

CPC classification number: G02B6/428 ,  G02B6/4269 ,  H05K1/0209 ,  H05K7/2039 ,  H05K7/2049 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10174

Abstract: Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.

Abstract translation: 散热资源根据模块的电气和光电组件对温度的灵敏度在光通信模块中分配。 具有较高温度敏感性的组件比具有较低温度敏感性的组分分配更多的可用散热资源。 此外，分配给具有不同温度敏感度的部件的散热资源彼此热分解。

公开(公告)号：US20150262981A1

公开(公告)日：2015-09-17

申请号：US14216690

申请日：2014-03-17

Applicant: WENG F. YAP

Inventor： WENG F. YAP

IPC: H01L25/16 ,  H01L23/495 ,  H01L23/12 ,  H05K1/02 ,  H01L23/00 ,  H01L21/78 ,  H05K1/18 ,  H01L21/48 ,  H01L25/18

CPC classification number: H01L25/16 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/12 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174 ,  Y10T29/41 ,  Y10T29/49126 ,  Y10T29/49139 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.

Abstract translation: 提供了用于制造系统级封装（SiP）的方法的实施例，如SiP的实施例。 在一个实施例中，该方法包括产生包括具有侧壁的第一模制封装主体的第一封装。 第一引线框架嵌入在第一模制封装主体内并且具有通过侧壁暴露的第一引线框引线。 在某些实施方案中，半导体管芯也可以封装在第一模制封装体内。 表面贴装器件（SMD）安装在第一模制封装主体的侧壁上，使得SMD的第一端子与通过侧壁暴露的第一引线框引线欧姆接触。

公开(公告)号：US20150255889A1

公开(公告)日：2015-09-10

申请号：US14198960

申请日：2014-03-06

Applicant: Chicony Power Technology Co., Ltd.

Inventor： Hung-Jui CHANG ,  Yu-Jen LAI

IPC: H01R4/48 ,  H05K5/00 ,  H05K1/18

CPC classification number: H01R4/48 ,  H01R4/70 ,  H01R12/53 ,  H02S40/34 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/325 ,  H05K5/0026 ,  H05K2201/10174 ,  H05K2201/10295

Abstract: Disclosed are a solar junction box and a wire connecting structure of the solar junction box. The solar junction box includes plural first conductive tongues separately and perpendicularly plugged onto a printed circuit board, plural solar panel conducting plates combined to the first conductive tongues, and each solar panel conducting plate including an extension plate connected to a solar panel and a U-shaped snap-in plate bent and extended from the extension plate, and each U-shaped snap-in plate being snapped onto each first conductive tongue, plural insulators sheathed on the solar panel conducting plates, a pair of second conductive tongues separately and flatly attached onto a side of the printed circuit board, and two conducting terminals electrically connected to the pair of second conductive tongues. With the installation of the wire connecting structure, the volume of the solar junction box can be reduced to provide a stable electrical connection.

Abstract translation: 公开了太阳能接线盒和太阳能接线盒的导线连接结构。 太阳能接线盒包括分别并垂直地插入印刷电路板的多个第一导电舌片，与第一导电舌片组合的多个太阳能电池板导电板，并且每个太阳能电池板导电板包括连接到太阳能电池板的延伸板和U- 并且每个U形卡入板卡在每个第一导电舌片上，多个绝缘体套在太阳能电池板导电板上，一对第二导电舌片分开并平坦地连接 到印刷电路板的一侧，以及两个导电端子，电连接到该对第二导电舌片。 随着电线连接结构的安装，可以减少太阳能接线盒的体积，以提供稳定的电连接。

公开(公告)号：US20150237727A1

公开(公告)日：2015-08-20

申请号：US14625045

申请日：2015-02-18

Applicant: Semikron Elektronik GmbH & Co., KG

Inventor： Matthias Spang ,  Eduard Faller ,  Lars Reußer

IPC: H05K1/11 ,  H02M7/00

CPC classification number: H05K1/111 ,  H01L23/3735 ,  H01L23/49 ,  H01L23/5386 ,  H01L24/48 ,  H01L24/49 ,  H01L25/07 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/19107 ,  H02M7/003 ,  H05K2201/09236 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10174 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor module comprising internal load and auxiliary connection devices embodied as wire bonding connections. A substrate has a plurality of load and auxiliary potential areas, wherein a power switch is arranged on a first load potential area, said power switch being embodied as a plurality of controllable power subswitches arranged in series. The power subswitches have a load bonding connection consisting of a plurality of load bonding wires to a second load potential area, wherein a first bonding base is arranged on the second load potential area and an adjacent second bonding base of the respective load bonding wire is arranged on a contact area of the power subswitch.

Abstract translation: 一种功率半导体模块，包括实现为引线接合连接的内部负载和辅助连接装置。 基板具有多个负载和辅助电位区域，其中功率开关布置在第一负载电位区域上，所述功率开关被实施为串联布置的多个可控功率子开关。 功率子开关具有由多个负载接合线组成的负载接合连接到第二负载电位区域，其中第一接合基座布置在第二负载电位区域上，并且相应的负载接合线的相邻的第二接合基底被布置 在电源子开关的接触区域。