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公开(公告)号：US11955740B2
公开(公告)日：2024-04-09
申请号：US17835530
申请日：2022-06-08
Applicant: Hitachi Metals, Ltd.
Inventor： Ryuta Takahashi
CPC classification number: H01R12/53 , A61M39/10 , H01R43/0263 , H05K1/11 , H05K1/18 , A61M2039/1022 , H01R4/023 , H01R4/04 , H05K2201/094 , H05K2201/09409 , H05K2201/09445 , H05K2201/10287 , H05K2201/10356
Abstract: An electric wire connection structure is composed of insulated electric wires each including a core and an insulation coating covering the core. The cores of the insulated electric wires are connected to pads provided on a substrate. The insulated electric wires are arranged along a predetermined alignment direction and arranged parallel to each other. The insulation coating is removed at a part in a longitudinal direction of each of the insulated electric wires to expose the core. Exposed portions of the cores are connected to the pads, respectively. Some of the insulated electric wires are configured in such a manner that the core is exposed in an area where the insulation coatings of adjacent ones of the other insulated electric wires in the alignment direction are not removed.
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142.发明公开公开(公告)号：US20230361516A1
公开(公告)日：2023-11-09
申请号：US18021948
申请日：2021-07-30
Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor： Shinji NOZAKI , Kenji MAKINO
CPC classification number: H01R24/60 , H01R12/778 , H01R43/205 , H05K1/118 , H05K2201/056 , H05K2201/09445
Abstract: It is aimed to provide a connection structure for flexible printed board and a method for manufacturing a flexible printed board unit, which are hardly affected by dimensional tolerances between adjacent contacts and capable of preventing a size increase. A flexible printed board includes a first constituent portion having a plurality of first contacts arrayed along a lateral direction provided on a front surface and a second constituent portion disposed side by side with the first constituent portion in a front-rear direction and having a plurality of second contacts arrayed along the lateral direction provided on a front surface. A supporting portion supports the flexible printed board in a folded state such that a back surface of the first constituent portion and a back surface of the second constituent portion face each other. The first contacts and the second contacts are arranged in a staggered manner along the lateral direction.
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公开(公告)号：US11764540B2
公开(公告)日：2023-09-19
申请号：US17620729
申请日：2020-06-30
Applicant: LANDA LABS (2012) LTD.
Inventor： Ronny Costi , Gilad Reut Gelbart
IPC: H01S5/02315 , H01S5/0237 , H01S5/02345 , H01S5/02 , H01S5/024 , H05K1/02 , H05K1/11 , H05K3/42
CPC classification number: H01S5/02315 , H01S5/0216 , H01S5/0237 , H01S5/02345 , H01S5/02469 , H01S5/02476 , H05K1/0206 , H05K1/0209 , H05K1/113 , H05K1/118 , H05K3/422 , H05K2201/09445 , H05K2201/09509 , H05K2203/073
Abstract: A method is disclosed for mounting and cooling a circuit component having a plurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive material having and electrically insulating regions with a circuit board arranged between the circuit component and the substrate. The circuit board, which carries conductive traces that terminate in contact pads, is secured to the substrate with at least some of the contact pads on the circuit board disposed on the side of the board facing the substrate, some of which being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate.
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公开(公告)号：US11723147B2
公开(公告)日：2023-08-08
申请号：US17667486
申请日：2022-02-08
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Chia-Shuai Chang , Chien-Chen Lee , Jui-Hung Hsu
CPC classification number: H05K1/111 , G02B7/006 , G02B7/02 , H05K1/0274 , H05K2201/09409 , H05K2201/09445 , H05K2201/10121 , H05K2201/10151
Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.
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公开(公告)号：US20230209712A1
公开(公告)日：2023-06-29
申请号：US17911425
申请日：2021-12-29
Inventor： Youyuan TAN , Zhifang YU , Wenjie LIANG
IPC: H05K1/11
CPC classification number: H05K1/117 , H05K2201/1034 , H05K2201/09445
Abstract: Provided is a double-sided plastic package power supply product, including a PCB, a plastic package body, electric contacts and pins, wherein the electric contact is connected to the pin and the PCB; the pin includes a plastic body and a metal body; the metal body is embedded in the plastic body; the plastic body is used to limit the metal body; and one end of the metal body is connected to the electric contact, and the other end of the metal body is used as a plug pin. A metal terminal is connected to a PCB substrate and wrapped in the plastic package body, and the surface of the portions of the metal terminal that protrude from the PCB substrate can be exposed on the surface of the product by means of cutting or thinning so as to form the electric contacts.
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Patent Agency Ranking
公开(公告)号：US20190207334A1
公开(公告)日：2019-07-04
申请号：US16125895
申请日：2018-09-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung-wan KOH , Seok-heon LEE , Seok-jae Han
CPC classification number: H01R12/714 , H01R12/7005 , H01R13/2442 , H05K1/11 , H05K2201/094 , H05K2201/09409 , H05K2201/09445 , H05K2201/09827 , H05K2201/09863 , H05K2201/10159
Abstract: A memory card includes a substrate, first row terminals and second row terminals. The substrate has a first pair of side edges extending in a first direction and a second pair of side edges extending in a second direction perpendicular to the first direction. The first row terminals are arranged adjacent to an insertion side edge of the substrate, the first row terminals including a first power terminal, the insertion side edge being one of the first pair of side edges. The second row terminals are arranged further from the insertion side edge than the first row terminals, the second row terminals including a second power terminal. At least one terminal among the first and second row terminals includes a recess area in an exposed surface of the at least one terminal.
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公开(公告)号：US20180288872A1
公开(公告)日：2018-10-04
申请号：US15997585
申请日：2018-06-04
Applicant: Sakai Display Products Corporation
Inventor： Nobuhiro YONEZAWA
IPC: H05K1/11 , G02F1/133 , G02F1/1343
CPC classification number: H05K1/11 , G02F1/13306 , G02F1/133514 , G02F1/1343 , G02F1/13458 , G09G3/36 , G09G3/3607 , H05K1/118 , H05K3/323 , H05K3/361 , H05K2201/09381 , H05K2201/09445 , H05K2201/097
Abstract: The terminal connection structure includes a first terminal group 80 including a plurality of first terminals 81 aligned side-by-side, and a second terminal group 110 including a plurality of second terminals 112 aligned side-by-side and connected to the plurality of first terminals 81, the second terminal group 110 opposing to the first terminal group 80 and electrically connected to the first terminal group 80 via an anisotropic conductive film, wherein each of the first terminals 81 has a recess-projection shape and each of the second terminals 112 has a recess-projection shape, two adjacent first terminals 81A, 81B have different and corresponding shapes with each other, and two adjacent second terminals 112A, 112B have different and corresponding shapes with each other.
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公开(公告)号：US20180180684A1
公开(公告)日：2018-06-28
申请号：US15390388
申请日：2016-12-23
Applicant: BIOSENSE WEBSTER (ISRAEL) LTD.
Inventor： Assaf Govari
IPC: G01R33/02 , H05K1/11 , H05K1/14 , H05K1/16 , H05K3/40 , H05K3/10 , H05K3/20 , H01F5/00 , H01F41/04 , G01R33/00
CPC classification number: G01R33/0206 , A61B1/04 , A61B5/0402 , A61B5/062 , A61B5/6847 , A61B2562/0223 , A61B2562/046 , G01R33/0005 , G01R33/0052 , H01F5/003 , H01F41/041 , H05K1/028 , H05K1/115 , H05K1/118 , H05K1/144 , H05K1/165 , H05K3/103 , H05K3/20 , H05K3/4038 , H05K2201/0154 , H05K2201/051 , H05K2201/056 , H05K2201/09445 , H05K2201/096 , H05K2201/09672 , H05K2201/10151
Abstract: Apparatus, including a flexible insulating substrate, having a first side and a second side, rolled about an axis parallel to the substrate. The apparatus also includes a first conducting spiral that is right-handed relative to a normal to the substrate, and a second conducting spiral that is left-handed relative to the normal, formed on the first side of the substrate. The first conducting spiral has a first initial termination and a first final termination, the second conducting spiral has a second initial termination and a second final termination, the spirals have a displacement therebetween, with a preset magnitude so that when the substrate is rolled about the axis the first initial termination aligns with the second initial termination. The apparatus also has a via penetrating the substrate from the first side to the second side so as to interconnect the first initial termination and the second initial termination.
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公开(公告)号：US20170318679A1
公开(公告)日：2017-11-02
申请号：US15523472
申请日：2015-10-29
Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
Inventor： Yoshiki SANTO
CPC classification number: H05K1/181 , B25J9/16 , H05K1/111 , H05K1/18 , H05K2201/09372 , H05K2201/09436 , H05K2201/09445 , H05K2201/10212 , H05K2201/10545 , H05K2201/10704
Abstract: A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other. A plurality of signal input pins are provided to the first edge portion, a plurality of signal output pins are provided to the third edge portion, a plurality of between-element communication input pins are provided to the second edge portion, and a plurality of between-element communication output pins are provided to the fourth edge portion, respectively. A common signal is input to the first and second elements and a communication is performed between the first element and the second element. Loss of control function can be surely prevented while suppressing enlargement of the board and increase of development/production cost.
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公开(公告)号：US09723712B2
公开(公告)日：2017-08-01
申请号：US14559837
申请日：2014-12-03
Applicant: Samsung Display Co. Ltd.
Inventor： Dong Beom Cho
CPC classification number: H05K1/028 , H05K1/111 , H05K1/147 , H05K1/189 , H05K3/361 , H05K2201/09418 , H05K2201/09427 , H05K2201/09445 , H05K2201/10136 , Y02P70/611
Abstract: A curved display device is provided. The curved display device includes: a curved display panel configured to have short sides and long sides; a printed circuit board (PCB) configured to provide signals for driving the curved display panel; and a flexible wiring board including a first portion, which is connected to a first area, a second portion, which is connected to the PCB, and a third portion, which is disposed between the first portion and the second portion and has curved sides, wherein a curvature radius of a first side of the curved sides differs from a curvature radius of a second side of the curved sides.
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