公开(公告)号：US5515241A

公开(公告)日：1996-05-07

申请号：US480115

申请日：1995-06-07

Applicant: William E. Werther

Inventor： William E. Werther

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H05K1/11

CPC classification number: H05K1/141 ,  H05K3/3415 ,  H05K7/1084 ,  H05K7/1092 ,  H05K1/0262 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract translation: 公开了用于互连集成电路，特别是预先包装的集成电路的组件和方法。 由引脚载体，一组焊盘（例如用于接收表面安装的集成电路）和耦合焊盘和引脚的一组导电路径组成的多电平电气组件可以将一个或多个集成电路连接到 插座或电路板的其他连接区域。 路径通过多层互连板，其可以被配置为允许将焊盘任意平移到引脚用于不同目的，或者允许附加电路元件（例如协处理器或无源电路）与路径的耦合。 还公开了用于形成组件的本发明的方法以及组件的实施例可用于增加电路板密度的本发明的系统。

公开(公告)号：US5481435A

公开(公告)日：1996-01-02

申请号：US278807

申请日：1994-07-22

Applicant: William E. Werther

Inventor： William E. Werther

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H05K1/11

CPC classification number: H05K1/141 ,  H05K3/3415 ,  H05K7/1084 ,  H05K7/1092 ,  H05K1/0262 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract translation: 公开了用于互连集成电路，特别是预先包装的集成电路的组件和方法。 由引脚载体，一组焊盘（例如用于接收表面安装的集成电路）和耦合焊盘和引脚的一组导电路径组成的多电平电气组件可以将一个或多个集成电路连接到 插座或电路板的其他连接区域。 路径通过多层互连板，其可以被配置为允许将焊盘任意平移到引脚用于不同目的，或者允许附加电路元件（例如协处理器或无源电路）与路径的耦合。 还公开了用于形成组件的本发明的方法以及组件的实施例可用于增加电路板密度的本发明的系统。

公开(公告)号：US5457878A

公开(公告)日：1995-10-17

申请号：US135777

申请日：1993-10-12

Applicant: Michael D. Rostoker ,  Nicholas F. Pasch

Inventor： Michael D. Rostoker ,  Nicholas F. Pasch

IPC: H01L21/60 ,  H01L23/31 ,  H01L25/16 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/30

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/49 ,  H01L25/16 ,  H05K1/141 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/85 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/0286 ,  H05K1/117 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09727 ,  H05K2203/1572 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: An apparatus and method for mounting and connecting a plurality of integrated circuit chip dice to a printed circuit substrate by means of a small circuit board (such as a Mini-Board) that may be adapted to attach and connect into a plurality of different types of printed circuit board systems. A pattern of conductors that monotonically increases in pitch and width from a central point on a planar structure to the perimeter edge of the structure allows matching of any type of printed circuit board connections. A standard Mini-Board may be fabricated and tested before attaching to an electronic system printed circuit board. Repair and rework is easily facilitated with a minimum amount of damage to a printed circuit board by utilizing the present invention. A plurality of active and passive electronic components may also be attached and connected to the planar structure of the present invention. A hybrid mini-system may be fabricated and tested before connecting it into a system printed circuit board.

Abstract translation: 一种用于通过小型电路板（例如小型板）将多个集成电路芯片骰子安装和连接到印刷电路基板的装置和方法，该小型电路板可以适于附接和连接到多个不同类型的 印刷电路板系统。 从平面结构的中心点到结构的周边边缘单调增加的节距和宽度的导体图案允许匹配任何类型的印刷电路板连接。 在连接到电子系统印刷电路板之前，可以制造和测试标准的迷你板。 通过利用本发明，对印刷电路板的损害最小化容易地修复和返工。 多个有源和无源电子部件也可以附接并连接到本发明的平面结构。 混合小型系统可以在将其连接到系统印刷电路板之前被制造和测试。

公开(公告)号：US5351393A

公开(公告)日：1994-10-04

申请号：US913880

申请日：1992-07-15

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01L23/495 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H05K1/141 ,  H01L2924/0002 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49135 ,  Y10T29/4914

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract translation: 具有布置的引脚格栅阵列的表面贴装集成电路转换器板组件能够安装常规的表面安装引线装置以便随后附接到印刷电路板。 转换器板组件包括排列成行和列的用于安装的间隔开的销的阵列，以及与之连接的多个间隔开的销垫。 引脚垫足够间隔开以避免干扰。 一组表面安装引线焊盘是转换器板的一部分，并通过多个引线与引脚阵列互连。 制造具有表面贴装集成电路器件的转换器板的方法包括将器件的引线形成或重整以与表面安装焊盘对准。

公开(公告)号：US5346401A

公开(公告)日：1994-09-13

申请号：US51138

申请日：1993-04-22

Applicant: John Delianides ,  Cindy L. Davis

Inventor： John Delianides ,  Cindy L. Davis

IPC: H01R31/06 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01R12/613 ,  H01R31/06 ,  H05K1/117 ,  H05K1/147 ,  H05K1/118 ,  H05K1/141 ,  H05K1/148 ,  H05K2201/049 ,  H05K2201/10136 ,  H05K3/36 ,  H05K3/361

Abstract: An electrical connector (100) for translating from a first plurality of interconnects (108) formed at a first pitch to a second plurality of interconnects (125) formed at a second pitch smaller than the first pitch comprises a first heat seal connector (105), which includes the first plurality of interconnects (108), and a second heat seal connector (120), which includes the second plurality of interconnects (125). The electrical connector (100) further comprises a translation circuit (110), which includes a first set of outer terminals (115) formed at the first pitch, wherein the first set of outer terminals (115) is aligned with and electrically coupled to the first plurality of interconnects (108). The translation circuit (110) further includes a second set of outer terminals (548) formed at the second pitch, wherein the second set of outer terminals (548) is aligned with and electrically coupled to the second plurality of interconnects (125). Connection circuitry (510-545) electrically couples the first and second sets of outer terminals (115, 548).

Abstract translation: 用于从以第一间距形成的第一多个互连（108）平移到以小于第一间距的第二间距形成的第二多个互连（125）的电连接器（100）包括第一热封连接器（105） ，其包括第一多个互连（108）和包括第二多个互连（125）的第二热封连接器（120）。 电连接器（100）还包括平移电路（110），其包括以第一节距形成的第一组外部端子（115），其中第一组外部端子（115）与第一组外部端子 第一多个互连（108）。 平移电路（110）还包括以第二间距形成的第二组外部端子（548），其中第二组外部端子（548）与第二多个互连（125）对准并电耦合到第二多个互连件（125）。 连接电路（510-545）电耦合第一组和第二组外部端子（115,548）。

公开(公告)号：US5173842A

公开(公告)日：1992-12-22

申请号：US766377

申请日：1991-09-27

Applicant: David T. Depew

Inventor： David T. Depew

IPC: H01L23/40 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01L23/4006 ,  H05K1/141 ,  H05K1/147 ,  H01L2023/4056 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/10409 ,  H05K3/363 ,  H05K3/366

Abstract: An electrical assembly for a removable printed circuit board, wherein the printed circuit board is mounted on a plate and spaced from the plate. Electrical devices, particularly power devices, are mounted on the plate and electrically connected to the printed circuit board by a terminal providing for a flexible high current interface in the form of a deformable bridge interface connector which is inserted into the printed circuit board to provide a circuit connection to the power device. The deformable bridge interface connector is formed so as to permit three directional movement of the printed circuit board, a positive low resistance high current connection to the power devices and which can be disconnected by unscrewing screws connecting the bridge with a terminal post which is connected to the power device.

Abstract translation: 一种用于可拆卸印刷电路板的电气组件，其中印刷电路板安装在板上并与板间隔开。 电气设备，特别是功率器件安装在板上，并通过端子电连接到印刷电路板，端子提供形式为可变形桥接接口连接器的柔性高电流接口，该可变形桥接接口连接器插入印刷电路板中以提供 电路连接到电源设备。 可变形桥接接口连接器形成为允许印刷电路板的三个方向移动，与电力设备的正低电阻大电流连接，并且可以通过旋转连接桥与连接到 电源设备。

公开(公告)号：US5170931A

公开(公告)日：1992-12-15

申请号：US644528

申请日：1991-01-23

Applicant: Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

Inventor： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC: H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15321 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template having a pattern of openings corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

公开(公告)号：US5101323A

公开(公告)日：1992-03-31

申请号：US446808

申请日：1989-12-06

Applicant: Michel Prevost

Inventor： Michel Prevost

IPC: H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40

CPC classification number: H05K1/112 ,  H01L23/5383 ,  H05K3/403 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/0919 ,  H05K2201/09472 ,  H05K2201/10674

Abstract: The component-connecting device comprises several stacked and assembled wafers. Each wafer is made of an insulating material and includes conductive tracks that are rectilinear and parallel to one another. The tracks of two adjacent wafers are perpendicular. The tracks of the different wafers are made on a given side of the device. The device has zones for the connection of a component to that face, of the faces bearing the tracks, which is free, and these zones are electrically connected to tracks of other wafers. Finally, the tracks of the different wafers are extended as a connection zone with the exterior.

Abstract translation: 部件连接装置包括几个堆叠和组装的晶片。 每个晶片由绝缘材料制成，并且包括彼此直线并平行的导电轨道。 两个相邻晶片的轨迹是垂直的。 不同晶片的轨迹在器件的给定侧面上制成。 该装置具有用于将元件连接到该面的区域，承载轨道的表面是空闲的，并且这些区域电连接到其它晶片的轨道。 最后，不同晶片的轨迹作为与外部的连接区域延伸。

公开(公告)号：US5046954A

公开(公告)日：1991-09-10

申请号：US648718

申请日：1991-01-31

Applicant: George R. Schmedding

Inventor： George R. Schmedding

IPC: G09F9/00 ,  H01R12/70 ,  H01R12/71 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10

CPC classification number: G09F9/00 ,  H01R12/7076 ,  H05K1/141 ,  H05K1/147 ,  H05K3/326 ,  H05K7/103 ,  H01L2924/00013 ,  H01R12/718 ,  H05K2201/0382 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K3/3442 ,  H05K3/363 ,  H05K3/368

Abstract: An electrical connector (20) includes a body (22) having cavities (24) adapted to receive the leads (18) of components such as displays (16) to be interconnected by circuit traces (28) carried on a film (26) on the surface of the body with contact arms (34, 36) formed in the trace material to engage the leads extended therethrough into the cavities (24) and provide an electrical and mechanical connection of the component.

Abstract translation: 电连接器（20）包括具有空腔（24）的主体（22），所述主体（22）适于容纳诸如显示器（16）的部件的引线（18），以通过承载在薄膜（26）上的电路迹线（28）互连 形成在微量材料中的接触臂（34,36）的主体的表面，以将穿过其中的引线接合到空腔（24）中并提供部件的电气和机械连接。

公开(公告)号：US5019700A

公开(公告)日：1991-05-28

申请号：US438206

申请日：1989-11-20

Applicant: Noburu Tada ,  Tadaharu Mukai ,  Katsuhide Shino

Inventor： Noburu Tada ,  Tadaharu Mukai ,  Katsuhide Shino

IPC: B42D15/10 ,  G06K19/077 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K1/111 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/10666 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/368

Abstract: A multifunction card type electronic apparatus comprising a simple flat-shaped circuit board into which electronic components are mounted; a protective member that is disposed on at least the top surface of the circuit board except for a portion of the top surface of the circuit board on which external connection terminals are to be disposed; and a terminal board on the top surface of which the external connection terminals are disposed, the terminal board being placed and bonded onto the portion of the top surface of the circuit board by means of an electrically conductive material so that the external connection terminals are electrically connected to the circuit board, whereby the electronic apparatus is produced in a low cost, easy to produce and suited to a mass production.

Abstract translation: 一种多功能卡式电子设备，包括：电子部件安装在其中的简单平板电路板; 保护构件，其设置在电路板的至少顶表面上，除了要布置外部连接端子的电路板的顶表面的一部分之外; 并且在其顶表面上设置有外部连接端子的端子板，端子板通过导电材料放置并接合到电路板的顶表面的部分上，使得外部连接端子电气 连接到电路板，由此电子设备以低成本生产，易于生产并且适合于批量生产。