公开(公告)号：US20030123818A1

公开(公告)日：2003-07-03

申请号：US10307285

申请日：2002-12-02

Inventor： Toshiaki Watanabe

IPC: G02B006/42 ,  G02B006/36

CPC classification number: H05K1/141 ,  G02B6/4201 ,  G02B6/4246 ,  H05K1/0219 ,  H05K1/024 ,  H05K3/3447 ,  H05K2201/09609 ,  H05K2201/09809 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10424 ,  H05K2201/1059

Abstract: One ends of a plurality of interface pins are attached to a substrate in a line. Optical semiconductor device and an electric circuit are mounted on this substrate. The other ends of the interface pins are fit into holes in an another substrate. Signals are exchanged between the two substrates via the interface pins. The interface pins are embedded in a dielectric material. A plurality of ground pins and/or ground through holes may be provided in the dielectric material around the interface pins. The dielectric constant of the dielectric material is less than the dielectric constants of the two substrates.

Abstract translation: 多个接口引脚的一端以一行连接到基板。 光学半导体器件和电路安装在该衬底上。 接口引脚的另一端装配在另一个基板上的孔中。 信号通过接口引脚在两个基板之间交换。 接口引脚嵌入电介质材料中。 多个接地引脚和/或接地通孔可以设置在接口引脚周围的电介质材料中。 介电材料的介电常数小于两个基片的介电常数。

公开(公告)号：US20020126456A1

公开(公告)日：2002-09-12

申请号：US10084662

申请日：2002-02-28

Inventor： Shunsuke Sato ,  Naoki Nishiyama

IPC: H05K007/00

CPC classification number: G02B6/4201 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/2036 ,  H05K2203/1572

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34c arc mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract translation: 光学数据链路20包括安装部件22，光学元件组件24，电路板26和间隔件32.PGA基板22具有基板22a和多个导电销22b。 电路板26具有一对表面。 电子部件34a至34c弧安装在该对表面上。 光学元件组件24包括半导体光学元件24f。 半导体光学元件24f连接到电路板26上的导电层。间隔物32的作用是使电路板26与PGA基板22保持距离。由于电路板26远离PGA基板22，所以 电子部件34a至34e可以安装在电路板22的两个表面上。

公开(公告)号：US06417747B1

公开(公告)日：2002-07-09

申请号：US09935496

申请日：2001-08-23

Applicant: Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

Inventor： Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

IPC: H01P100

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

Abstract: An RF interconnect is incorporated in RF module packages for direct attachment onto a multi-layer PWB using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing including a metal bottom wall structure. The module includes a plurality of RF interconnects, which provide RF interconnection between the package and the PWB. Each interconnect includes a feedthrough center pin protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator. The center pin is surrounded with a ring of shield pins attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes formed in the PWB, and make contact with fuzz button interconnects disposed in the holes. Circuitry connects the fuzz button interconnects to appropriate levels of the PWB for grounding and RF signal conduction.

Abstract translation: RF互连结合在RF模块封装中，以使用可压缩中心导体（Fuzz按钮）互连直接连接到多层PWB上。 该模块具有以微波频率工作的电路。 模块封装包括金属外壳，其包括金属底壁结构。 该模块包括多个RF互连，其在封装和PWB之间提供RF互连。 每个互连件包括穿过形成在金属底壁中的开口突出的馈通中心销，由隔离绝缘子提供隔离。 中心销被围绕着一个安装在模块壳体底壁外表面的屏蔽销圈。 销可插入形成在PWB中的孔中，并与布置在孔中的绒头按钮互连接触。 电路将毛绒按钮互连连接到PWB的适当级别，用于接地和RF信号传导。

公开(公告)号：US20020075664A1

公开(公告)日：2002-06-20

申请号：US09740115

申请日：2000-12-19

Inventor： Russell Wayne Perkins ,  Mark Alan Yoder ,  Christopher Day States ,  Theodore Paul Corbin

IPC: H05K009/00

CPC classification number: H05K9/0028 ,  H05K1/0201 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10848 ,  Y10S174/34

Abstract: An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.

Abstract translation: 一种用于通过减少远离焊点的散热来屏蔽安装在印刷电路板（PCB）上的电气部件免受电磁和射频干扰的装置和方法。 在本发明的实施例中，用于印刷电路板的射频（RF）屏蔽包括用于RF屏蔽用于屏蔽其上安装有电子部件的PCB的一部分的屏蔽。 屏蔽件具有第一部分和第二部分，其中第一部分具有减小的横截面面积，用于当屏蔽件的第一部分插入到第一部分和第二部分中的第一多个孔中时，用于减小第一部分和第二部分之间的热传导 PCB，用于将屏蔽的第一部分焊接到PCB的铜箔。

公开(公告)号：US06351194B2

公开(公告)日：2002-02-26

申请号：US09106086

申请日：1998-06-29

Applicant: Yoshiro Takahashi ,  Kei Nakakuki ,  Satoshi Itaya ,  Kayo Hamano

Inventor： Yoshiro Takahashi ,  Kei Nakakuki ,  Satoshi Itaya ,  Kayo Hamano

IPC: H03H972

CPC classification number: H03H9/725 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H9/0576 ,  H03H9/6433 ,  H03H9/72 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/112 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09536 ,  H05K2201/10371 ,  H05K2201/10674 ,  H05K2203/1394

Abstract: An electronic component having a multi-layered printed circuit board made of an organic material, a plurality of electronic components mounted in a face-down position on the multi-layered printed circuit board, a metal cover for covering the plurality of electronic components remaining a space or a cavity between the top surface of the printed circuit board and the inner surface of the metal cover having a flange surrounding the outskirts of the metal cover to be adhered to the top surface of the multi-layered printed circuit board, and a heat conductive member packed between the bottom surface of the electronic components, wherein the multi-layered printed circuit board has at least one through-hole vertically penetrating the multi-layered printed circuit board at a location corresponding to the flange and is lined by a metal film, and the multi-layered printed circuit board has a heat conductive layer arranged along the rear surface of the multi-layered printed circuit board, the heat conductive layer being connected to a metal lining of the through-hole.

Abstract translation: 一种具有由有机材料制成的多层印刷电路板的电子部件，多层印刷电路板上以面朝下的方式安装的多个电子部件，用于覆盖剩余的多个电子部件的金属盖 空间或印刷电路板的顶表面和金属盖的内表面之间的空腔，其具有围绕金属盖的外围的凸缘以粘附到多层印刷电路板的顶表面，并且热量 导电构件，其被包装在电子部件的底表面之间，其中所述多层印刷电路板具有至少一个在与所述凸缘相对应的位置处垂直贯穿所述多层印刷电路板的通孔，并且由金属膜 ，并且多层印刷电路板具有沿着多层印刷电路板的后表面布置的导热层，hea t导电层与通孔的金属衬里连接。

公开(公告)号：US20010036684A1

公开(公告)日：2001-11-01

申请号：US09791104

申请日：2001-02-22

Inventor： Kazuhiko Kitade

IPC: H01L021/50 ,  H01L021/44 ,  H03B007/12 ,  H03B005/18 ,  H01L021/48

CPC classification number: H05K9/0022 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/3415 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10371 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A plurality of surface-mounting components are mounted on a mother printed-circuit board provided with component-connecting electrodes, engagement holes, and case-fixing electrodes provided inside the engagement holes. Soldering paste is applied in the vicinity of the engagement holes or in an area covering a portion of each of the engagement holes and the vicinity of the engagement holes on the mother printed-circuit board from the side of the component-mounted surface such that soldering paste is not entirely filled in the engagement hole. A plurality of shielding cases are engaged in the mother printed-circuit board by inserting engagement protrusion portions of the shielding cases into the engagement holes. Then the engagement protrusion portions of the shielding cases are soldered to case-fixing electrodes inside the engagement holes by melting solder in the soldering paste. The mother printed-circuit board is then cut and divided into individual electronic components.

Abstract translation: 多个表面安装部件安装在母版印刷电路板上，母版印刷电路板上设置有设置在接合孔内部的元件连接电极，接合孔和外壳固定电极。 将焊膏从部件安装表面侧施加到接合孔附近或覆盖母版印刷电路板上的每个接合孔的一部分和接合孔附近的区域，使得焊接 糊剂没有完全填充在接合孔中。 通过将屏蔽壳体的接合突起部分插入到接合孔中，多个屏蔽壳体与母版印刷电路板接合。 然后，通过熔化焊膏中的焊料将屏蔽壳体的接合突起部分焊接到接合孔内的壳体固定电极。 然后将母版印刷电路板切割并分成单独的电子部件。

公开(公告)号：US06195244B1

公开(公告)日：2001-02-27

申请号：US09319085

申请日：1999-05-27

Applicant: Herbert Barz

Inventor： Herbert Barz

IPC: H05K900

CPC classification number: H05K9/0033 ,  H04B15/02 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/10371 ,  H05K2201/10386

Abstract: In an electronic circuit, comprising electrical and electronic components and their connecting lines (3) on a printed circuit board (2), in which case a shielded housing encloses the electronic circuit, attenuating radiofrequencies, in order to prevent interference which acts on the electronic circuit and interference which is caused by the electronic circuit, in particular for use in a combination display instrument in a motor vehicle. Connecting lines (3) from the electronic circuit on the printed circuit board (2) are passed out of the shielded housing (1), connecting means (5) outside the shielded housing (1, 15) are connected to the connecting lines (3), and shielding is provided which reduce or suppress the ingress of radio-frequency interference into the shielded housing (1) and the emission of radio-frequency interference from the shielded housing (1).

Abstract translation: 在电子电路中，包括电气和电子部件及其在印刷电路板（2）上的连接线（3），在这种情况下，屏蔽的外壳包围电子电路，衰减射频，以防止作用在电子线路上的干扰 由电子电路引起的电路和干扰，特别是用于机动车辆中的组合显示装置中。 从印刷电路板（2）上的电子电路的连接线（3）从屏蔽壳体（1）中通过，屏蔽壳体（1,15）外部的连接装置（5）连接到连接线 ），并且提供屏蔽，其减少或抑制对屏蔽壳体（1）的射频干扰的进入和来自屏蔽壳体（1）的射频干扰的发射。

公开(公告)号：US6059170A

公开(公告)日：2000-05-09

申请号：US104572

申请日：1998-06-24

Applicant: Lisa J. Jimarez ,  Craig G. Heim

Inventor： Lisa J. Jimarez ,  Craig G. Heim

IPC: B23K1/018 ,  H01L21/60 ,  H05K3/34 ,  B23K31/00 ,  B23K1/00

CPC classification number: H01L24/81 ,  B23K1/018 ,  H01L24/75 ,  H05K3/3494 ,  B23K2201/40 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K2201/10371 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/304 ,  H05K3/3436

Abstract: Method and apparatus removing a component having a solder ball grid array to a circuitized substrate. The solder balls have a first temperature at which they melt. The component has a second temperature, greater than the first temperature, over which the component is damaged. The method has a step of placing a thermal shield over the component. In a next step, the circuitized substrate and the component having the solder ball grid array are heated to a third temperature lower than the first temperature. In a next step, a stream of hot gas of a fourth temperature is directed for a predetermined time about the periphery of the thermal shield such that the solder balls reach the first temperature thereby reflowing the solder joints or balls, while other parts of the component reach less than the second temperature. At this point, the component is either attached to the circuitized substrate or permitted to be removed therefrom. Similar methods are also provided for attaching a component having a solder ball grid array from a circuitized substrate.

Abstract translation: 将具有焊球栅格阵列的部件移除到电路化基板的方法和装置。 焊球具有熔化的第一温度。 组件具有大于第一温度的第二温度，组件被损坏。 该方法具有将热屏蔽件放置在部件上的步骤。 在下一步骤中，电路化基板和具有焊球栅格阵列的部件被加热到低于第一温度的第三温度。 在下一步骤中，将第四温度的热气流围绕热屏蔽的周边定向预定时间，使得焊球达到第一温度，从而回流焊接点或球，而组件的其它部分 达到小于第二温度。 在这一点上，组件或者附接到电路化的衬底或被允许从其移除。 还提供了类似的方法用于从电路化的衬底附接具有焊球栅格阵列的部件。

公开(公告)号：US5911356A

公开(公告)日：1999-06-15

申请号：US911458

申请日：1997-08-14

Applicant: Arata Tsurusaki

Inventor： Arata Tsurusaki

IPC: B23K1/008 ,  H05K3/00 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3405 ,  B23K1/008 ,  B23K2201/42 ,  H05K2201/10371 ,  H05K3/0052 ,  Y10S174/34

Abstract: A method of attaching a lead part and a shield case for preventing a high-frequency signal from being leaked to a printed circuit board includes a solder coating step of coating solder so that the solder should cover the whole of an aperture provided through a printed circuit board into which a lead of the lead part is inserted and so that the solder should cover a part of an aperture provided through the printed circuit board into which an engagement portion of the shield case is inserted, a mounting step of inserting the lead of the lead part and the engagement portion of the shield case into the respective apertures to thereby mount the lead part and the shield case on the printed circuit board, and a soldering step of inserting the printed circuit board mounted with the lead part and the shield case into a reflowing furnace and melting the solder to thereby carry out soldering.

Abstract translation: 一种将引线部分和屏蔽壳体附接以防止高频信号泄漏到印刷电路板的方法包括：涂覆焊料的焊料涂覆步骤，使得焊料应覆盖通过印刷电路提供的整个孔 插入引线部分的引线的板，使得焊料应覆盖通过印刷电路板提供的孔的一部分，其中插入有屏蔽壳的接合部分的安装步骤， 导线部分和屏蔽壳体的接合部分分别插入相应的孔中，从而将引线部分和屏蔽壳体安装在印刷电路板上，以及焊接步骤，将安装有引线部分和屏蔽壳体的印刷电路板插入 回流炉并熔化焊料从而进行焊接。

公开(公告)号：US5907478A

公开(公告)日：1999-05-25

申请号：US991393

申请日：1997-12-16

Applicant: Hideki Watanabe

Inventor： Hideki Watanabe

IPC: H05K1/18 ,  H05K3/34 ,  H05K9/00 ,  H05K5/03

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10871 ,  H05K3/3447 ,  Y02P70/613

Abstract: A unit part mounting structure in which mounting legs are soldered onto soldering lands at a side of the printed board to which the unit part is mounted, so that mounting of the unit part to the printed board is made easier, and repairing and replacement of the unit part can be performed without removing the printed board, thereby making it easier to perform the repairing and replacement. In conventional unit part mounting structures, the unit part is mounted to a side of the printed board not having a conductive pattern, connecting portions of a housing are inserted into holes in the printed board, and the printed board is turned upside down to solder the connecting portions. Thus, it takes time and effort to insert and solder the unit part P. The unit part mounting structure of the invention overcomes such a problem.

Abstract translation: 一种单元部件安装结构，其中安装腿焊接到安装有单元部件的印刷电路板的一侧的焊盘上，使得将单元部件安装到印刷电路板上变得更容易，并且修理和更换 可以在不去除印刷电路板的情况下执行单元部件，从而更容易进行修理和更换。 在传统的单元部件安装结构中，单元部件安装在不具有导电图案的印刷电路板的一侧，壳体的连接部分插入印刷电路板的孔中，并且印刷电路板被颠倒以焊接 连接部分。 因此，插入和焊接单元部件P需要花费时间和精力。本发明的单元部件安装结构克服了这样的问题。