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    Compact radio equipment and method of mounting the same
    111.
    发明授权
    Compact radio equipment and method of mounting the same 有权
    小型无线电设备及其安装方法

    公开(公告)号：US07177161B2

    公开(公告)日：2007-02-13

    申请号：US10933226

    申请日：2004-09-03

    Applicant: Makoto Shima

    Inventor： Makoto Shima

    IPC: H05K9/00

    CPC classification number: H04B15/00 ,  H05K1/141 ,  H05K3/0061 ,  H05K9/0039 ,  H05K2201/10371

    Abstract: A compact radio equipment includes internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure. With this structure, a first metal shield frame is mounted on a first printed circuit board to cover components mounted on the first printed circuit board. A second printed circuit board is mounted on the first metal shield frame.

    Abstract translation: 紧凑型无线电设备包括彼此电连接并牢固地安装在结构上的两个或多个印刷电路板上的内部电路。 利用该结构，第一金属屏蔽框架安装在第一印刷电路板上以覆盖安装在第一印刷电路板上的部件。 第二印刷电路板安装在第一金属屏蔽框架上。

    Electronic package structures and methods
    112.
    发明申请
    Electronic package structures and methods 有权
    电子封装结构和方法

    公开(公告)号：US20060273447A1

    公开(公告)日：2006-12-07

    申请号：US11345147

    申请日：2006-01-31

    Applicant: Roy Buck ,  Joseph Bergeron

    Inventor： Roy Buck ,  Joseph Bergeron

    IPC: H01L23/053

    CPC classification number: H05K3/3405 ,  H01L24/16 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2203/0173 ,  H05K2203/1572

    Abstract: Electronics packages are provided with structure that provides a significantly-reduced package footprint and also facilitates substantial reduction of package fabrication time and cost. The footprint reduction is realized with a frame that defines an aperture wall which surrounds first sets of components on the first side of a printed circuit board and also extends away from the printed circuit board to provide package input/output access along the perimeter of the package footprint. The second side of the printed circuit board receives a second set of components and this set is protected by a board fill. The frame and printed circuit board are configured for realization from frame and board panels whose planar forms substantially reduce package fabrication time and cost because they facilitate the use of modern high-speed printed circuit board (PCB) fabrication processes.

    Abstract translation: 电子封装具有提供显着减小的封装占地面积的结构，并且还有助于显着减少封装制造时间和成本。 通过框架来实现占地面积减小，该框架限定了围绕印刷电路板的第一侧上的第一组元件的孔壁，并且还延伸离开印刷电路板，以沿着封装的周边提供封装输入/输出访问 脚印。 印刷电路板的第二面接收第二组组件，并且该组由板填充保护。 框架和印刷电路板被配置为从框架和板面板实现，其平面形式基本上减少了封装制造时间和成本，因为它们有助于使用现代高速印刷电路板（PCB）制造工艺。

    Semiconductor device with a solder creep-up prevention zone
    113.
    发明授权
    Semiconductor device with a solder creep-up prevention zone 失效
    具有焊料防蠕变区域的半导体器件

    公开(公告)号：US07145230B2

    公开(公告)日：2006-12-05

    申请号：US11024597

    申请日：2004-12-30

    Applicant: Futoshi Hosoya

    Inventor： Futoshi Hosoya

    IPC: H01L23/043 ,  H01L23/10 ,  H01L23/12 ,  H01L23/06 ,  H01L23/04

    CPC classification number: H01L23/492 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00

    Abstract: The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal package base has, in a portion thereof ranging from the opened side end portion of the inner side wall to the semiconductor chip, a creep-up preventive zone preventing solder entering from the opened side end portion from creeping up. The device makes it possible to solve problems which have been apprehended for conventional semiconductor devices configured as mounting a semiconductor chip on a small semiconductor package, in that reduction in distance between external terminal portions of the metal package and the semiconductor chip results in contact of a solder for mounting with the semiconductor chip to thereby adversely affect the electrical properties and reliability thereof, and in that resin filling or partial plating for avoiding intrusion of the solder raises the cost.

    Abstract translation: 本发明提供了一种半导体器件，其包括U形金属封装基座和至少具有表面电极并且安装在U形金属封装基座的内底部的半导体芯片，其中金属封装基座具有， 在从内侧壁的开放侧端部到半导体芯片的一部分中，防止从开口侧端部进入的焊料的蠕变防止区域爬行。 该装置使得可以解决已经被配置为将半导体芯片安装在小型半导体封装上的常规半导体器件所理解的问题，因为金属封装的外部端子部分与半导体芯片之间的距离的减小导致接触 用于与半导体芯片一起安装的焊料，从而不利地影响其电性能和可靠性，并且为了避免焊料侵入的树脂填充或部分电镀增加了成本。

    Electrical connector
    115.
    发明授权
    Electrical connector 有权
    电连接器

    公开(公告)号：US07138584B1

    公开(公告)日：2006-11-21

    申请号：US11399318

    申请日：2006-04-07

    Applicant: Ted Ju

    Inventor： Ted Ju

    IPC: H05K9/00

    CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

    Abstract: An electrical connector is disclosed to include an electrically insulative housing, which houses a plurality of metal contact pins, each metal contact pin having a bottom bonding face protruding over the bottom side of the housing, a metal shield, which is coupled to the housing and has two bonding portions at two sides, and a bonding adjustment architecture provided between the metal shield and the housing for allowing vertical movement of the metal shield relative to the housing to adjust the elevation of the bonding portions so that the bonding portions and the bonding face of each metal contact pin can be positively bonded to a circuit board by SMT.

    Abstract translation: 公开了一种电连接器，其包括电绝缘壳体，其容纳多个金属接触销，每个金属接触销具有在壳体的底侧上突出的底部接合面，金属屏蔽，其联接到壳体和 在两侧具有两个接合部分，并且设置在金属屏蔽件和壳体之间的接合调整结构，用于允许金属屏蔽件相对于壳体的垂直移动，以调节接合部分的高度，使得接合部分和接合面 每个金属接触销可以通过SMT积极地结合到电路板。

    EMI shielding package and method for making the same
    116.
    发明申请
    EMI shielding package and method for making the same 有权
    EMI屏蔽封装及其制作方法

    公开(公告)号：US20060221591A1

    公开(公告)日：2006-10-05

    申请号：US11322870

    申请日：2005-12-30

    Applicant: Xiao-Hua Kong

    Inventor： Xiao-Hua Kong

    IPC: H05K9/00

    CPC classification number: H05K9/0026 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0969 ,  H05K2201/10371 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: An exemplary Electromagnetic Interference (EMI) shielding package (1) includes a substrate (10), a metal cap (15), and a potting compound (18). The substrate has a plurality of electronic components (11a, 11b, 12) fixed thereon. The metal cap includes a horizontal base panel (152) and a plurality of peripheral walls (151) vertical to the base panel. A related method for making the EMI shielding package includes: providing a substrate with a plurality of electronic components fixed thereon; providing a metal cap including a horizontal base panel and a plurality of peripheral walls vertical to the base panel; attaching the walls to the substrate, thereby covering selected one or more of the electronic components that need to be shielded with the metal cap; sealing the electronic components and the metal cap with a potting compound; and curing the potting compound to form an encapsulation.

    Abstract translation: 示例性电磁干扰（EMI）屏蔽封装（1）包括衬底（10），金属帽（15）和灌封化合物（18）。 基板具有固定在其上的多个电子部件（11a，11b，12）。 金属盖包括垂直于基板的水平基板（152）和多个周壁（151）。 制造EMI屏蔽封装的相关方法包括：提供固定有多个电子部件的基板; 提供包括水平基板和垂直于所述基板的多个周壁的金属盖; 将壁附接到基板，从而覆盖需要被金属盖屏蔽的所选择的一个或多个电子部件; 用灌封胶密封电子元件和金属盖; 并固化灌封化合物以形成封装。

    Semiconductor device
    118.
    发明申请
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US20050161802A1

    公开(公告)日：2005-07-28

    申请号：US11024597

    申请日：2004-12-30

    Applicant: Futoshi Hosoya

    Inventor： Futoshi Hosoya

    IPC: H01L23/12 ,  H01L21/60 ,  H01L23/02 ,  H01L23/492 ,  H01L23/495 ,  H05K3/34

    CPC classification number: H01L23/492 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00

    Abstract: The present invention provides a semiconductor device which comprises a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal package base has, in a portion thereof ranging from the opened side end portion of the inner side wall to the semiconductor chip, a creep-up preventive zone preventing solder entering from the opened side end portion from creeping up. The device makes it possible to solve problems which have been apprehended for conventional semiconductor devices configured as mounting a semiconductor chip on a small semiconductor package, in that reduction in distance between external terminal portions of the metal package and the semiconductor chip results in contact of a solder for mounting with the semiconductor chip to thereby adversely affect the electrical properties and reliability thereof, and in that resin filling or partial plating for avoiding intrusion of the solder raises the cost.

    Abstract translation: 本发明提供一种半导体器件，其包括U形金属封装基座和至少具有表面电极并安装在U形金属封装基座的内底部的半导体芯片，其中金属封装基座具有， 在从内侧壁的开放侧端部到半导体芯片的一部分中，防止从开口侧端部进入的焊料的蠕变防止区域爬行。 该装置使得可以解决已经被配置为将半导体芯片安装在小型半导体封装上的常规半导体器件所理解的问题，因为金属封装的外部端子部分与半导体芯片之间的距离的减小导致接触 用于与半导体芯片一起安装的焊料，从而不利地影响其电性能和可靠性，并且为了避免焊料侵入的树脂填充或部分电镀增加了成本。

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