公开(公告)号：US20010053565A1

公开(公告)日：2001-12-20

申请号：US09885000

申请日：2001-06-21

Inventor： Theodore A. Khoury

IPC: H01L021/44 ,  H01L023/02

CPC classification number: H05K3/366 ,  H01L23/13 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01R13/514 ,  H05K1/142 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2203/041 ,  H05K2203/049 ,  H05K2203/167 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. In addition, the interlocking edges can be a ridge member or a ridge recess, where the ridge member or ridge recess is securely received by a respective ridge recess or ridge member of an adjacent IC module to create a structural connection between the IC modules. The interconnection edge can also be a combination of the ridge member, ridge recess, and/or the rows of teeth and recesses. The attachment surfaces of adjacent IC modules can be co-planar and non-planar, depending on the shape desired. The elements on the IC modules communicate using external pathways and/or internal pathways using conventional wire-bond techniques or using conductive layers within the IC module. The IC module is formed of conventional Si wafers. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in a housing, and has improved speed due to reduced pathway lengths.

Abstract translation: 一种具有多个IC模块的集成电路（IC），每个IC模块具有连接IC的元件的附接表面，并且每个IC模块具有与附接表面相邻的互锁边缘。 相邻IC模块的互锁边缘互锁，形成IC模块之间的结构连接。 互锁边缘是排成行的多个齿和凹槽。 齿通过相邻的互锁边缘中的相应凹槽被牢固地接收，以在相邻的IC模块之间产生结构连接。 此外，互锁边缘可以是脊部件或脊部凹部，其中脊部件或脊部凹部被相邻IC模块的相应脊部凹部或脊部构件牢固地接收，以在IC模块之间形成结构连接。 互连边缘还可以是脊部件，脊部凹部和/或齿排和凹槽的组合。 取决于所需的形状，相邻IC模块的附接表面可以是共面的和非平面的。 IC模块上的元件使用常规引线键合技术或在IC模块内使用导电层，使用外部路径和/或内部路径进行通信。 IC模块由常规的Si晶片形成。 使用这种配置，可以构造出利用较少的空间，适合于壳体中的非平面空间并且由于减小的路径长度而具有改进的速度的IC。

公开(公告)号：US06304082B1

公开(公告)日：2001-10-16

申请号：US09366297

申请日：1999-08-02

Applicant: Devlin M. Gualtieri ,  Robert E. Kollmyer

Inventor： Devlin M. Gualtieri ,  Robert E. Kollmyer

IPC: G01R3302

CPC classification number: B82Y25/00 ,  G01R33/0206 ,  G01R33/06 ,  G01R33/093 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10446

Abstract: A multi-axis magnetometer is provided having three magnetic field sensing circuits for sensing a magnetic field along the X, Y and Z axes. Each magnetic field sensing circuit includes an operational amplifier and a bridge chip having at least one electrical conductor. The operational amplifier is electrically connected to the at least one electrical conductor of the bridge chip for receiving a portion of a current flowing through the at least one electrical conductor. The operational amplifier provides an output voltage based on a magnitude of the portion of the current flowing through the at least one electrical conductor. The multi-axis magnetometer further includes a voltage regulator for providing an operating voltage. A method is also provided for fabricating the multi-axis magnetometer which includes the steps of providing at least one bridge chip having at least one electrical conductor on a motherboard; providing at least one operational amplifier to the motherboard; electrically connecting the at least one electrical conductor to the at least one operational amplifier; providing at least one bridge chip having at least one electrical conductor on a daughterboard; providing at least one operational amplifier to the daughterboard; electrically connecting the at least one electrical conductor of the at least one bridge chip on the daughterboard to the at least one operational amplifier on the daughterboard; and attaching the daughterboard to the motherboard.

Abstract translation: 提供具有三个用于感测沿着X，Y和Z轴的磁场的磁场感测电路的多轴磁力仪。 每个磁场感测电路包括运算放大器和具有至少一个电导体的桥接芯片。 运算放大器电连接到桥接芯片的至少一个电导体，用于接收流过至少一个电导体的电流的一部分。 运算放大器基于流经至少一个电导体的电流的一部分的大小提供输出电压。 多轴磁力仪还包括用于提供工作电压的电压调节器。 还提供了一种用于制造多轴磁力计的方法，其包括以下步骤：在母板上提供至少一个具有至少一个电导体的桥芯片; 向主板提供至少一个运算放大器; 将所述至少一个电导体电连接到所述至少一个运算放大器; 提供至少一个在子板上具有至少一个电导体的桥芯片; 向所述子板提供至少一个运算放大器; 将所述子板上的所述至少一个桥接芯片的所述至少一个电导体电连接到所述子板上的所述至少一个运算放大器; 并将子板连接到主板。

公开(公告)号：US20010008043A1

公开(公告)日：2001-07-19

申请号：US09788808

申请日：2001-02-20

Inventor： Yukiko Daido ,  Yoshihisa Hatta

IPC: H05K003/30

CPC classification number: H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/34 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10446 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A method of making a circuit board (10) on which surface electronic components (15) are mounted during the method using a solder reflow process. The board comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction that the board travels during the reflow direction (16), thereby preventing electronic component soldering failures that may occur as a result of the deflection of the circuit board during the reflow process.

Abstract translation: 一种制造电路板（10）的方法，在该方法期间使用焊料回流工艺安装表面电子部件（15）。 板包括电路部分（12），周围圆周部分（13）和形成在围绕圆周部分的至少一个细长开口（14），其基本上平行于板在回流方向（16）处行进的方向，从而 防止在回流过程中由于电路板的偏转而可能发生的电子部件焊接故障。

公开(公告)号：US06246334B1

公开(公告)日：2001-06-12

申请号：US09299162

申请日：1999-04-26

Applicant: Andy Saffarian

Inventor： Andy Saffarian

IPC: G08B522

CPC classification number: H05K1/0266 ,  G06F1/181 ,  H05K1/18 ,  H05K7/1455 ,  H05K2201/044 ,  H05K2201/10128 ,  H05K2201/10446

Abstract: An improved board ID number display mechanism whereby an LCD or LED or similar display is utilized on the backplane of a circuit card. The display is viewable for outside the computer case, making it possible to ascertain the board's ID number without having to open up the computer case and examine jumper or switch patterns.

Abstract translation: 改进的电路板ID号显示机构，由此在电路卡的背板上利用LCD或LED或类似显示器。 显示器可以在计算机机箱外面查看，使得可以确定电路板的ID号码，而无需打开电脑机箱并检查跳线或开关模式。

公开(公告)号：US06222732B1

公开(公告)日：2001-04-24

申请号：US08064010

申请日：1993-05-14

Applicant: Gert Jakob ,  Joachim Zimmermann ,  Friedrich Horn ,  Hans Rummel ,  Thomas Sutter ,  Dieter Karr ,  Karl Schupp ,  Dieter Neuhaus ,  Dieter Hussmann ,  Peter Jares

Inventor： Gert Jakob ,  Joachim Zimmermann ,  Friedrich Horn ,  Hans Rummel ,  Thomas Sutter ,  Dieter Karr ,  Karl Schupp ,  Dieter Neuhaus ,  Dieter Hussmann ,  Peter Jares

IPC: H05K720

CPC classification number: H05K7/20854 ,  H05K1/0209 ,  H05K1/18 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10446

Abstract: The electrical unit has a printed circuit board (10) supporting the circuit, which includes a power component (11) which generates heat. In order to dissipate this heat from the power component, the power component rests on a heat conductive layer (13) which in turn is applied to the upper side (12) of the printed circuit board. This heat conductive layer further has a portion of the lid (18, 19) of the housing resting on it, which serves as a cooling area. Alternatively, the cooling area can be a free-standing cooling element. The heat transfer thus takes place via the heat conductive layer (13) to the cooling element (18, 19) so that the latter may be applied and formed independently of type and form of the power component.

Abstract translation: 电气单元具有支撑电路的印刷电路板（10），其包括产生热量的功率部件（11）。 为了从功率部件散发这种热量，功率部件放置在导热层（13）上，导热层（13）又被施加到印刷电路板的上侧（12）。 该导热层还具有壳体的盖子（18,19）的一部分位于其上，其作为冷却区域。 或者，冷却区域可以是独立冷却元件。 因此，热传递通过导热层（13）发生到冷却元件（18,19），使得后者可以独立于功率部件的类型和形式被施加和形成。

公开(公告)号：US6118651A

公开(公告)日：2000-09-12

申请号：US998047

申请日：1997-12-24

Applicant: Vivek Mehrotra ,  Jose Azevedo ,  Shri Sridhar

Inventor： Vivek Mehrotra ,  Jose Azevedo ,  Shri Sridhar

IPC: H01G9/28 ,  H01G9/00 ,  H01G9/008 ,  H01G9/048 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H01G9/035 ,  H01G9/08

CPC classification number: H05K1/18 ,  H01G9/00 ,  H05K1/16 ,  H05K1/0201 ,  H05K1/162 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10446

Abstract: Anodized aluminum anode and cathode foils are interleaved in a stack separated by spacers saturated with electrolyte in an enclosure. The anode foils and cathode foils have tabs which protrude from the housing and are cold welded to leads outside the housing, where they are not exposed to electrolyte. This permits using copper leads, which can be soldered to traces on a printed circuit board. A flat capacitor can be fixed underneath a PCB or even used as the substrate for a circuit, resulting in high volume efficiencies and the possibility of using it as a heat sink for other components.

Abstract translation: 阳极氧化的铝阳极和阴极箔在叠层中交错，由隔离物中的电解质饱和的间隔隔开。 阳极箔和阴极箔具有从壳体突出并且被冷焊接以引导到壳体外部的突片，在那里它们不暴露于电解质。 这允许使用铜引线，其可以焊接到印刷电路板上的迹线。 扁平电容器可以固定在PCB下面，甚至可以用作电路的基板，从而产生高体积效率，也可以将其用作其它部件的散热片。

公开(公告)号：US5966294A

公开(公告)日：1999-10-12

申请号：US991895

申请日：1997-12-16

Applicant: Takashi Harada ,  Hideki Sasaki

Inventor： Takashi Harada ,  Hideki Sasaki

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/16 ,  H05K3/40 ,  H05K9/00 ,  H05K7/02

CPC classification number: H05K1/0234 ,  H05K1/0233 ,  H05K1/167 ,  H05K9/0039 ,  H05K1/0231 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09354 ,  H05K2201/10022 ,  H05K2201/10446 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K3/403 ,  Y02P70/611

Abstract: There is provided a printed circuit board including (a) at least one dielectric layer, (b) at least two metal layers one of which acts as a ground layer, another one of which acts as a power-supplying layer, and the others of which, if any, act as a wiring layer in which a signal pattern is formed, the dielectric layer and the metal layers being alternately formed one on another, and (c) at least one resistor disposed at a marginal end of the printed circuit board between the ground layer and the power-supplying layer, the resistor having a function of disallowing current communication between the ground layer and the power-supplying layer. The above-mentioned printed circuit board prevents fluctuation in a voltage between ground and a power-supply, and further prevents unintentional electromagnetic interference and circuit malfunction caused by invasion of external electromagnetic field thereinto.

Abstract translation: 提供了一种印刷电路板，包括：（a）至少一个介电层，（b）至少两个金属层，其中一个用作接地层，另一个用作供电层，其余的 如果有的话，其作为其中形成信号图案的布线层，电介质层和金属层彼此交替地形成，并且（c）至少一个电阻器设置在印刷电路板的边缘端 在接地层和供电层之间，电阻器具有不允许接地层和供电层之间的电流连通的功能。 上述印刷电路板防止接地和电源之间的电压波动，并且进一步防止由于外部电磁场的侵入引起的无意的电磁干扰和电路故障。

公开(公告)号：US5788511A

公开(公告)日：1998-08-04

申请号：US613289

申请日：1996-03-11

Applicant: Randy J. Burnworth ,  Kenneth C. Tate

Inventor： Randy J. Burnworth ,  Kenneth C. Tate

IPC: H01R12/50 ,  H01R12/57 ,  H01R12/71 ,  H01R24/50 ,  H05K1/00 ,  H05K3/30 ,  H01R9/09

CPC classification number: H05K3/306 ,  H01R12/57 ,  H01R24/50 ,  H05K1/0295 ,  H01R12/716 ,  H01R2103/00 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A universal connector pad is intended for use on a printed circuit board and is used to connect a variety of connector types to the printed circuit board, without having to provide a specific connector pad layout which is unique to a specific connector type. The connector pad includes multiple rows and columns of solder pads, which receive a variety of connectors, wherein at least some of the solder pads are usable by more than one type of connector.

Abstract translation: 通用连接器焊盘用于印刷电路板上，用于将各种连接器类型连接到印刷电路板，而不必提供特定连接器类型独有的特定连接器焊盘布局。 连接器焊盘包括多个排和多个焊盘，其接收各种连接器，其中至少一些焊盘可由多于一种类型的连接器使用。

公开(公告)号：US5688146A

公开(公告)日：1997-11-18

申请号：US686982

申请日：1996-07-25

Applicant: William J. McGinley ,  John R. Cannon ,  William J. Green ,  Richard P. Zanardo

Inventor： William J. McGinley ,  John R. Cannon ,  William J. Green ,  Richard P. Zanardo

IPC: C09K19/38 ,  H01R12/71 ,  H01R13/03 ,  H01R24/00 ,  H01R43/16 ,  H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R23/70

CPC classification number: H05K3/0014 ,  H01R12/716 ,  H01R13/035 ,  H05K1/119 ,  H05K3/326 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/117 ,  H05K2201/0141 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K3/366 ,  Y10S428/901 ,  Y10S439/931

Abstract: A conductive component for carrying electrical signals constructed from a molded polymer substrate and a conductive coating adhered to the substrate, the coating defining a continuous electrical pathway between at least two terminals. Preferably, molded plastic such as liquid crystal polymer is formed to make circuits having conductive ink adhered thereto in order to provide inexpensive and versatile printed circuit boards for carrying electrical traces and other components and to provide printed formed contacts. The conductive solderable inks can be adhered to the substrate, for example, via screen printing, brush, spraying, dipping, masking, vacuum plating or vacuum deposition with subsequent oven drying, reflowing in a vapor phase, post curing or plating.

公开(公告)号：US5632650A

公开(公告)日：1997-05-27

申请号：US554313

申请日：1995-11-08

Applicant: Clyde W. Boling ,  Charles E. Connoley

Inventor： Clyde W. Boling ,  Charles E. Connoley

IPC: H01R43/20 ,  H01R43/02 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H01R13/73

CPC classification number: H05K3/303 ,  H01R43/0256 ,  H01R43/0263 ,  H01R12/724 ,  H05K2201/09127 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2203/167 ,  H05K3/0097 ,  Y02P70/613

Abstract: Electronic components utilize the waste areas of panelized circuit boards to provide self-fixturing of the components to the circuit boards prior to soldering. The components, connectors in particular, include a main body or housing intended to remain with the circuit board after assembly and one or more locator tabs extending from the housing into the waste area or areas of the panelized circuit board. A weakened area located between the housing and the locator tab facilitates separation of the locator tab from the housing and permits the locator tab or tabs to be easily removed at the same time the waste area of the circuit board is removed from the useful area.

Abstract translation: 电子部件利用镶板电路板的废弃区域，在焊接之前，将组件自身固定在电路板上。 组件，连接器尤其包括主体或外壳，用于在组装之后保持在电路板上，并且一个或多个定位器突片从壳体延伸到镶板电路板的废物区域或区域中。 位于外壳和定位器接头之间的弱化区域有助于将定位器突片与壳体分开，并且允许在电路板的废物区域从有用区域移除的同时容易地移除定位器突片或突片。