公开(公告)号：US20090091897A1

公开(公告)日：2009-04-09

申请号：US12114255

申请日：2008-05-02

Applicant: Steven Lee WILLING ,  Kent CARLSON ,  Robert E. CAMPBELL ,  Alberto AVENDANO

Inventor： Steven Lee WILLING ,  Kent CARLSON ,  Robert E. CAMPBELL ,  Alberto AVENDANO

IPC: H05K7/00

CPC classification number: H05K1/0263 ,  H02M7/003 ,  H05K2201/09954 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/2018

Abstract: The present invention relates, generally, to electrical power conversion devices and to the universal packaging of those devices for a wide range of applications yielding cost efficient inventory management of product lines consisting of a group of power conversion devices each with minor variations. More specifically, the present invention relates to a universal mounting frame for receiving a printed circuit board in a switch mode power supply. The universal frame is adapted for receiving an open frame or printed circuit board and securing the open frame within a plurality of known packaging configurations. To this end, only a single size printed circuit board is necessary for any type of switch mode power supply configurations, thereby, reducing costs associated with manufacture and testing.

Abstract translation: 本发明一般涉及电力转换装置以及用于各种应用的这些装置的通用封装，从而对由各种各样的变化的一组电力转换装置组成的产品线进行成本效益的库存管理。 更具体地，本发明涉及一种用于在开关模式电源中接收印刷电路板的通用安装框架。 通用框架适于接收开放框架或印刷电路板，并将开放框架固定在多个已知的包装结构内。 为此，对于任何类型的开关模式电源配置，仅需要单一尺寸的印刷电路板，从而降低与制造和测试相关的成本。

公开(公告)号：US20090086561A1

公开(公告)日：2009-04-02

申请号：US11952140

申请日：2007-12-07

Applicant: SHOU-KUO HSU ,  DUEN-YI HO ,  CHENG-SHIEN LI

Inventor： SHOU-KUO HSU ,  DUEN-YI HO ,  CHENG-SHIEN LI

IPC: G11C5/14 ,  H05K1/11

CPC classification number: G06F1/26 ,  G11C5/04 ,  G11C5/147 ,  H05K1/0262 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/09954 ,  H05K2201/10159

Abstract: An exemplary motherboard includes a driving module, a first slot module arranged for mounting a first type of memory and connected to the driving module via a first channel, a second slot module arranged for mounting a second type of memory and connected to the driving module via a second channel, and a voltage regulator electronically connected to the first slot module and the second slot module. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly.

Abstract translation: 示例性主板包括驱动模块，布置成用于安装第一类型存储器并经由第一通道连接到驱动模块的第一插槽模块，布置成用于安装第二类型存储器并连接到驱动模块的第二插槽模块，其经由 第二通道和电连接到第一插槽模块和第二插槽模块的电压调节器。 第一存储器和第二存储器替代地安装在母板上，电压调节器检测当前安装在母板上的哪种类型的存储器，并相应地输出适合安装在母板上的存储器类型的电压。

公开(公告)号：US07511966B2

公开(公告)日：2009-03-31

申请号：US11976150

申请日：2007-10-22

Applicant: Norikuni Noguchi

Inventor： Norikuni Noguchi

IPC: H05K7/10

CPC classification number: H05K1/111 ,  H05K1/0203 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/611

Abstract: According to one embodiment, first to fourth pads are arranged on a surface mounting area of a printed circuit board along one side of the mounting area, with a preset gap defined between each pair of adjacent ones of the pads. The first to third pads form a first land, and the second to fourth pads form a second land. When a first three-terminal regulator IC is mounted on the first land, a radiator-side terminal pin incorporated in the regulator IC is connected to a first radiator pad and a common radiator pad. When a second three-terminal regulator IC is mounted on the second land, a radiator-side terminal pin incorporated in the regulator IC is connected to a second radiator pad and the common radiator pad.

Abstract translation: 根据一个实施例，第一至第四焊盘沿着安装区域的一侧布置在印刷电路板的表面安装区域上，在每对相邻焊盘之间限定预设间隙。 第一至第三焊盘形成第一焊盘，第二焊盘形成第二焊盘。 当在第一焊盘上安装第一三端稳压器IC时，将并入调节器IC的散热器侧端子引脚连接到第一散热器焊盘和公共散热器焊盘。 当在第二平台上安装第二三端子稳压器IC时，并入调节器IC中的散热器侧端子引脚连接到第二散热器焊盘和公用散热器焊盘。

公开(公告)号：US20090073655A1

公开(公告)日：2009-03-19

申请号：US12119439

申请日：2008-05-12

Applicant: Masahiko Takakusaki ,  Minoru Enomoto

Inventor： Masahiko Takakusaki ,  Minoru Enomoto

IPC: G06F1/20 ,  H05K1/14 ,  H05K7/20 ,  G06F1/18 ,  H05K5/00

CPC classification number: H05K1/141 ,  G06F1/1616 ,  G06F1/1658 ,  G06F1/185 ,  G06F1/203 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract translation: 电子设备包括：壳体; 住在房屋中的主板; 容纳在壳体中的第一个子板; 容纳在壳体中的第二子板; 安装在主板上的主机控制器; 桥式控制器，其安装在第一子板上并电连接到主机控制器; 安装在第一子板上并电连接到桥接控制器的第一芯片; 以及安装在第二子板上并电连接到桥接控制器的第二芯片。

公开(公告)号：US20090040450A1

公开(公告)日：2009-02-12

申请号：US12162810

申请日：2006-11-15

Applicant: Hiroaki Nakaminami

Inventor： Hiroaki Nakaminami

IPC: G02F1/1343 ,  H01R9/00

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G02F2201/50 ,  G02F2202/22 ,  H05K1/0254 ,  H05K1/111 ,  H05K1/14 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/099 ,  H05K2201/09954 ,  H05K2201/10136 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2203/0191

Abstract: A circuit board capable of preventing driver ICs and electronic and electrical components from being affected by static electricity, a liquid crystal display module having the same, and a display device having the same. The liquid crystal display module includes a liquid crystal display panel, gate side common circuit boards including FPC connector bonding lands placed at both ends in longitudinal directions of the gate side common circuit boards, and source side common circuit boards, wherein the FPC connector bonding lands adjacent to the source side common circuit boards are mounted with FPC connectors and are electrically connected with the source side common circuit boards, and surfaces of the FPC connector bonding lands placed at the other ends are covered with an electrical insulating coating.

Abstract translation: 能够防止驱动IC和电子电气部件受静电影响的电路板，具有该电路板的液晶显示模块和具有该电路板的显示装置。 液晶显示模块包括液晶显示面板，栅极侧公共电路板，栅极侧公共电路基板，栅极侧公共电路基板的长度方向的两端侧的FPC连接器接合焊盘以及源极侧公共电路基板， 与源极侧公共电路板相邻地安装有FPC连接器并与源极公共电路板电连接，并且在另一端放置的FPC连接器接合面的表面被电绝缘涂层覆盖。

公开(公告)号：US20080316118A1

公开(公告)日：2008-12-25

申请号：US11884991

申请日：2006-03-15

Applicant: Carles Puente Baliarda ,  Jaime Anguera Pros

Inventor： Carles Puente Baliarda ,  Jaime Anguera Pros

IPC: H01Q1/38 ,  H01Q1/24

CPC classification number: H01Q9/0421 ,  H01Q13/10 ,  H01Q13/103 ,  H05K1/023 ,  H05K1/025 ,  H05K1/0295 ,  H05K3/222 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2203/171 ,  H05K2203/173 ,  Y02P70/611

Abstract: The invention refers to a member (1) for a wireless device, wherein that member (1) is or comprises a ground-plane (2, 3) with at least two portions (2, 3), wherein on each of said portions (2, 3) at least one connecting means such as a pad (4, 5) is provided, wherein the two connecting means (4, 5) can be connected with an electric component (10) for connecting said two portions (2, 3) of said ground plane. The invention further refers to a wireless device with such a member and to a wireless device including a ground plane (2, 3) with at least two portions (2, 3) wherein said two portions (2, 3) are connected by an electric component (10), wherein the connection is preferably made between two portions of the ground-plane which are separated by a gap or a slot in the conducting surface of said ground-plane.

Abstract translation: 本发明涉及一种用于无线设备的构件（1），其中该构件（1）是或包括具有至少两个部分（2,3）的接地平面（2,3），其中在每个所述部分 2，3）提供至少一个连接装置，例如垫（4,5），其中两个连接装置（4,5）可与电气部件（10）连接，用于将所述两个部分（2,3） ）所述接地平面。 本发明还涉及具有这种构件和无线装置的无线装置，该无线装置包括具有至少两个部分（2,3）的接地平面（2,3），其中所述两个部分（2,3）通过电连接 组件（10），其中所述连接优选地在所述接地平面的两个部分之间由所述接地平面的导电表面中的间隙或狭槽分开。

公开(公告)号：US20080253099A1

公开(公告)日：2008-10-16

申请号：US11947776

申请日：2007-11-30

Applicant: Chuan-Tsai Hou

Inventor： Chuan-Tsai Hou

IPC: H05K7/00

CPC classification number: H05K1/0295 ,  H05K1/0262 ,  H05K1/029 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2203/173

Abstract: A compatible circuit for integrated circuits (ICs) includes three input terminals coupled to corresponding pins of an IC, and three function terminals corresponding to the three input terminals. Each input terminal coupled to the three function terminals via three transmission lines, each transmission line has an open segment, and each input terminal is electrically coupled to a corresponding function terminal by selectively mounting a connection component on the open segment of the corresponding transmission line according to a specification of the IC.

Abstract translation: 用于集成电路（IC）的兼容电路包括耦合到IC的相应引脚的三个输入端子和对应于三个输入端子的三个功能端子。 每个输入端通过三条传输线耦合到三个功能端子，每条传输线都有一个开放的段，每个输入端通过有选择地将一个连接部件安装在相应的传输线的开放段上来电耦合到相应的功能终端， 到IC的规格。

公开(公告)号：US20080130255A1

公开(公告)日：2008-06-05

申请号：US11976150

申请日：2007-10-22

Applicant: Norikuni Noguchi

Inventor： Norikuni Noguchi

IPC: H05K7/10

CPC classification number: H05K1/111 ,  H05K1/0203 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/611

Abstract: According to one embodiment, first to fourth pads are arranged on a surface mounting area of a printed circuit board along one side of the mounting area, with a preset gap defined between each pair of adjacent ones of the pads. The first to third pads form a first land, and the second to fourth pads form a second land. When a first three-terminal regulator IC is mounted on the first land, a radiator-side terminal pin incorporated in the regulator IC is connected to a first radiator pad and a common radiator pad. When a second three-terminal regulator IC is mounted on the second land, a radiator-side terminal pin incorporated in the regulator IC is connected to a second radiator pad and the common radiator pad.

Abstract translation: 根据一个实施例，第一至第四焊盘沿着安装区域的一侧布置在印刷电路板的表面安装区域上，在每对相邻焊盘之间限定预设间隙。 第一至第三焊盘形成第一焊盘，第二焊盘形成第二焊盘。 当在第一焊盘上安装第一三端稳压器IC时，将并入调节器IC的散热器侧端子引脚连接到第一散热器焊盘和公共散热器焊盘。 当在第二平台上安装第二三端子稳压器IC时，并入调节器IC中的散热器侧端子引脚连接到第二散热器焊盘和公用散热器焊盘。

公开(公告)号：US20080106860A1

公开(公告)日：2008-05-08

申请号：US12005818

申请日：2007-12-28

Applicant: Behdad Jafari ,  George Sorensen

Inventor： Behdad Jafari ,  George Sorensen

IPC: H05K7/06 ,  H05K7/20

CPC classification number: H05K1/141 ,  G06F1/183 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15321 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/3436 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/1572

Abstract: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.

Abstract translation: 用于耦合到PCB（印刷电路板）接口的多配置处理器 - 存储器件。 该设备包括支持多个配置的存储器组件的基板和处理器，同时具有与印刷电路板的PCB接口的单一公共接口。 在第一配置中，衬底支撑处理器和第一数量的存储器组件。 在第二配置中，衬底支撑处理器和附加数量的存储器组件。 存储器组件可以是预先测试的，封装的存储器组件安装在衬底上。 处理器可以是表面安装的处理器管芯。 此外，处理器可以安装在倒装芯片配置中，与存储器组件相对。 在第一配置中，散热器可以安装在存储器组件和处理器上以散热。 在第二个倒装芯片的配置中，处理器面可以焊接到印刷电路板的PCB接口的非功能区域以散热。

公开(公告)号：US20080038961A1

公开(公告)日：2008-02-14

申请号：US11836286

申请日：2007-08-09

Applicant: Sung-Joo PARK ,  Kyoung-Sun KIM ,  Jung-Joon LEE ,  Jea-Eun LEE

Inventor： Sung-Joo PARK ,  Kyoung-Sun KIM ,  Jung-Joon LEE ,  Jea-Eun LEE

IPC: H01R24/00

CPC classification number: H01R12/83 ,  H01R13/62988 ,  H01R13/631 ,  H05K1/0295 ,  H05K1/117 ,  H05K2201/09954 ,  H05K2201/10159

Abstract: A memory module socket disposed on a principal surface of a mainboard, and adapted to mechanically receive and electrically connect a memory module with a mainboard, the memory module socket including a first unit socket having a plurality of first socket pins adapted to electrically connect a first connector disposed on an edge of the memory module, and a second unit socket having a plurality of second socket pins adapted to electrically connect to a second connector disposed on the memory module orthogonal to the first connector, wherein the memory module as installed in the memory module socket is parallel to the principal surface of the mainboard.

Abstract translation: 存储模块插座，设置在主板的主表面上，并且适于机械地接收和电连接存储器模块与主板，所述存储器模块插座包括第一单元插座，所述第一单元插座具有多个第一插座引脚，所述第一插座引脚适于电连接第一 连接器，其设置在存储器模块的边缘上，以及第二单元插座，其具有多个第二插座引脚，其适于电连接到设置在与第一连接器正交的存储器模块上的第二连接器，其中存储器模块安装在存储器 模块插座平行于主板的主表面。