公开(公告)号：US07759604B2

公开(公告)日：2010-07-20

申请号：US11460206

申请日：2006-07-26

Applicant: Laurent Stauffer ,  Peter Kipfer ,  Heinz Bernhard

Inventor： Laurent Stauffer ,  Peter Kipfer ,  Heinz Bernhard

IPC: B23K26/20 ,  B23K1/005

CPC classification number: G02B7/02 ,  B23K1/0056 ,  G02B7/00 ,  H05K3/202 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2203/0195 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/31

Abstract: The invention relates to a method for high-precision fixing of a miniaturized component (1), in particular having a microoptical element (2), on a predetermined fixing section (3) of a support plate (4) by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region (10) which encloses the fixing section (3), is bridged by at least one connecting web (9) of the support plate (4), keeps the heat transfer from the fixing section (3) to the remaining support plate low and compensates lateral thermal expansions of the fixing section (3). Solder material (8) is applied on the top of the fixing section (3). The method comprises in particular the steps: arrangement of the component (1) above the fixing section (3), the solder material (8) and the base (7) of the component (1) being present in opposite positions without contact and forming a space. Supply of electromagnetic radiation (12) to the bottom (6) of the fixing section (3) for melting the solder material (8′) so that, as a result of drop formation and optionally as a result of lowering of the component (1) the space fills with molten solder material (8′) for mutual fixing. Waiting for the mutual fixing by resolidification of the molten solder material (8′).

Abstract translation: 本发明涉及一种用于通过焊接接头在支撑板（4）的预定固定部分（3）上高精度固定小型化部件（1）的方法，特别是具有微光学元件（2）。 支撑板由金属材料形成，并且具有包围固定部分（3）的切口区域（10），由支撑板（4）的至少一个连接腹板（9）桥接，保持 从固定部（3）向剩余的支撑板的热传递较低，并补偿固定部（3）的横向热膨胀。 将焊料（8）施加在固定部（3）的顶部。 该方法特别包括以下步骤：在固定部分（3）上方的部件（1）的布置，部件（1）的焊料材料（8）和基部（7）以相对的位置存在而不接触和形成 一个空间 向固定部分（3）的底部（6）提供电磁辐射（12），以熔化焊料（8'），使得由于液滴形成和任选地由于部件（1）的降低 ），空间填充有熔融焊料（8'）以进行相互固定。 通过重新熔化焊料材料（8'）等待相互固定。

公开(公告)号：US07737796B2

公开(公告)日：2010-06-15

申请号：US12009406

申请日：2008-01-18

Applicant: Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

Inventor： Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

IPC: H03L1/04

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

Abstract: A lead wire led-out type crystal oscillator of constant temperature type for high stability is disclosed, which includes a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant. The heat supply body includes a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract translation: 公开了一种用于高稳定性的恒温型引线引出型晶体振荡器，其包括向多个引线从其引出的晶体谐振器供热，以保持温度恒定的供热体。 供热体包括：导热板，其具有用于引线的通孔并且安装在电路板上，并且面向并直接热连接到晶体谐振器和用于加热的片状电阻器 电路板与导热板相邻，并且热连接到导热板。

公开(公告)号：US07663891B2

公开(公告)日：2010-02-16

申请号：US11431097

申请日：2006-05-10

Applicant: Hirokazu Tanaka ,  Hiroyuki Ishibashi

Inventor： Hirokazu Tanaka ,  Hiroyuki Ishibashi

IPC: H05K7/00

CPC classification number: H05K1/0203 ,  H05K1/0201 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/202 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09972 ,  H05K2201/2036 ,  H05K2203/1316

Abstract: In a lead frame board, while a heat radiation wall member formed by a resin having a relatively high thermal conductivity is provided in a low heat-resistance heat generating component mounting region where a low heat-resistance heat generating component is mounted, heat block wall members formed by resins having relatively low thermal conductivities are provided in a high heat-resistance heat generating component mounting region where a high heat-resistance heat generating component is mounted and in a non-heat generating component mounting region where a non-heat generating component is mounted. Thus, heat block is performed between the low heat-resistance heat generating component mounting region and the high heat-resistance heat generating component mounting region and non-heat generating component mounting region, and a heat radiation function is enhanced in the low heat-resistance heat generating component.

Abstract translation: 在引线框架板中，在安装有低耐热性发热部件的低耐热发热部件安装区域中设置由具有较高导热性的树脂形成的散热壁部件，但是热阻壁 在具有较高耐热发热部件的高耐热发热部件安装区域和非发热部件安装区域中设置具有较低热导率的树脂构成的部件， 被安装。 因此，在低耐热性发热部件安装区域和高耐热发热部件安装区域和非发热部件安装区域之间进行热阻，并且在低耐热性下提高散热功能 发热部件。

公开(公告)号：US20100001048A1

公开(公告)日：2010-01-07

申请号：US12557851

申请日：2009-09-11

Applicant: Tsuyoshi Yamamoto ,  Akiomi Hiruma ,  Fumigi Koyama

Inventor： Tsuyoshi Yamamoto ,  Akiomi Hiruma ,  Fumigi Koyama

IPC: B23K1/018

CPC classification number: H05K3/3494 ,  H01L24/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K1/0201 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/062 ,  H05K2203/0126 ,  H05K2203/176 ,  H05K2203/304

Abstract: A soldering method for soldering an electronic part on a substrate by reflow soldering is disclosed that includes the steps of applying a solder paste on the substrate; mounting the electronic part on the substrate by using the solder paste; disposing a heat capacity enhancing member on the electronic part, the heat capacity enhancing member including a gel-like material able to enhance the heat capacity of the electronic part; and soldering the electronic part onto the substrate by reflow soldering with the heat capacity enhancing member being applied thereon.

Abstract translation: 公开了一种通过回流焊接将电子部件焊接在基板上的焊接方法，其包括在基板上涂敷焊膏的工序; 通过使用焊膏将电子部件安装在基板上; 在电子部件上设置热容量增强部件，该热容增强部件包括能够提高电子部件的热容量的凝胶状材料; 以及通过在其上施加热容增强部件的回流焊将电子部件焊接到基板上。

公开(公告)号：US07564337B2

公开(公告)日：2009-07-21

申请号：US11072553

申请日：2005-03-03

Applicant: Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

Inventor： Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

IPC: H01H85/143 ,  H01H85/48

CPC classification number: H05K3/301 ,  H01H85/0418 ,  H01H85/202 ,  H01H2085/0414 ,  H01H2085/2085 ,  H05K3/3426 ,  H05K2201/062 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.

Abstract translation: 在本发明的一个方面，通过连接到保险丝端盖的夹子将超小型保险丝焊接到PCB。 夹子物理连接到PCB焊盘，使熔断器可以更换，如果需要，并提供保险丝和加热焊锡/ PCB焊盘之间的热解耦。 保险丝和夹子也可以被拾取并放置在一个操作中。 在另一方面，提供了改进的熔断器夹，其包括将夹子的壳体部分与加热凹陷焊料/ PCB焊盘分离的突片。 这种改进的夹子进一步增强了热解耦。 在另一方面，提供了一种改进的保险丝，其中刚刚描述的热去耦接头直接与保险丝一起提供。 在另一方面，提供了一种热绝缘熔丝体，以进一步使熔丝元件与其周围环路分离。

公开(公告)号：US20090176384A1

公开(公告)日：2009-07-09

申请号：US12097960

申请日：2005-12-22

Applicant: Yoshihito Fujiwara ,  Masahito Kawabata

Inventor： Yoshihito Fujiwara ,  Masahito Kawabata

IPC: H01R12/00 ,  H05K1/16

CPC classification number: H05K3/361 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/09145 ,  H05K2203/0278

Abstract: The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structure 10 of a circuit board comprises a first circuit board 11 and a second circuit board 12, with a first connecting part 15 and a second connecting part 16 opposedly disposed via an adhesive 13. The first connecting part 15 and the second connecting part 16 are pinched by a pair of pressurizing jigs 20 and subjected to hot pressure welding so that first circuit patterns 17 and second circuit patterns 18 are in contact with each other. In the connecting structure 10 of the circuit board, the first circuit board 11 is a soft base material 21, and a heat-insulating layer 28, having lower thermal conductivity than the soft base material 21, is provided on only a part 27 of the region corresponding to the first connecting part 15 on the rear surface 21B of the soft base material 21.

Abstract translation: 本发明提供了一种电路板的连接结构，电路板的连接部分和能够在热压焊接下减轻连接部件之间的温差的电子设备。 电路板的连接结构10包括第一电路板11和第二电路板12，第一连接部分15和第二连接部分16经由粘合剂13相对设置。第一连接部分15和第二连接部分 16被一对加压夹具20夹紧，并进行热压焊，使得第一电路图案17和第二电路图案18彼此接触。 在电路基板的连接结构体10中，第一电路基板11是软质基材21，仅在软质基材21的热传导率较低的隔热层28上设置 对应于软基材21的背面21B上的第一连接部15的区域。

公开(公告)号：US20080264683A1

公开(公告)日：2008-10-30

申请号：US12148804

申请日：2008-04-22

Applicant: Tatsuya Watanabe ,  Masahiko Imoto ,  Hideyuki Iiboshi ,  Shinichi Awano

Inventor： Tatsuya Watanabe ,  Masahiko Imoto ,  Hideyuki Iiboshi ,  Shinichi Awano

IPC: H05K1/16 ,  H05K3/20

CPC classification number: H05K3/3442 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/183 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09745 ,  H05K2201/10636 ,  H05K2201/2081 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.

Abstract translation: 金属布线板包括焊接电子器件的焊接部分和从焊接部分延伸的配线部分，并且将电子器件电连接到其他器件。 布线部分包括邻近焊接部分的窄部分。 窄部分的宽度小于焊接部分的宽度，使得窄部分有助于防止施加到焊接部分的熔融焊料扩散到焊接部分外部的区域。 狭窄部分允许电子设备可靠地焊接到焊接部分而不使用阻焊剂。

公开(公告)号：US20080190656A1

公开(公告)日：2008-08-14

申请号：US11579727

申请日：2005-05-06

Applicant: David Cheeke ,  Leslie M. Landsberger

Inventor： David Cheeke ,  Leslie M. Landsberger

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/167 ,  H05K1/0212 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/062 ,  H05K2203/171 ,  Y10T29/49155

Abstract: There is described a printed circuit board with a thermally trimmable component embedded therein. A layer of refractory insulating material is provided to provide mechanical support and chemical passivation for the thermally trimmable component. The component is trimmed by applying a sequence of heat pulses the a heating element, which could be the component itself or a separate element. A cavity may be burned in the substrate to provide thermal isolation for the thermally trimmable component.

Abstract translation: 描述了嵌入其中的可热调制组件的印刷电路板。 提供一层难熔绝缘材料，为热可调节部件提供机械支撑和化学钝化。 通过施加加热元件的加热元件序列来修剪部件，加热元件可以是部件本身或单独的元件。 空腔可以在基板中燃烧以提供热可分离组件的热隔离。

公开(公告)号：US07409661B2

公开(公告)日：2008-08-05

申请号：US11308769

申请日：2006-05-01

Applicant: Lee-Chieh Kang

Inventor： Lee-Chieh Kang

IPC: G06F17/50

CPC classification number: H05K3/0005 ,  G06F17/5068 ,  H05K1/0201 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969

Abstract: A computer-aided thermal relief pad design system includes a depicting unit, a memory unit and a calculating unit. The depicting unit is used for depicting an elongated oval pattern of a thermal relief pad. The elongated oval pattern includes two perpendicular axes that intersect at a center point, and a plurality of terminals. The memory unit is used for storing formulae defining relationships between lengths of the two axes and coordinates of the terminals. The coordinates of the terminal define positions of the terminals relative to the center point. The calculating unit is used for calculating the coordinates of the terminals based on the formulae stored in the memory unit.

Abstract translation: 计算机辅助热释放垫设计系统包括描绘单元，存储单元和计算单元。 描绘单元用于描绘热释放垫的细长椭圆形图案。 细长的椭圆形图案包括在中心点相交的两个垂直轴和多个端子。 存储单元用于存储定义两个轴的长度和端子的坐标之间的关系的公式。 端子的坐标定义端子相对于中心点的位置。 计算单元用于基于存储在存储单元中的公式来计算终端的坐标。

公开(公告)号：US20080107867A1

公开(公告)日：2008-05-08

申请号：US11935352

申请日：2007-11-05

Applicant: Fred Miekka

Inventor： Fred Miekka

IPC: B32B3/00

CPC classification number: H05K1/0203 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/341 ,  H05K3/386 ,  H05K2201/0215 ,  H05K2201/0373 ,  H05K2201/062 ,  H05K2201/083 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/24355

Abstract: Low profile circuit boards having heat dissipative properties are disclosed having numerous discrete heat dissipating bonding zones. These electric circuit boards help dissipate heat from individual components such as transistors. Thermally conductive protrusions that may have an ultra low profile may be employed to promote bonding and remove heat. The resulting circuit boards are compact and have good heat dissipating properties. The ultra low profile protrusions disclosed in the present invention may also be used in other applications as well.

Abstract translation: 公开了具有散热特性的薄型电路板，其具有许多分散的散热接合区域。 这些电路板有助于从单个组件（如晶体管）散发热量。 可以使用可能具有超低轮廓的导热突起来促进结合并除去热。 所得到的电路板是紧凑的并且具有良好的散热性能。 本发明中公开的超低轮廓突起也可以用于其他应用中。