公开(公告)号：US20160143179A1

公开(公告)日：2016-05-19

申请号：US14543089

申请日：2014-11-17

Applicant: Tyco Electronics Corporation

Inventor： Abraham L. Shocket ,  Lyle S. Bryan ,  John S. Cowan ,  Kevin J. Peterson

IPC: H05K7/20 ,  H05K1/18 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K1/181 ,  H01R12/515 ,  H05K1/0203 ,  H05K5/0069 ,  H05K7/20854 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10537

Abstract: An electrical assembly configured to be fixed in a housing of an electrical connector includes an electrical package disposed on a substrate and electrically connected to the substrate. The electrical assembly also includes a conductor terminated to the substrate at a spaced apart location from the electrical package to provide at least one of power or control signals to the substrate. A terminating segment of the conductor is thermally coupled to the electrical package to receive heat generated at the electrical package and dissipate the heat through the conductor away from the electrical package.

Abstract translation: 构造成固定在电连接器的壳体中的电组件包括设置在基板上并电连接到基板的电气封装。 电组件还包括在与电气封装间隔开的位置处终止于衬底的导体，以向衬底提供功率或控制信号中的至少一个。 导体的端接部分热耦合到电气封装，以接收在电气封装处产生的热量，并将热量通过导体散发远离电气封装。

公开(公告)号：US20160111803A1

公开(公告)日：2016-04-21

申请号：US14896420

申请日：2014-05-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Konrad Wagner ,  Jürgen Holz

IPC: H01R13/405 ,  H05K7/02 ,  H05K1/03 ,  H01R4/24 ,  H01R24/58 ,  H05K1/18 ,  H01R12/71

CPC classification number: H01R13/405 ,  H01R4/2404 ,  H01R4/2479 ,  H01R12/718 ,  H01R24/58 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/056 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/325 ,  H05K3/368 ,  H05K7/02 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10409

Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.

Abstract translation: 光电布置包括布置在第一电路板上的第一电路板，第二电路板和光电子半导体芯片，其中第一电接触表面和第二电接触表面形成在第一电路板的表面上， 第一配合接触表面和第二配合接触表面形成在第二电路板的表面上，并且第一电路板和第二电路板彼此连接，使得第一电路板的表面面向 第二电路板，并且第一配合接触表面导电地连接到第一接触表面，并且第二配合接触表面导电地连接到第二接触表面。

公开(公告)号：US09178287B2

公开(公告)日：2015-11-03

申请号：US13937496

申请日：2013-07-09

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Masato Tanaka

IPC: H01R4/00 ,  H01R9/03 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01R4/00 ,  H01R9/034 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/094 ,  H05K2201/09809 ,  H05K2201/10356

Abstract: A multi-core cable assembly is formed by arranging a plurality of cables side by side and connecting the cables to a substrate 30 which is a connection member. The plurality of cables configure flat cable units 10, 20 for each diameter of cables, and ground bars 16, 27 are fixed thereto so as to be electrically connected with a shield member included in the cable. Each of ground bars 16, 27 are electrically connected to a ground pad 31 of the substrate 30. The ground bars 16, 27 adjacent to each other are disposed to be shifted in a longitudinal direction of the cable. In addition, two ground bars 16, 27 interposing the other one ground bar and positioned at both sides thereof are disposed in a position overlapped in the longitudinal direction of the cables.

Abstract translation: 多芯电缆组件通过并排布置多根电缆并将电缆连接到作为连接部件的基板30而形成。 多个电缆为每个电缆直径构成扁平电缆单元10,20，并且接地棒16,27被固定到其上以与包括在电缆中的屏蔽构件电连接。 接地棒16,27中的每一个电连接到基板30的接地焊盘31.彼此相邻的接地棒16,27设置成沿电缆的纵向移动。 另外，插入另一个接地棒并位于其两侧的两个接地棒16,27设置在与电缆的纵向重叠的位置。

公开(公告)号：US09144155B2

公开(公告)日：2015-09-22

申请号：US13880348

申请日：2011-10-10

Applicant: Sabine Schmideder ,  Torsten Thelemann ,  Josef Nagl ,  Heinrich Aschenbrenner ,  Reinhold Hoenicka

Inventor： Sabine Schmideder ,  Torsten Thelemann ,  Josef Nagl ,  Heinrich Aschenbrenner ,  Reinhold Hoenicka

IPC: H05K7/10 ,  H05K1/18 ,  B81B7/00 ,  B81C1/00 ,  H05K3/40 ,  H05K3/32 ,  H05K1/03 ,  H05K3/34 ,  H05K3/46 ,  H05K1/16

CPC classification number: H05K1/181 ,  B81B7/0006 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/32 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4629 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10356 ,  Y10T29/49128 ,  H01L2924/00

Abstract: A sensor comprises a preferably multi-layer ceramic substrate (2) and at least one sensor element (1) arranged in, at, or on the ceramic substrate (2). The sensor element (1) can be contacted via a metallic contact (6), with the metallic contact (6) being produced via a soldering connection, which electrically connects the contact (6) with the sensor element (1) and here generates a fixed mechanic connection of the contact (6) in reference to the ceramic substrate (2). Furthermore, a method is claimed for producing the sensor according to the invention.

Abstract translation: 传感器包括优选多层陶瓷衬底（2）和布置在陶瓷衬底（2）上，之中或之上的至少一个传感器元件（1）。 传感器元件（1）可以经由金属触点（6）接触，金属触点（6）通过焊接连接产生，焊接连接将触点（6）与传感器元件（1）电连接，并且这里产生 触点（6）相对于陶瓷基板（2）的固定机械连接。 此外，要求保护用于制造根据本发明的传感器的方法。

公开(公告)号：US20150160412A1

公开(公告)日：2015-06-11

申请号：US14097772

申请日：2013-12-05

Applicant: Ronald Steven Cok ,  Todd Mathew Spath

Inventor： Ronald Steven Cok ,  Todd Mathew Spath

IPC: G02B6/122 ,  G02B6/42

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: An imprinted optical micro-channel structure for transmitting light to an optical receiver or receiving light from an optical transmitter includes a substrate and a cured optical layer formed in relation to the substrate. The cured optical layer includes one or more optical micro-channels imprinted in the cured optical layer. Each optical micro-channel includes a cured light-transparent material forming a light-pipe that transmits light in the optical micro-channel. The optical transmitter is located in alignment with a light-pipe for transmitting light through the light-pipe or the optical receiver is located in alignment with a light-pipe for receiving light from the light-pipe.

Abstract translation: 用于将光传输到光接收器或从光发射器接收光的印刷光学微通道结构包括基板和相对于基板形成的固化光学层。 固化的光学层包括印刷在固化的光学层中的一个或多个光学微通道。 每个光学微通道包括形成在光学微通道中透射光的光管的固化透光材料。 光发射器与光管对准，用于通过光管传输光，或者光接收器与用于接收来自光管的光的光管对准。

公开(公告)号：US09049787B2

公开(公告)日：2015-06-02

申请号：US13745352

申请日：2013-01-18

Applicant: Molex Incorporated

Inventor： Mark Alan Bugg

IPC: H05K1/09 ,  H05K1/02 ,  H01R9/03 ,  H01R13/6474

CPC classification number: H05K1/0216 ,  H01R9/032 ,  H01R12/57 ,  H01R12/62 ,  H01R12/775 ,  H01R13/6474 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/112 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09218 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09727 ,  H05K2201/10356

Abstract: A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair of points to which cable wire free ends may be terminated, such as by soldering. The spacing of the pads apart from each other in effect reduces to amount of capacitance in the cable wire termination area on the circuit board, thereby reducing the impedance and insertion loss in that area at high frequencies. The contact pads of each pair may be further interconnected together by a thin, conductive trace that extends lengthwise between the contact pads.

Abstract translation: 公开的用于将电子设备连接在一起的桨卡结构。 桨卡采取电路板的形式，其具有成对地布置在其上的多个导电接触垫。 每对的接触垫彼此间隔开以提供一对点，电缆线自由端可以通过焊接方式终止于该点。 彼此分开的焊盘的间隔实际上减少到电路板上的电缆线端接区域中的电容量，从而降低了在该区域的高频下的阻抗和插入损耗。 每对的接触垫可以通过在接触垫之间纵向延伸的薄导电迹线进一步互连在一起。

公开(公告)号：US09011177B2

公开(公告)日：2015-04-21

申请号：US13987296

申请日：2011-02-14

Applicant: Brian Keith Lloyd ,  Christopher David Hirschy ,  Munawar Ahmad ,  Eran J. Jones ,  Stephen W. Hamblin ,  Darian Ross Schulz ,  Todd David Ward ,  Gregory B. Walz ,  Ebrahim Abunasrah ,  Rehan M. Khan

Inventor： Brian Keith Lloyd ,  Christopher David Hirschy ,  Munawar Ahmad ,  Eran J. Jones ,  Stephen W. Hamblin ,  Darian Ross Schulz ,  Todd David Ward ,  Gregory B. Walz ,  Ebrahim Abunasrah ,  Rehan M. Khan

IPC: H01R13/58 ,  H01B11/00 ,  H01R13/6593 ,  H05K1/02 ,  H05K3/22

CPC classification number: H01R13/6461 ,  H01B11/00 ,  H01R13/6471 ,  H01R13/6592 ,  H01R13/6593 ,  H05K1/0243 ,  H05K3/222 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2201/10674

Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.

Abstract translation: 公开了一种电缆旁路组件，用于提供用于将电子设备的板安装的连接器连接到设备板上的芯片的高速传输线。 旁路电缆组件具有允许它的结构，其中它终止于板安装的连接器和芯片构件，或者紧靠其附近，以紧密地复制电缆的几何形状。 连接器端子布置成与电缆信号导体对准，并且设置屏蔽延伸部，使得可以在电缆信号导体和电路板连接器端子尾部之间的终端之间提供屏蔽。 类似地，在电缆的相对端处提供类似的端接结构，其中一对端子由第二连接器主体支撑并封闭在屏蔽环中。 屏蔽套环具有接合电缆第二端的延伸部。

公开(公告)号：US20150084200A1

公开(公告)日：2015-03-26

申请号：US14032239

申请日：2013-09-20

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: H01L23/538

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: A method of making a multi-level micro-wire structure includes imprinting first micro-channels in a curable first layer over a substrate with a first stamp, curing the first layer, and locating and curing a curable conductive ink in the first micro-channels to form first micro-wires. Second micro-channels are imprinted in a curable second layer in contact with the first layer with a second stamp, the second layer is cured, and a curable conductive ink is located and cured in the second micro-channels to form second micro-wires. At least one of the second micro-channels contacts at least one first micro-wire and a second micro-wire in at least one of the second micro-channels is in electrical contact with at least one first micro-wire.

Abstract translation: 一种制造多级微线结构的方法包括：在第一印模上固化第一层，并在第一微通道中固化和固化可固化的导电油墨，将可固化的第一层中的第一微通道压印在衬底上; 以形成第一微线。 将第二微通道印刷在与第一层接触的可固化第二层中，第二印模固化，并且可固化导电油墨在第二微通道中定位和固化以形成第二微细线。 第二微通道中的至少一个与至少一个第二微通道中的至少一个第一微线和第二微线接触，与至少一个第一微线电接触。

公开(公告)号：US08878065B2

公开(公告)日：2014-11-04

申请号：US13541887

申请日：2012-07-05

Applicant: Gwun Jin Lin

Inventor： Gwun Jin Lin

IPC: H01B7/00

CPC classification number: H05K1/0219 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/051 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/10356

Abstract: Disclosed is a flexible circuit cable with at least two bundled wire groups. The circuit cable has first and second ends respectively connected to first and second connection sections. The circuit cable includes a cluster section, which is formed of a plurality of cluster wires formed by slitting the circuit cable, in an extension direction of the cable, at a predetermined cut width. The cluster section includes at least two independent bundles, which are formed by dividing the cluster wires of the circuit cable into different signal groups according to electrical signals transmitted therethrough. Bundling members are used to the cluster wires of the independent bundles according to predetermined bundling modes. Further, the circuit cable has a surface forming a shielding conductive layer for electromagnetic interference protection and impedance control for internal signals of the circuit cable.

Abstract translation: 公开了具有至少两个捆扎线组的柔性电路电缆。 电路电缆具有分别连接到第一和第二连接部分的第一和第二端。 电路电缆包括簇部分，其由沿着电缆的延伸方向以预定切割宽度分割电路电缆形成的多个簇线形成。 集群部分包括至少两个独立的束，其通过根据从其传输的电信号将电路电缆的群线分成不同的信号组而形成。 根据预定捆绑模式，捆绑成员用于独立捆绑的群集线。 此外，电路电缆具有形成用于电磁干扰保护的屏蔽导电层和电路电缆的内部信号的阻抗控制的表面。

公开(公告)号：US08844883B2

公开(公告)日：2014-09-30

申请号：US13585104

申请日：2012-08-14

Applicant: Kenji Tsutsumi

Inventor： Kenji Tsutsumi

IPC: F16L3/08 ,  H02G3/32 ,  G02B6/46 ,  H02G3/00 ,  H05K1/14

CPC classification number: H02G3/32 ,  G02B6/46 ,  H02G3/26 ,  H05K1/148 ,  H05K2201/10356

Abstract: A cable holder includes: a pair of arm portions to form a holding space for holding a cable; and a guide portion, provided at an end portion of each of the pair of guide portions to block the holding space, to guide the cable into the holding space while elastically deforming the pair of arm portions in directions in which the pair of arm portions move away from each other when contacting with the cable.

Abstract translation: 电缆架包括：一对臂部，以形成用于保持电缆的保持空间; 以及引导部，设置在所述一对引导部的每一个的端部处以阻挡所述保持空间，以将所述电缆引导到所述保持空间中，同时在所述一对臂部移动的方向上弹性变形所述一对臂部 与电缆接触时彼此远离。