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公开(公告)号：US09655229B2
公开(公告)日：2017-05-16
申请号：US14938900
申请日：2015-11-12
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2924/15311 , H05K1/0203 , H05K1/0207 , H05K1/0231 , H05K1/185 , H05K3/445 , H05K3/4602 , H05K3/4608 , H05K2201/0323 , H05K2201/09136 , H05K2201/10015 , H05K2201/10416 , H05K2201/10636 , Y02P70/611
Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.
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公开(公告)号：US09641254B1
公开(公告)日：2017-05-02
申请号：US14678230
申请日：2015-04-03
Applicant: Google Inc.
Inventor： Zuowei Shen , Kyle Fukuchi , Melanie Beauchemin , Ryohei Urata
CPC classification number: H05K1/0206 , B23K26/381 , G02B6/00 , G02B6/32 , G02B6/42 , G02B6/4204 , G02B6/4246 , G02B6/4269 , G02B6/428 , H01S5/0261 , H04B10/40 , H04B10/801 , H05K1/0274 , H05K1/18 , H05K3/061 , H05K3/32 , H05K3/4038 , H05K2201/10121 , H05K2201/10416
Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.
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公开(公告)号：US20170086293A1
公开(公告)日：2017-03-23
申请号：US14932974
申请日：2015-11-05
Applicant: Subtron Technology Co., Ltd.
Inventor： Chih-Hsien Cheng
CPC classification number: H01L23/13 , H01L23/3677 , H01L23/49822 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K1/0204 , H05K3/022 , H05K3/427 , H05K2201/10416 , H05K2203/0191 , H01L2924/00014
Abstract: A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.
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公开(公告)号：US09596747B2
公开(公告)日：2017-03-14
申请号：US14233984
申请日：2012-06-29
Applicant: Hiroshi Kawagoe , Kazuhiko Yagi
Inventor： Hiroshi Kawagoe , Kazuhiko Yagi
IPC: H05K1/02 , H01L23/367 , H01L23/498 , H05K7/20 , H01L23/495 , H01L23/31 , H01L33/64 , H05K3/24 , H01L23/00
CPC classification number: H05K1/0209 , H01L23/3107 , H01L23/3677 , H01L23/498 , H01L23/49844 , H01L24/73 , H01L33/641 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48644 , H01L2224/48655 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H05K1/0204 , H05K3/246 , H05K2201/10416 , H01L2924/00 , H01L2924/00012
Abstract: A wiring substrate in which a plating layer is sufficiently plated on a surface metal layer and which has an excellent reliability is provided. A wiring substrate includes an insulating base; a heat dissipation member disposed in the insulating base, the heat dissipation member partially exposed from the insulating base, the heat dissipation member containing Cu; a surface metal layer disposed on a surface of the insulating base, the surface metal layer contacting and covering the heat dissipation member, the surface metal layer containing Mo as a main component, the surface metal layer including a surface portion containing Cu; and a plating layer disposed on the surface metal layer, wherein Cu contained in the heat dissipation member and Cu contained in the surface portion are bonded to each other.
Abstract translation: 提供了在表面金属层上充分镀覆镀层并具有优异的可靠性的布线基板。 布线基板包括绝缘基底; 所述散热构件设置在所述绝缘基座中，所述散热构件部分地从所述绝缘基底露出，所述散热构件包含Cu; 表面金属层，其设置在所述绝缘基材的表面上，所述表面金属层与所述散热构件接触并覆盖，所述表面金属层包含以Mo为主要成分的所述表面金属层，所述表面金属层包括含有Cu的表面部分; 以及设置在表面金属层上的镀层，其中包含在散热构件中的Cu和表面部分中包含的Cu彼此结合。
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115.发明授权Solder wettable flanges and devices and systems incorporating solder wettable flanges 有权焊接可润湿法兰和装有焊接可湿性法兰的装置和系统公开(公告)号：US09538659B2
公开(公告)日：2017-01-03
申请号：US13972838
申请日：2013-08-21
Applicant: Lakshminarayan Viswanathan , Jaynal A. Molla , Mahesh K. Shah
Inventor： Lakshminarayan Viswanathan , Jaynal A. Molla , Mahesh K. Shah
CPC classification number: H05K1/181 , B23K1/20 , H01L2224/48091 , H01L2924/19107 , H05K1/056 , H05K1/141 , H05K2201/10015 , H05K2201/10166 , H05K2201/10416 , H05K2201/10553 , H05K2203/1173 , Y02P70/611 , Y10T29/49144 , Y10T428/12389 , H01L2924/00014
Abstract: An embodiment of a solder wettable flange includes a flange body formed from a conductive material. The flange body has a bottom surface, a top surface, sidewalls extending between the top surface and the bottom surface, and one or more depressions extending into the flange body from the bottom surface. Each depression is defined by a depression surface that may or may not be solder wettable. During solder attachment of the flange to a substrate, the depressions may function as reservoirs for excess solder. Embodiments also include devices and systems that include such solder wettable flanges, and methods for forming the solder wettable flanges, devices, and systems.
Abstract translation: 焊料可润湿凸缘的实施例包括由导电材料形成的凸缘体。 凸缘体具有底表面，顶表面，在顶表面和底表面之间延伸的侧壁以及从底表面延伸到凸缘体中的一个或多个凹陷。 每个凹陷由凹陷表面限定，凹陷表面可以或可以不是可焊料润湿的。 在将凸缘焊接到基板期间，凹陷可以用作多余焊料的储存器。 实施例还包括包括这种焊料可润湿凸缘的装置和系统，以及用于形成焊料可润湿凸缘，装置和系统的方法。
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Patent Agency Ranking
公开(公告)号：US20160366757A1
公开(公告)日：2016-12-15
申请号：US15175732
申请日：2016-06-07
Inventor： Tomoyoshi Kobayashi , Masato Kasashima , Koichi Suzuki
CPC classification number: H05K1/0204 , H05K1/0298 , H05K1/111 , H05K1/115 , H05K1/181 , H05K2201/10015 , H05K2201/10166 , H05K2201/10409 , H05K2201/10416 , Y02P70/611
Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.
Abstract translation: 印刷电路板包括：第一绝缘层，其具有用于电子部件的安装区域和设置在上表面上的布线图案;第二绝缘层，设置成与第一绝缘层的下表面接触;以及金属芯体， 在第二绝缘层中，以便垂直地重叠安装区域。 通过冲压金属板将金属芯形成为预定的形状。 与金属芯的厚度方向正交的一个外表面是具有在其边缘处形成的弯曲部分并且与第一绝缘层的下表面接触的突出表面。 与金属芯的厚度方向正交的另一个外表面是具有在其边缘处形成的突出部分的凹陷表面，并且从第二绝缘层的下表面露出。
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公开(公告)号：US09504138B2
公开(公告)日：2016-11-22
申请号：US14446289
申请日：2014-07-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hoon Kim , Jin-Hyuk Lee
CPC classification number: H05K1/0207 , H01L23/36 , H01L23/52 , H01L2224/16225 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H05K1/0206 , H05K1/0209 , H05K1/181 , H05K2201/10159 , H05K2201/10371 , H05K2201/10416 , H01L2924/00
Abstract: Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer. A case may accommodate the circuit board. The case may have a projection portion that is configured to come in contact with the circuit board in the contact region. The plurality of inner layers may include a ground layer. The first outer layer may be connected to the ground layer through a via-hole. The case may be connected to the ground layer through the first outer layer.
Abstract translation: 本发明构思的实施例包括具有电路板的半导体器件，该电路板包括第一外层，第一外层中的接触区域，形成在第一外层的相对侧上的第二层，通孔和多个 的内层被形成为堆叠在第一层和第二层之间。 一个案例可以容纳电路板。 壳体可以具有突出部分，其被配置为在接触区域中与电路板接触。 多个内层可以包括接地层。 第一外层可以通过通孔连接到接地层。 壳体可以通过第一外层连接到接地层。
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公开(公告)号：US20160309575A1
公开(公告)日：2016-10-20
申请号：US15198110
申请日：2016-06-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Myung Sam KANG , Jung Han LEE , Young Gwan KO
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/2518 , H01L2924/15311 , H01L2924/3511 , H05K1/0204 , H05K1/0207 , H05K1/0209 , H05K1/0298 , H05K1/111 , H05K1/181 , H05K1/185 , H05K3/4602 , H05K3/4608 , H05K2201/0195 , H05K2201/0323 , H05K2201/0338 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10416 , H05K2201/10674 , H05K2201/10727
Abstract: A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.
Abstract translation: 电路板包括绝缘部分，其包括绝缘层，设置在绝缘层上的金属层，每个穿过绝缘层中的至少一个绝缘层的通孔，并将金属层中的至少两个金属层连接在一起; 包括导热材料的第一导热结构，所述导热结构的至少一部分插入到所述绝缘部分中，具有与所述第一导热结构接触的一个表面的第一通孔，第一金属图案与所述第一导热结构的第一 通孔，连接到第一金属图案的第一接合构件以及在布置在绝缘部分的最外表面上的金属层的最外表面上连接有第一电子部件的焊盘，所述焊盘至少在第一区域中 以及具有比第一区域更高的温度的第二区域。
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公开(公告)号：US09408295B2
公开(公告)日：2016-08-02
申请号：US14701792
申请日：2015-05-01
Applicant: NGK Insulators, Ltd.
Inventor： Shinsuke Yano , Makoto Tani , Hirokazu Nakanishi
CPC classification number: H05K1/0207 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/16245 , H01L2933/0066 , H05K1/0204 , H05K1/0209 , H05K1/053 , H05K2201/0137 , H05K2201/062 , H05K2201/068 , H05K2201/10106 , H05K2201/10416 , H05K2203/1126
Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.
Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过实现低热阻作为整个基板的总热阻而可以显示出高散热能力而不降低基板的绝缘可靠性和高湿度可靠性的发光二极管的基板。
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公开(公告)号：US09402300B2
公开(公告)日：2016-07-26
申请号：US14701730
申请日：2015-05-01
Applicant: NGK Insulators, Ltd.
Inventor： Shinsuke Yano , Makoto Tani , Hirokazu Nakanishi
CPC classification number: H05K1/0203 , H01L33/486 , H01L33/62 , H01L33/641 , H01L2924/0002 , H01L2933/0066 , H05K1/0204 , H05K1/0209 , H05K1/0298 , H05K1/053 , H05K2201/062 , H05K2201/068 , H05K2201/10106 , H05K2201/10416 , H05K2203/1126 , H01L2924/00
Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.
Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过在不降低基板的绝缘可靠性和高湿度可靠性的情况下实现作为整个基板的总热阻的低热阻而能够显示高散热能力的发光二极管的基板。
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