公开(公告)号：US07188410B2

公开(公告)日：2007-03-13

申请号：US10991064

申请日：2004-11-17

Applicant: Timothy Wayne Crockett ,  Harry Thomas Minikel

Inventor： Timothy Wayne Crockett ,  Harry Thomas Minikel

IPC: H05K3/30

CPC classification number: H05K1/0231 ,  H05K1/0298 ,  H05K1/145 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10583 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/53187

Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

Abstract translation: 一种用于减小参考路径内的阻抗和/或节省印刷电路板内的空间的印刷电路板和方法。 在本发明的一个实施例中，印刷电路板包括多个导电层。 印刷电路板还包括用于互连两个或更多个导电层的两个或更多个通孔。 印刷电路板还包括嵌入在两个导电层之间的特定通孔中的电气部件，以减小参考路径内的阻抗和/或节省印刷电路板内的空间。

公开(公告)号：US20070049130A1

公开(公告)日：2007-03-01

申请号：US11510591

申请日：2006-08-28

Applicant: Toshiya Kojima ,  Gentaro Furukawa

Inventor： Toshiya Kojima ,  Gentaro Furukawa

IPC: H01R13/40

CPC classification number: H05K3/06 ,  B41J2/14233 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/18 ,  H05K1/0265 ,  H05K3/041 ,  H05K3/061 ,  H05K3/107 ,  H05K3/244 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09236 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/1527

Abstract: The wiring substrate comprises: a recess section and a projecting section formed on at least one surface of the wiring substrate; and wires formed on both the recess section and the projecting section.

Abstract translation: 布线基板包括：形成在布线基板的至少一个表面上的凹部和突出部; 以及形成在所述凹部和所述突出部两者上的线。

公开(公告)号：US07183650B2

公开(公告)日：2007-02-27

申请号：US10483175

申请日：2002-07-12

Applicant: Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigoro Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Sato ,  Takao Miwa ,  Shigehisa Motowaki

Inventor： Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigoro Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Sato ,  Takao Miwa ,  Shigehisa Motowaki

IPC: H01L23/21 ,  H01L23/053

CPC classification number: H05K3/4061 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/426 ,  H05K2201/0116 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09981 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.

Abstract translation: 布线玻璃基板包括由玻璃形成的玻璃基板，在预定位置形成有多个孔，凸起形成为与填充孔的导电材料连接，形成在与形成有凸点的表面相对的表面上的布线 并且将与间隔不同的间隔布置的多个连接端子电连接到导电材料上。 导电材料的形状是多孔的，并且多孔电极通过锚固效应结合到孔的内壁表面，以增加玻璃基底的强度。

公开(公告)号：US20060223345A1

公开(公告)日：2006-10-05

申请号：US11423767

申请日：2006-06-13

Applicant: Thomas Dozier ,  Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu ,  David Pedersen ,  Michael Stadt

Inventor： Thomas Dozier ,  Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu ,  David Pedersen ,  Michael Stadt

IPC: H01R12/00

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract translation: 从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子 抵抗弹簧接触元件的端部。 公开了各种终端配置。

公开(公告)号：US20060084288A1

公开(公告)日：2006-04-20

申请号：US10969369

申请日：2004-10-19

Applicant: Ping Chuang ,  Li-Sen Chen ,  Chien-Yu Hsu

Inventor： Ping Chuang ,  Li-Sen Chen ,  Chien-Yu Hsu

IPC: H01R12/00

CPC classification number: H05K3/326 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10378

Abstract: An LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD. The through-holes have a funnel-like shape to absorb external stresses and redirect the stress to shrink the through-hole diameters. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.

Abstract translation: LGA连接器用于连接LGA封装和印刷电路板。 LGA连接器包括具有多个通孔的弹性体。 金属膜形成在通孔的内壁上，并在其上部和下部开口的嘴部周围张开。 金属膜通过真空金属化，溅射，化学镀，电镀或PVD形成。 通孔具有漏斗形形状以吸收外部应力并且重定向应力以收缩通孔直径。 此外，金属膜的弹性变形大于常规金属导电填料，从而提高可靠性。

公开(公告)号：US07012017B2

公开(公告)日：2006-03-14

申请号：US10791966

申请日：2004-03-03

Applicant: Dennis M. Brunner ,  David L. Buster ,  Michael S. Graff ,  Daniel K. Luebbert ,  Nathan P. Kreutter ,  Rui Yang ,  Guoping Mao

Inventor： Dennis M. Brunner ,  David L. Buster ,  Michael S. Graff ,  Daniel K. Luebbert ,  Nathan P. Kreutter ,  Rui Yang ,  Guoping Mao

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/302

CPC classification number: H01L24/10 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/002 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/0369 ,  H01L2924/00

Abstract: Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.

Abstract translation: 提供了具有凸起导电特征的部分蚀刻的电介质膜。 还提供了用于在介电膜中形成凸起的导电特征的方法，该方法包括部分蚀刻介电膜。

公开(公告)号：US20060032670A1

公开(公告)日：2006-02-16

申请号：US10917978

申请日：2004-08-13

Applicant: Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

Inventor： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

IPC: H05K1/14

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

Abstract translation: 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US06984915B2

公开(公告)日：2006-01-10

申请号：US10348788

申请日：2003-01-22

Applicant: Jack T. Galyean

Inventor： Jack T. Galyean

IPC: H01R39/08

CPC classification number: H01R12/526 ,  H01R39/10 ,  H05K3/107 ,  H05K3/181 ,  H05K3/244 ,  H05K3/4623 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  Y10T29/49009 ,  Y10T29/49011 ,  Y10T29/53143

Abstract: A slip ring and a method for manufacturing a slip ring utilizes a first double clad copper laminate with a first side and a second side separated by a first dielectric and a second double clad copper laminate with a third side and a fourth side separated by a second dielectric. Copper is selectively removed from the second and third sides to provide desired patterns in the copper. The second and third sides are joined in a desired orientation. Substantially, all of the copper from a window in the first and fourth sides is removed to expose the first and second dielectrics. A plurality of concentric grooves is machined into the first and second dielectrics from the first and fourth sides and the concentric grooves are metalized to provide a plurality of concentric metalized rings.

公开(公告)号：US20050208708A1

公开(公告)日：2005-09-22

申请号：US10801894

申请日：2004-03-16

Applicant: Jinbao Jiao ,  Kevin Moore ,  Thomas Gall ,  William Weigler

Inventor： Jinbao Jiao ,  Kevin Moore ,  Thomas Gall ,  William Weigler

IPC: H01L21/44 ,  H05K3/00 ,  H05K3/12 ,  H05K3/38

CPC classification number: H05K3/0061 ,  H05K3/1225 ,  H05K3/386 ,  H05K2201/09827 ,  H05K2201/09909

Abstract: An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.

Abstract translation: 一种用于将印刷电路板固定到基底的粘合剂组件的装置和方法。 该组件提供具有通过其限定的多个孔的印刷工具。 优选地，孔具有比底部开口更大的面积的顶部开口。 印刷工具放置在印刷电路板和/或基板之一上，并将液体粘合剂印刷到印刷工具上。 液体粘合剂在每个孔内形成粘合剂岛。 移除打印工具使每个岛变形，以在每个岛的周边形成凸起的边缘。 可以将临时衬垫放置在凸起边缘上以保护粘合剂，直到印刷电路板可以与衬底组装在一起。

公开(公告)号：US20050133918A1

公开(公告)日：2005-06-23

申请号：US10740957

申请日：2003-12-17

Applicant: Todd Myers ,  Nicholas Watts ,  Eric Palmer ,  Renee Defeo ,  Jui Lim

Inventor： Todd Myers ,  Nicholas Watts ,  Eric Palmer ,  Renee Defeo ,  Jui Lim

IPC: H01L23/02 ,  H01L23/498 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/064 ,  H05K3/403 ,  H05K3/4644 ,  H05K2201/09645 ,  H05K2201/09827 ,  H01L2924/00

Abstract: A system includes a device having at least one integrated circuit. The integrated circuit further includes a first layer of conductive material, a second layer of conductive material, and a via having multiple electrical paths for interconnecting the first layer of conductive material and the second layer of conductive material. A method for forming a via includes drilling an opening to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

Abstract translation: 一种系统包括具有至少一个集成电路的装置。 集成电路还包括第一导电材料层，第二导电材料层，以及具有用于互连导电材料的第一层和第二导电材料层的多条电路的通路。 用于形成通孔的方法包括将开口钻出一定深度以露出第一垫和第二垫，用导电材料衬套开口，并将开口中的衬里的第一部分与衬里的第二部分绝缘 所述开口形成接触所述第一焊盘的第一电路径和与所述第二焊盘接触的第二电路径。