公开(公告)号：US12127329B2

公开(公告)日：2024-10-22

申请号：US17612010

申请日：2020-05-29

Applicant: HELLA GMBH & CO KGAA ,  INFINITE FLEX GMBH

Inventor： Dirk Bösch ,  Kangkai Ma

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H01L33/64 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K1/118 ,  H05K3/0061 ,  H01L33/64 ,  H01L33/647 ,  H05K1/0207 ,  H05K1/189 ,  H05K7/205 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/066 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2203/0522

Abstract: A flexible circuit board includes an electrically insulating cover layer, at least one electrical component arranged on the upper side of the cover layer with electrical contacts, a conducting track structure arranged on the underside of the cover layer and with contact regions, wherein the electrical contacts are each electrically conductively connected to one of the contact regions through one of a plurality of openings in the cover layer, a heat sink which is thermally conductively connected to each electrical component through the cover layer, and a layer with high conductivity. To create an improved cooling capacity of the electrical component, the heat arising in the electrical components is first dissipated effectively within the conducting paths of the conducting path structure and then dissipated out of the conducting paths directly into the heat sink by the layer with high heat conductivity.

公开(公告)号：US20240268034A1

公开(公告)日：2024-08-08

申请号：US18382278

申请日：2023-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jesang Park ,  Changgun Oh ,  Yangje Lee ,  Hyun Kyung Park

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/103 ,  H05K1/0306 ,  H05K3/4697 ,  H05K2201/0212 ,  H05K2201/0753 ,  H05K2201/099 ,  H05K2201/10204 ,  H05K2203/0186 ,  H05K2203/1377

Abstract: A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

公开(公告)号：US20240260187A1

公开(公告)日：2024-08-01

申请号：US18423833

申请日：2024-01-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiroshi YOKOTA

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/24

CPC classification number: H05K1/113 ,  H05K3/062 ,  H05K3/067 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/099

Abstract: A wiring board includes an insulating layer, first and second pads provided on the insulating layer and including a first surface in contact with the insulating layer, a second surface opposite to the first surface, and a side surface connecting the first and second surfaces, respectively, and a protective insulating layer provided above the insulating layer. The first and second pads have a portion exposed inside an opening in the protective insulating layer. The first pad has a portion opposing the second pad without the protective insulating layer interposed between the first and second pads. A region of the second surface of the first and second pads exposed from the protective insulating layer is covered with a plating layer. A region of the side surface of the first and second pads exposed from the protective insulating layer is exposed from the plating layer.

公开(公告)号：US20230335479A1

公开(公告)日：2023-10-19

申请号：US18211093

申请日：2023-06-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Hoon KO ,  Sang Hoon KIM ,  Yoong OH ,  Hea Sung KIM

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L21/4846 ,  H05K1/111 ,  H05K3/18 ,  H05K3/241 ,  H05K3/28 ,  H05K2203/0723 ,  H01L23/49822 ,  H05K2201/098 ,  H05K2201/099

Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

公开(公告)号：US20230319991A1

公开(公告)日：2023-10-05

申请号：US17709461

申请日：2022-03-31

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hao-Cheng Hou ,  Tsung-Ding Wang ,  Jung-Wei Cheng ,  Chien-Hsun Chen ,  Chien-Hsun Lee

IPC: H05K1/11 ,  G01R1/073 ,  H05K1/02 ,  H05K1/14 ,  H05K1/09 ,  H05K1/18 ,  H05K3/24

CPC classification number: H05K1/113 ,  G01R1/07342 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/09 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/032 ,  H05K2201/10015 ,  H05K2201/099 ,  H05K2203/1333

Abstract: A laminated structure and the manufacturing methods thereof are provided. The structure includes an interconnect substrate having a first surface and a second surface opposite to the first surface, an insulating encapsulant laterally wrapping the interconnect substrate, and a redistribution structure disposed on the first surface of the interconnect substrate and electrically connected with the interconnect substrate. The redistribution structure has a third surface facing the first surface and a fourth surface opposite to the third surface. The redistribution structure includes first pads, second pads located beside the first pads, and protective patterns disposed on the first pads and covering the first pads. The first pads include pad portions protruded from the fourth surface and the protective patterns are in contact with sidewalls and top surfaces of the pad portions of the first pads.

公开(公告)号：US11723153B2

公开(公告)日：2023-08-08

申请号：US17653054

申请日：2022-03-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi Bae ,  Soon Gyu Kwon ,  Sang Hwa Kim ,  Sang Young Lee ,  Jin Hak Lee ,  Han Su Lee ,  Dong Hun Jeong ,  In Ho Jeong ,  Dae Young Choi ,  Jung Ho Hwang

IPC: H05K1/11 ,  H05K3/24 ,  H05K3/18 ,  H05K3/10 ,  H05K1/02 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/12 ,  H05K1/09 ,  C25D3/38

CPC classification number: H05K3/244 ,  C25D3/48 ,  C25D5/022 ,  C25D5/48 ,  C25D7/123 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/11 ,  H05K3/108 ,  H05K3/181 ,  H05K3/188 ,  C25D3/38 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/0989 ,  H05K2203/1184

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：US20180211934A1

公开(公告)日：2018-07-26

申请号：US15924305

申请日：2018-03-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keisuke IKENO ,  Kuniaki YOSUI

IPC: H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/81 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/9211 ,  H05K1/111 ,  H05K3/328 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2924/00

Abstract: A component-mounted resin substrate includes a thermoplastic resin substrate and an electronic component. The resin substrate includes a surface including a mounting land conductor and a reinforcing resin member. A bump of the electronic component is joined to the mounting land conductor by ultrasonic joining. The reinforcing resin member is in contact with a side surface of the mounting land conductor and has a height smaller than a height of the mounting land conductor.

公开(公告)号：US09974168B2

公开(公告)日：2018-05-15

申请号：US14861272

申请日：2015-09-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sumiyo Nakamura ,  Takahiro Sumi ,  Takahiro Oka

IPC: H05K1/00 ,  H05K1/03 ,  C04B35/195 ,  H01L23/12 ,  H01L23/15 ,  H01L21/48 ,  H05K1/11 ,  H05K3/46 ,  C04B35/20 ,  H05K1/02 ,  H05K3/12 ,  H01L23/498

CPC classification number: H05K1/0306 ,  C04B35/195 ,  C04B35/20 ,  C04B35/62218 ,  C04B35/62625 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2235/80 ,  H01L21/4867 ,  H01L23/12 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/099 ,  H05K2201/09909 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

公开(公告)号：US20170268753A1

公开(公告)日：2017-09-21

申请号：US15459905

申请日：2017-03-15

Applicant: ROHM CO., LTD.

Inventor： Hiroyuki TAJIRI ,  Yuya HASEGAWA

IPC: F21V19/00 ,  H01L25/16 ,  H01L33/62 ,  H01L33/60 ,  F21V29/89 ,  H01L33/48 ,  H01L33/64 ,  F21V7/04 ,  F21V23/06 ,  F21V29/74 ,  H01L25/075 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H05K1/0268 ,  H05K3/3431 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613

Abstract: An LED lighting apparatus is provided. The LED lighting apparatus includes LED chips, a substrate, and an electronic element. The substrate includes a mount surface on which the LED chips are mounted. The LED chips are arranged at or near a center of the mount surface of the substrate. The substrate includes a base, a wiring pattern, and an insulating layer. The wiring pattern is formed on the base. The insulating layer is formed on the base or the wiring pattern and formed with a plurality of openings. The wiring pattern includes pad portions comprising parts of the wiring pattern, respectively. Each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate. Each of the LED chips is mounted on one of the pad portions.

公开(公告)号：US20170188454A1

公开(公告)日：2017-06-29

申请号：US15459740

申请日：2017-03-15

Applicant: Sridharan Venk ,  Earl Alfred Picard ,  Qi Dai ,  Richard Garner

Inventor： Sridharan Venk ,  Earl Alfred Picard ,  Qi Dai ,  Richard Garner

IPC: H05K1/02

CPC classification number: H05K1/111 ,  F21S4/22 ,  F21V21/005 ,  G06K19/07749 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1421 ,  H05K1/0209 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/051 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09872 ,  H05K2201/099 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1545 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.