公开(公告)号：US4688867A

公开(公告)日：1987-08-25

申请号：US818147

申请日：1986-01-13

Applicant: Manfred Reichardt

Inventor： Manfred Reichardt

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K1/119 ,  H05K1/183 ,  H05K3/303 ,  H05K3/326 ,  H05K1/0284 ,  H05K1/184 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2203/167 ,  H05K3/301 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit board with circuit paths on the upper and/or lower surface, the conductive paths being adapted to provide a connection between the components located on the surfaces. Positioning elements for the components are provided at the circuit board or, alternatively, are formed in the circuit board. These positioning elements may be in the form of detents or ribs. In addition, an indentation may be provided either as the positioning element or in addition thereto to retain the component.

Abstract translation: 具有在上表面和/或下表面上的电路路径的电路板，所述导电路径适于提供位于表面上的组件之间的连接。 组件的定位元件设置在电路板上，或者替代地形成在电路板中。 这些定位元件可以是棘爪或肋的形式。 此外，可以将定位元件作为定位元件提供或者除此之外还可以设置为保持部件。

公开(公告)号：US4675989A

公开(公告)日：1987-06-30

申请号：US848651

申请日：1986-04-07

Applicant: Michael D. Galloway ,  William H. Rose ,  David T. Shaffer

Inventor： Michael D. Galloway ,  William H. Rose ,  David T. Shaffer

IPC: H05K1/18 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40 ,  H05K5/02 ,  H01H11/04

CPC classification number: H05K3/326 ,  H05K5/02 ,  H05K1/182 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K3/202 ,  H05K3/4092 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49156

Abstract: An electrical circuit package comprises a stamped and formed lead frame to which is molded a dielectric housing member which includes openings having exposed electrical contacts, the housing member providing support for the lead frame. Some of the exposed contacts in the openings serve to support electrical components in the openings and to make electrical contact therewith while other of the exposed contacts in the openings electrically engage the electrical components and maintain them in the openings. Further exposed contacts electrically engage another electrical component and the housing member and the further exposed contacts maintain the other electrical component in the housing member. An electrical switch is part of the lead frame. The method involves molding a dielectric housing member on the lead frame with exposed circuit path parts in openings either stamped into pairs before molding or severed into pairs after molding, and further forming ones of the pairs of exposed path parts into cantilever contact members while the others of the pairs define stationary contact members.

Abstract translation: 电路封装包括冲压成形的引线框架，模制成绝缘壳体构件，绝缘壳体构件包括具有暴露的电触点的开口，壳体构件为引线框架提供支撑。 开口中的一些暴露的触点用于支撑开口中的电气部件并与其电接触，而开口中的其他暴露的触点电接合电气部件并将它们保持在开口中。 进一步暴露的接触件电接合另一个电气部件和壳体部件，并且另外暴露的触头将另一电气部件保持在壳体部件中。 电气开关是引线框架的一部分。 该方法包括在引线框架上模制绝缘壳体构件，其中在模制之前模制成型或成对切割成对之间的开口中的暴露的电路路径部分，并且进一步将成对的暴露路径部件中的一对成形为悬臂接触构件，而其他 的对限定固定接触构件。

公开(公告)号：US4628527A

公开(公告)日：1986-12-09

申请号：US548798

申请日：1983-11-04

Applicant: Hans Henneberger ,  Walter Puchta

Inventor： Hans Henneberger ,  Walter Puchta

IPC: H01M2/10 ,  H04R25/00 ,  H04R25/02 ,  H05K1/18 ,  H05G1/04

CPC classification number: H05K1/184 ,  H01M2/1044 ,  H04R25/60 ,  H04R2225/021 ,  H04R25/65 ,  H05K2201/09827 ,  H05K2201/10166 ,  H05K2201/10568 ,  H05K2201/1059

Abstract: A miniature hearing aid (1) includes a microphone (12), a receiver (14) an amplifier (15), and a battery connectable via a contact (18), all of which are contained in a housing (2,3). The amplifier is constructed of a printed circuit board (20) and a plurality of components (21). In order to save space, the components (21) are countersunk in openings (24) in the circuit board (20) to reduce the vertical dimension of the amplifier. The openings (24) are used as temporary supports and for exact positioning for the components (21) by making them rectangular with cut off edges.

Abstract translation: 微型助听器（1）包括麦克风（12），接收器（14），放大器（15）和可经由触点（18）连接的电池，所有这些都被容纳在壳体2,3中。 放大器由印刷电路板（20）和多个部件（21）构成。 为了节省空间，组件（21）沉入电路板（20）中的开口（24）中，以减小放大器的垂直尺寸。 开口（24）用作临时支撑件，并且通过使其具有切割边缘的矩形，用于部件（21）的精确定位。

公开(公告)号：US4417114A

公开(公告)日：1983-11-22

申请号：US348998

申请日：1982-02-16

Applicant: Willis A. Larson

Inventor： Willis A. Larson

IPC: H01H13/83 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H01H9/02

CPC classification number: H01H13/83 ,  H05K3/326 ,  H05K1/118 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K3/306

Abstract: This invention relates to an arrangement for attaching discrete electrical components to a generally flat layer of sheet material. Both mechanical and electrical connections are provided by the attachment elements of the present invention. One form of the invention is directed to a membrane switch keyboard wherein one of the layers of the membrane switch has a tail extending therefrom. The tail has a free end which is adhesively secured to some portion of the keyboard. Conductive traces are formed on the tail and extend to the free end where they contact the leads of an electrical component. The component is held between the tail and the keyboard. In another aspect, which may be applied to the membrane switch keyboard just described, the invention includes a sheet material having two or more slits cut therein for each of the component's leads. The slits are cut in a portion of the sheet having conductive traces formed thereon. The leads of the component are then interlaced through the tabs created by the slits to both mechanically and electrically connect the component to the sheet.

公开(公告)号：US4295184A

公开(公告)日：1981-10-13

申请号：US137449

申请日：1980-04-04

Applicant: Joseph A. Roberts

Inventor： Joseph A. Roberts

IPC: H05K3/06 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K3/4092 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2203/0369 ,  H05K3/06 ,  H05K3/062 ,  H05K3/281 ,  H05K3/306

Abstract: The present invention provides an apertured circuit board having self-locking terminals which partially cover at least some of the apertures. The terminals, which are integral extensions of the circuit pathways, each include a pair of inwardly disposed generally L-shaped fingers. The terminals are adhesively anchored to the circuit board at the terminal peripheries and are covered in part by a dielectric overlay. The latter also provides environmental protection and electrical insulation to the circuit conductive pathways. The circuit board and integral sockets may be formed by photoimaging and chemical milling techniques.

Abstract translation: 本发明提供了一种具有自锁端子的有孔电路板，其部分地覆盖至少一些孔。 作为电路通路的整体延伸部的端子各自包括一对向内设置的大致L形的手指。 端子在端子周围粘合地锚定到电路板，并且被绝缘覆盖部分覆盖。 后者还为电路导电通路提供环保和电绝缘。 电路板和集成插座可以通过光学成像和化学研磨技术形成。

公开(公告)号：US4250616A

公开(公告)日：1981-02-17

申请号：US23146

申请日：1979-03-23

Applicant: John J. Klimek ,  Charles L. Tesch ,  Ernest M. Feo ,  Ronald W. Lesky

Inventor： John J. Klimek ,  Charles L. Tesch ,  Ernest M. Feo ,  Ronald W. Lesky

IPC: H01R12/04 ,  B32B15/08 ,  H01R12/18 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46 ,  H05K7/08 ,  H05K3/36

CPC classification number: H05K1/0265 ,  H05K3/445 ,  H05K3/4641 ,  H05K7/08 ,  H05K1/0262 ,  H05K2201/0352 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K3/0052 ,  H05K3/4046 ,  Y10T156/108 ,  Y10T29/49126

Abstract: A method of forming an electrical backplane comprising providing an initially oversized ground and potential plate, forming discontinuous slots in a staggered relationship near the edges of the top surface of one of the plates and the bottom surface of the other plates, laminating the plates together by filling the slots with insulative material and trimming the edge portions off by cutting through the filled slots and webs connecting the slots whereby exposed backplane edges lie opposite insulation in the slots of the plates.

Abstract translation: 一种形成电背板的方法，包括提供初始尺寸过大的接地和电位板，在其中一个板的顶表面和另一个板的底表面的边缘附近以交错关系形成不连续的槽，通过 用绝缘材料填充槽并通过切穿连接槽的填充槽和腹板来剪切边缘部分，从而暴露的背板边缘与板的槽中的绝缘相对。

公开(公告)号：US4230385A

公开(公告)日：1980-10-28

申请号：US9957

申请日：1979-02-06

Applicant: J. Preston Ammon ,  Harry R. Weaver

Inventor： J. Preston Ammon ,  Harry R. Weaver

IPC: H01R12/51 ,  H05K3/00 ,  H05K3/28 ,  H05K13/04 ,  H05K1/08

CPC classification number: H01R12/585 ,  H05K3/0094 ,  H05K3/28 ,  H05K2201/09581 ,  H05K2201/1059 ,  H05K2203/0759 ,  H05K2203/082 ,  Y10S439/936

Abstract: A solderless electrical connector comprising a printed circuit board and electrical contact terminals mounted therein. A printed circuit board is fabricated to the construction stage wherein conductive circuitry interconnects plated through holes formed therethrough. The exposed circuitry and plated through holes are covered with a conformal coating of insulative material which seals the outer surfaces of the conductive materials from the environment and its effects. The insulative coating obviates the need for solder to protect the conductive materials as well as precludes the use of solder for electrical interconnection therewith. The plated through holes are constructed for press fit insertion of contact terminals in tight frictional engagement therein. The press fit insertion of a contact having an angular edge portion effectively penetrates the insulative coating by deforming it away from that portion of the plated through hole brought to bear against the contact. A mechanical and electrical interconnection is thereby provided between the plated through hole and contact terminal of the press fit assembly while the utilization of solder and the requisite heat thereof is effectively eliminated.

Abstract translation: 一种无焊电气连接器，包括印刷电路板和安装在其中的电接触端子。 制造印刷电路板到施工阶段，其中导电电路通过穿过其中形成的孔互连电镀。 暴露的电路和电镀通孔用覆盖绝缘材料的保形涂层覆盖，这些涂层将导电材料的外表面与环境及其影响密封在一起。 绝缘涂层消除了焊料保护导电材料的需要，并且排除了使用焊料与其进行电互连。 电镀通孔被构造成用于压配合插入接触端子以紧密摩擦接合在其中。 具有角边缘部分的触点的压入插入通过使其远离被抵抗接触的电镀通孔的部分变形而有效地穿透绝缘涂层。 因此，在电镀通孔和压配合组件的接触端子之间提供机械和电气互连，同时有效地消除了焊料的使用和必要的热量。

公开(公告)号：US4079284A

公开(公告)日：1978-03-14

申请号：US682276

申请日：1976-05-03

Applicant: David G. J. Fanshawe

Inventor： David G. J. Fanshawe

IPC: H05K1/18 ,  H05K3/32 ,  H01L41/04

CPC classification number: H05K3/326 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K2203/1189 ,  Y10T29/4913

Abstract: A method of mounting an elongate piezoelectric element on a laminated printed wiring board by forcing said element into the board at an angle normal to the surface of the board and at a point where the element can contact a conductor line on the board. Piezoelectric elements made of ferroelectric ceramic materials are suitable especially when mounted on a printed circuit board composed of copper-clad phenol formaldehyde laminated plastic.

Abstract translation: 一种将细长压电元件安装在叠层印刷线路板上的方法，该方法是通过将所述元件以垂直于板表面的角度和元件可接触板上导体线的点强制进入基板。 由铁电陶瓷材料制成的压电元件特别适用于安装在由铜包覆酚醛树脂层压塑料制成的印刷电路板上。

公开(公告)号：US3927471A

公开(公告)日：1975-12-23

申请号：US43730574

申请日：1974-01-28

Applicant: TRICKER KEITH ARTHUR

Inventor： TRICKER KEITH ARTHUR

IPC: H01R12/70 ,  H05K1/00 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/308 ,  H01R12/7076 ,  H05K1/0287 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2203/1446 ,  Y10T29/4914 ,  Y10T29/49167

Abstract: A method of fabricating an electrical circuit - usually employing small electronic components - on a generally rigid electrically conductive panel. The panel has apertures through which insulating collars are inserted, the necessary wiring and components then being built up on the panel by inserting the wires through the collars. The wires through each collar respectively are then united into electrical connection by crimping of the collars.

Abstract translation: 在通常刚性的导电面板上制造通常采用小型电子部件的电路的方法。 面板具有插入绝缘套环的孔，然后通过将线穿过套环将所需的布线和部件组装在面板上。 然后通过每个衣领的电线通过套环的卷曲结合成电连接。

公开(公告)号：US3774140A

公开(公告)日：1973-11-20

申请号：US3774140D

申请日：1972-10-24

Applicant: GTE AUTOMATIC ELECTRIC LAB INC

Inventor： REIMER W

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K7/10 ,  H05K1/02

CPC classification number: H05K3/326 ,  H05K1/189 ,  H05K3/0058 ,  H05K7/1015 ,  H05K2201/09045 ,  H05K2201/09445 ,  H05K2201/10393 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10689

Abstract: A printed wiring card assembly in which electronic components can be plugged in to mechanically mount and electrically interconnect into the assembly, including a flexible printed wiring sheet held in resilient contact between a component positioner and ridges on a support base. The positioner includes slots and a guide ramp for guiding the component leads insertable between the positioner and conductive connecting portions on the printed wiring sheet. A layer of resilient material on the ridges urges the conductive connecting portions into resilient contact engagement with the component leads.

Abstract translation: 一种印刷线路卡组件，其中电子部件可以被插入以机械地安装和电互连到组件中，包括柔性印刷线路板，该柔性印刷线路板在部件定位器和支撑基座上的脊之间保持弹性接触。 定位器包括槽和引导斜面，用于引导可插入定位器和印刷布线板上的导电连接部分之间的部件引线。 脊上的一层弹性材料促使导电连接部分与部件引线弹性接触接合。