公开(公告)号：US08033877B2

公开(公告)日：2011-10-11

申请号：US12506974

申请日：2009-07-21

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R11/22

CPC classification number: H05K3/32 ,  H01R12/52 ,  H01R13/11 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10734 ,  Y02P70/613

Abstract: One embodiment is a connector for making electrical connection to a bulbous terminal, the connector including: a metal tube with a cylindrical wall extending from a mating end, wherein: (a) two or more slots perforate the wall and extend from the mating end along the tube; (b) two or more apertures perforate the wall and are disposed in a circumferential array disposed a distance from the mating end; and (c) each of the two or more slots transects one of the two or more apertures to divide the mating end of the tube into resilient prongs.

Abstract translation: 一个实施例是用于与球根端子进行电连接的连接器，该连接器包括：金属管，其具有从配合端延伸的圆柱形壁，其中：（a）两个或更多个狭缝在壁上穿孔并从配合端沿着 管子 （b）两个或更多个孔穿过该壁并设置在与配合端一定距离设置的圆周阵列中; 和（c）两个或更多个槽中的每一个横切两个或更多个孔中的一个，以将管的配合端分成弹性插脚。

公开(公告)号：US20110192634A1

公开(公告)日：2011-08-11

申请号：US13120421

申请日：2009-09-23

Applicant: Ping Wang

Inventor： Ping Wang

IPC: H05K1/00

CPC classification number: H05K3/3447 ,  H05K1/119 ,  H05K3/42 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10333 ,  H05K2201/10409

Abstract: A circuit board comprises at least one mounting hole for coupling a weld screw. At least one notch for receiving solder is formed in an inner wall of the mounting hole.

Abstract translation: 电路板包括用于联接焊接螺钉的至少一个安装孔。 用于接收焊料的至少一个凹口形成在安装孔的内壁中。

公开(公告)号：US07990001B2

公开(公告)日：2011-08-02

申请号：US12524386

申请日：2007-10-30

Applicant: Kenta Hatano ,  Naoki Miyamoto ,  Toshiyuki Umemoto ,  Hirofumi Doi

Inventor： Kenta Hatano ,  Naoki Miyamoto ,  Toshiyuki Umemoto ,  Hirofumi Doi

IPC: H02K11/00

CPC classification number: H05K3/308 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10446 ,  H05K2201/10757

Abstract: A terminal structure for a vehicle-mounted motor includes a motor body having a motor terminal 28 connected to a coil, and a circuit body 5 holding a circuit board 18 for controlling a rotation of the motor body and is assembled in the motor body, wherein a stress relaxation section 35 is provided in an intermediate of an intermediate conductor 34, in order to reduce stress acting on the intermediate conductor 34 connecting the motor terminal 28 and the circuit board 18 and to thereby improve the conductive reliability of electrical joint.

Abstract translation: 一种用于车载电动机的端子结构，包括具有连接到线圈的电动机端子28的电动机主体和保持用于控制电动机主体的旋转并组装在电动机主体中的电路板18的电路体5，其中， 在中间导体34的中间设置有应力缓和部35，以便减小作用在连接电动机端子28和电路基板18的中间导体34上的应力，从而提高电接头的导电可靠性。

公开(公告)号：US20110059661A1

公开(公告)日：2011-03-10

申请号：US12877656

申请日：2010-09-08

Applicant: Noriyasu INOMATA ,  Toshihiro MIYAKE ,  Yasuyuki TACHIBANA ,  Hideyuki IIBOSHI

Inventor： Noriyasu INOMATA ,  Toshihiro MIYAKE ,  Yasuyuki TACHIBANA ,  Hideyuki IIBOSHI

IPC: H01R13/33

CPC classification number: H01R13/33 ,  H01R13/111 ,  H05K3/308 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/1059

Abstract: An electrical connector assembly having a connector part for electrically and mechanically connecting a printed circuit board with a land part to a lead part of an electrical component by inserting the lead part into the connector part. The connector part composed of a line spring member having a fixed end part, a terminal fixing part, and an elastic deforming part. The fixed end part is fixed to the land part. The terminal fixing part formed by winding the line spring member elastically fastens the lead part. The elastic deforming part is elastically deformed when external force is applied to the lead part while maintaining the lead part fixed to the terminal fixing part.

Abstract translation: 一种电连接器组件，其具有用于通过将引线部分插入到连接器部分中来将印刷电路板与凸台部分电连接并机械地连接到电气部件的引线部分的连接器部件。 由具有固定端部，端子固定部和弹性变形部的线弹簧部件构成的连接部。 固定端部固定在陆部上。 通过卷绕线弹簧部件而形成的端子固定部件弹性地固定引线部分。 当将引导部件固定到端子固定部件上时，弹性变形部件在对引线部分施加外力时弹性变形。

公开(公告)号：US20100253155A1

公开(公告)日：2010-10-07

申请号：US12418764

申请日：2009-04-06

Applicant: Shao-Feng LU

Inventor： Shao-Feng LU

IPC: H02J4/00

CPC classification number: H05K7/1432 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/142 ,  H05K3/366 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10333 ,  H05K2201/10409

Abstract: A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power. The architecture including at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to the power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element. Therefore, through the power conduction elements replacing the conventional connecting wires with large diameter to connect the power input port and the power process board without disobeying the safety regulation, not only the space occupied by the bent connection wires can be reduced, but the collisions and damage to other components caused therefrom also can be avoided.

Abstract translation: 一种用于在电源中传输的结构，特别是用于承载大直流电流的用于传输的电力结构，其中电源包括用于连接到DC输入电力的电力输入端口和用于转换DC输入电力的DC / DC转换电路 进入直流输出电源。 所述架构包括至少一个用于布置所述电力输入端口的电力传输板，其中所述电力传输板通过至少一个电力传导元件安装在其上的DC / DC转换电路电连接到所述电力处理板。 因此，通过代替大直径的常规连接线的电力传导元件来连接电力输入端口和电源处理板，而不违背安全规定，不仅可以减少弯曲的连接线所占据的空间，而且可以减少碰撞和 也可以避免对其引起的其他成分的损害。

公开(公告)号：US07797663B2

公开(公告)日：2010-09-14

申请号：US11696659

申请日：2007-04-04

Applicant: Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

Inventor： Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

IPC: G06F17/50

CPC classification number: G01R31/2818 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3457 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0367 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/10333 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Abstract translation: 提供了使用高密度互连（HDI技术）访问在印刷电路板（PCB）的内层上的导电迹线上路由的高速信号的方法和装置。 导电迹线可以耦合到具有设置在μVia的外层焊盘上方的导电圆顶的微孔（μVia）。 与使用电镀通孔（PTH）技术的常规测试点相比，在线测试（ICT）固定装置或高速测试探头可与导电圆顶接口以测试具有降低的反射损耗和其他寄生效应的高速信号。

公开(公告)号：US07695287B2

公开(公告)日：2010-04-13

申请号：US11428902

申请日：2006-07-06

Applicant: Steven C. Smith ,  Steven R. Snyder

Inventor： Steven C. Smith ,  Steven R. Snyder

IPC: H01R9/09

CPC classification number: H05K3/32 ,  H05K3/4015 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2201/10962 ,  Y02P70/611

Abstract: A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

Abstract translation: 球栅阵列（BGA）连接系统包括集成电路（IC）封装，其包括形成以矩阵图案布置的球栅阵列（BGA）的多个导电球。 印刷电路板（PCB）包括以相应的矩阵图形排列的多个球窝。 每个球窝包括具有接合PCB的一侧的基座和被配置用于安置BGA的导电球的相对侧。 多个插脚被固定到基座并从基座延伸并且被构造成接纳和保持导电球与基座接触。

公开(公告)号：US07629534B2

公开(公告)日：2009-12-08

申请号：US12081618

申请日：2008-04-18

Applicant: Yuko Ikeda ,  Toshihiro Kusagaya

Inventor： Yuko Ikeda ,  Toshihiro Kusagaya

IPC: H01R4/18

CPC classification number: H05K3/308 ,  H01R12/52 ,  H01R12/57 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069 ,  H05K2201/10333 ,  Y10T29/49139

Abstract: A contact member inserted in a piercing hole of a socket provided between a first contacted member and a second contacted member facing each other, the contact member includes a first contact part configured to come in contact with a first pad formed in the first connected member; a second contact part configured to come in contact with a second pad formed in the second connected member; and a spiral cylindrical part formed in a spiral manner with respect to an axial line connecting the first pad and the second pad, the spiral cylindrical part having one end formed in a large diameter curved part having the first contact part, the spiral cylindrical part having another end formed in a small diameter curved part having the second contact part; the spiral cylindrical part having an external circumferential surface coming in contact with an inside wall of the piercing hole.

公开(公告)号：US20090185393A1

公开(公告)日：2009-07-23

申请号：US12193470

申请日：2008-08-18

Applicant: Eun-Jeong Kang ,  Seok-Won Kang ,  Young-Keun Lee ,  Ho-Sik Shin

Inventor： Eun-Jeong Kang ,  Seok-Won Kang ,  Young-Keun Lee ,  Ho-Sik Shin

IPC: F21V7/22 ,  F21V21/00 ,  H05K3/30

CPC classification number: H05K3/323 ,  G02B6/0073 ,  G02B6/0083 ,  H05K3/28 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2201/10333 ,  Y02P70/611 ,  Y10S362/80 ,  Y10T29/4913

Abstract: A light source module includes a mounting substrate including at least two exposed metal lines, a light-emitting diode (LED) including two electrodes disposed corresponding to the at least two exposed metal lines, and an anisotropic conductive film (ACF) provided on the mounting substrate, the ACF electrically connecting the at least two exposed metal lines to the two electrodes, wherein the ACF comprises an insulation body, and a plurality of conductive particles dispersed in the insulation body and insulated from each other, and an insulation of the conductive particles disposed between the two exposed metal lines and the two electrodes of the LED is prevented in at least a first direction.

Abstract translation: 一种光源模块，包括：至少包括两个暴露的金属线的安装基板;包括对应于所述至少两个暴露的金属线设置的两个电极的发光二极管（LED）;以及设置在所述安装件上的各向异性导电膜 基板，ACF将至少两个暴露的金属线电连接到两个电极，其中ACF包括绝缘体和分散在绝缘体中并彼此绝缘的多个导电颗粒，并且导电颗粒的绝缘 设置在两个暴露的金属线之间，并且至少在第一方向上防止LED的两个电极。

公开(公告)号：US06994570B2

公开(公告)日：2006-02-07

申请号：US10765042

申请日：2004-01-28

Applicant: Young Hoon Kwark

Inventor： Young Hoon Kwark

IPC: H01R4/58

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/714 ,  H05K2201/0367 ,  H05K2201/10303 ,  H05K2201/10333 ,  H01L2924/00

Abstract: An interposer includes an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when at least one of the two adjacent buttons is axially compressed above a predetermined threshold. The chip package includes a chip having a first surface and a second surface, a printed circuit board having a first surface and a second surface, and an interposer having an array of buttons between the chip and the printed circuit board. The first surfaces are closer to each other than the second surfaces.

Abstract translation: 插入器包括在载体上具有彼此接近的按钮阵列，当两个相邻按钮中的至少一个被轴向压缩到高于预定阈值时，允许两个相邻按钮之间的接触。 芯片封装包括具有第一表面和第二表面的芯片，具有第一表面和第二表面的印刷电路板，以及在芯片和印刷电路板之间具有按钮阵列的插入件。 第一表面比第二表面更接近。