公开(公告)号：US6054761A

公开(公告)日：2000-04-25

申请号：US203126

申请日：1998-12-01

Applicant: Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

Inventor： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

IPC: C08K3/00 ,  C08L63/00 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H01L23/04

CPC classification number: H05K3/363 ,  H01L23/49883 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H01L2224/16503 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455 ,  H05K3/321 ,  H05K3/4623

Abstract: Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400.degree. C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25.degree. C.

Abstract translation: 公开了印刷电路基板和包括导电组合物的电气组件。 印刷电路基板和电组件实施例包括第一导电区域和第二导电区域。 电介质层设置在第一和第二导电区域之间。 在电介质层中设置孔，并且包括导电组合物的通孔结构设置在孔中。 导电组合物优选处于固化状态并与第一和第二导电区域电连通。 在优选的实施方案中，导电组合物包含至少约75wt。 基于组合物的重量％。 至少50重量％的导电颗粒具有小于约400℃的熔点。该组合物还包括载体，其包含至少约50重量％的量的环氧官能树脂。 基于载体的重量，以及基于载体重量的至少约0.1重量％的助熔剂。 环氧官能树脂在25℃下的粘度可以小于约1000厘泊

公开(公告)号：US5936848A

公开(公告)日：1999-08-10

申请号：US087793

申请日：1998-05-29

Applicant: Behrooz Mehr ,  Tony Kean-Lee Lim ,  Agnes Seok-Tuan Lim ,  Michael Barrow

Inventor： Behrooz Mehr ,  Tony Kean-Lee Lim ,  Agnes Seok-Tuan Lim ,  Michael Barrow

IPC: B23K1/00 ,  B23K11/11 ,  H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K7/02

CPC classification number: B23K11/11 ,  B23K1/0016 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/0094 ,  H05K3/3436 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/113 ,  H05K1/114 ,  H05K2201/0959 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/1178 ,  H05K2203/1394 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3478 ,  Y02P70/613

Abstract: An electronics package includes a substrate, a via and a solder ball. The substrate has first and second opposed surfaces. The via is located within the substrate and terminates at the first surface. The via defines an opening having first and second opposed walls. The solder ball is at least partially located over the opening. The solder ball has first and second opposed sides, the first side being adjacent the first wall and the second side being adjacent the second wall. The first side is nearer to the first wall than the second side is to the second wall.

Abstract translation: 电子封装包括衬底，通孔和焊球。 衬底具有第一和第二相对表面。 通孔位于衬底内并终止于第一表面。 通孔限定了具有第一和第二相对壁的开口。 焊球至少部分地位于开口上方。 焊球具有第一和第二相对侧，第一侧邻近第一壁并且第二侧邻近第二壁。 第一侧比第二面靠近第二面墙更靠近第一面。

公开(公告)号：US5923535A

公开(公告)日：1999-07-13

申请号：US959270

申请日：1997-10-28

Applicant: Yuzo Shimada ,  Takayuki Suyama ,  Shinichi Hasegawa

Inventor： Yuzo Shimada ,  Takayuki Suyama ,  Shinichi Hasegawa

IPC: H01L23/498 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K1/03

CPC classification number: H01L23/4985 ,  H05K3/3436 ,  H05K3/363 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/141 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/0058 ,  H05K3/3457 ,  H05K3/368 ,  Y02P70/613

Abstract: An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.

Abstract translation: 电子设备组件包括刚性的第一衬底和第二衬底。 第一基板在上表面具有第一焊盘，在第一焊盘的位置具有通孔。 第二衬底在其上表面上具有第二衬垫。 第一和第二焊盘通过焊料连接。 焊料的至少一部分位于第一基板的通孔中。 第一基板可以包括柔性基板和刚性板。 通孔设置在柔性基板中。 第一衬垫设置在柔性衬底的下表面上。 刚性板附着在柔性基板上。 该板在通孔的位置处具有孔，以使第一垫可达。

公开(公告)号：US5914859A

公开(公告)日：1999-06-22

申请号：US837793

申请日：1997-04-22

Applicant: Masaru Takada ,  Kiyotaka Tsukada ,  Morio Nakao

Inventor： Masaru Takada ,  Kiyotaka Tsukada ,  Morio Nakao

IPC: H05K1/02 ,  H01L23/36 ,  H01L23/498 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K3/44 ,  H05K9/00 ,  H05K7/20

CPC classification number: H05K9/0039 ,  H01L23/36 ,  H01L23/49827 ,  H05K3/44 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K2201/066 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/386 ,  Y10T29/49128

Abstract: An electronic component mounting base board comprises an insulating substrate provided with a mounting portion for mounting an electronic component and a heat-sink plate disposed on an lower surface of the insulating substrate, in which the insulating substrate is provided with a wiring pattern for signal or power, a grounding pattern and a grounding hole, and the grounding hole is provided on its inner wall with a metal plated film for electrically connecting to the grounding pattern and a solder is filled in an inside of the grounding hole for electrically connecting to the heat-sink plate.

Abstract translation: 电子部件安装基板包括设置有用于安装电子部件的安装部分和设置在绝缘基板的下表面上的散热板的绝缘基板，其中绝缘基板设置有用于信号的布线图案或 电源，接地图案和接地孔，并且接地孔在其内壁上设置有用于电连接到接地图案的金属镀膜，并且焊料填充在接地孔的内部，用于电连接到热 贴板

公开(公告)号：US5852397A

公开(公告)日：1998-12-22

申请号：US900787

申请日：1997-07-25

Applicant: Chi-Ming Chan ,  Michael Zhang ,  Daniel Chandler ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

Inventor： Chi-Ming Chan ,  Michael Zhang ,  Daniel Chandler ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

IPC: H01C1/14 ,  H01C7/02 ,  H01C17/065 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01C7/10

CPC classification number: H05K1/184 ,  H01C1/14 ,  H01C1/1406 ,  H01C17/06586 ,  H01C7/027 ,  H05K3/3442 ,  H05K1/182 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  H05K3/0097 ,  H05K3/403 ,  Y02P70/613 ,  Y10T29/49085 ,  Y10T29/49101 ,  Y10T29/49103

Abstract: A circuit protection device which comprises first and second laminar electrodes; a laminar PTC conductive polymer resistive element sandwiched between the electrodes; a third laminar conductive member which is secured to the same face of the PTC element as the second electrode but is separated therefrom; and an electrical connector which connects the third conductive member and the first electrode. This permits connection to both electrodes from the same side of the device, so that the device can be connected flat on a printed circuit board, with the first electrode on top, without any need for leads. The connector is preferably a cross-conductor which passes through an aperture in the PTC element, because this makes it possible to carry out the steps for preparing the devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

Abstract translation: 一种电路保护装置，包括第一和第二层状电极; 夹在电极之间的层状PTC导电聚合物电阻元件; 第三层状导电构件，其固定到PTC元件的与第二电极相同的表面，但与其分离; 以及连接第三导电构件和第一电极的电连接器。 这允许从器件的相同侧连接到两个电极，使得器件可以平坦地连接在印刷电路板上，第一电极在顶部，而不需要引线。 连接器优选是穿过PTC元件中的孔的交叉导体，因为这使得可以在对应于多个单独装置的组件上执行用于准备装置的步骤，将组件划分为 最后一步。

公开(公告)号：US5838519A

公开(公告)日：1998-11-17

申请号：US928922

申请日：1997-09-12

Applicant: Toshimitsu Takizawa ,  Takahiro Asano ,  Nobuyuki Tanaka

Inventor： Toshimitsu Takizawa ,  Takahiro Asano ,  Nobuyuki Tanaka

IPC: G11B21/02 ,  G11B5/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  G11B5/55

CPC classification number: G11B5/486 ,  H05K3/363 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/113 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K3/3473 ,  H05K3/3494 ,  H05K3/4007

Abstract: A bump of an electrically conductive metal protrudes from an electrode pad of a junction FPC. The bump includes a lead portion that penetrates a conductor pattern and a base layer of the junction FPC and projects on the back side of the base layer. A spare solder layer is formed on the surface of the bump. In soldering the electrode pad of the junction FPC to a connecting pad of a main FPC, the bump and the connecting pad are opposed to each other, and a heat source is pressed against the lead portion of the bump from the side of the base layer of the junction FPC. Heat is transmitted to the spare solder layer through the lead portion and the bump, whereupon the spare solder layer is melted for soldering.

Abstract translation: 导电金属的凸起从接合FPC的电极焊盘突出。 凸块包括穿过导体图案的引线部分和接合FPC的基底层并突出在基底层的背面上。 在凸块的表面上形成备用焊料层。 在将FPC的电极焊盘焊接到主FPC的连接焊盘的同时，凸起和连接焊盘彼此相对，并且热源从基层的一侧压靠在凸块的引线部分 的FPC。 热量通过引线部分和凸块传输到备用焊料层，随后将备用焊料层熔化以进行焊接。

公开(公告)号：US5722160A

公开(公告)日：1998-03-03

申请号：US547811

申请日：1995-10-25

Applicant: Yasuhiro Uemura ,  Masakazu Sakaue

Inventor： Yasuhiro Uemura ,  Masakazu Sakaue

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/42

CPC classification number: H01L24/73 ,  H05K3/3436 ,  H01L2224/16237 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/351 ,  H05K1/11 ,  H05K2201/094 ,  H05K2201/10666 ,  H05K2203/0455 ,  H05K3/3431 ,  H05K3/3484 ,  H05K3/42 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A packaging method of an electronic component for packaging the electronic component to a packaging substrate comprises the steps of: forming a predetermined quantity of solder bumps at connection portions of the electronic component; forming through-holes and pads on the packaging substrate in such a manner as to correspond to the solder bumps; applying a solder paste to pad portions of the through-holes and the pads formed on the surface of the packaging substrate in such a manner as to attain a specific quantity of solder components with the predetermined quantity of the solder bump; and heating the electronic component and the packaging substrate to a predetermined temperature such that button-shaped connection bumps having a predetermined height are formed between the pads and the packaging substrate so as to connect the electronic component and the packaging substrate and to keep a predetermined gap between the electronic component and the packaging substrate, and cylindrical-post connection bumps are formed between the through-holes and the packaging substrate in accordance with this predetermined gap so as to connect the electronic component and the packaging substrate. In this way, the cylindrical-post connection bumps are formed in association with the button-shaped connection bumps.

Abstract translation: 用于将电子部件封装到封装基板的电子部件的封装方法包括以下步骤：在电子部件的连接部形成规定量的焊料凸块; 以与所述焊料凸块相对应的方式在所述封装基板上形成通孔和焊盘; 以形成在所述封装基板的表面上的所述通孔和所述焊盘的焊盘部分的方式施加焊膏，以达到预定量的所述焊料凸块的特定量的焊料成分; 并且将电子部件和包装基板加热到预定温度，使得在焊盘和封装基板之间形成具有预定高度的按钮形连接凸块，以便连接电子部件和封装基板并保持预定的间隙 在电子部件和包装基板之间，并且根据该预定间隙在通孔和封装基板之间形成圆柱形连接凸起，以连接电子部件和封装基板。 以这种方式，圆柱形连接凸块与按钮形连接凸块相关联地形成。

公开(公告)号：US5706178A

公开(公告)日：1998-01-06

申请号：US603444

申请日：1996-02-20

Applicant: Michael Barrow

Inventor： Michael Barrow

IPC: B23K1/00 ,  B23K11/11 ,  H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K7/02

CPC classification number: H05K3/0094 ,  B23K1/0016 ,  B23K11/11 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/113 ,  H05K1/114 ,  H05K2201/0959 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/1178 ,  H05K2203/1394 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3478 ,  Y02P70/613

Abstract: A ball grid array (BGA) integrated circuit package which has a plurality of elliptically shaped solder pads located on a bottom surface of a package substrate. The bottom surface also has a solder mask which contains a number of holes that expose the solder pads. The holes allow solder balls to be attached to the solder pads. The solder balls can be reflowed to attach the package to a printed circuit board. The elliptical shaped solder pads have a width that is smaller than the length of the pads. The narrow pad portions provide additional routing space for the bottom surface of the package. The solder mask hole diameters are less than the lengths of the solder pads so that portions of the pads are anchored by the maskant material. The anchored portions increase the peel strength of the pads.

Abstract translation: 一种球栅阵列（BGA）集成电路封装，其具有位于封装衬底的底表面上的多个椭圆形焊盘。 底表面还具有包含许多露出焊盘的孔的焊接掩模。 这些孔允许焊球附着在焊盘上。 可以回流焊球以将封装附接到印刷电路板。 椭圆形焊盘的宽度小于焊盘的长度。 窄焊盘部分为封装的底表面提供额外的布线空间。 焊料掩模孔直径小于焊盘的长度，使得焊盘的部分被掩模材料锚定。 锚固部分​​增加了焊盘的剥离强度。

公开(公告)号：US5699610A

公开(公告)日：1997-12-23

申请号：US474019

申请日：1995-06-07

Applicant: Yuzo Shimada ,  Takayuki Suyama ,  Yoshimasa Tanaka ,  Shinichi Hasegawa

Inventor： Yuzo Shimada ,  Takayuki Suyama ,  Yoshimasa Tanaka ,  Shinichi Hasegawa

IPC: H01L21/48 ,  H01L23/40 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K13/34

CPC classification number: H01L21/486 ,  H01L23/4006 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/01 ,  H05K3/301 ,  H05K3/363 ,  H01L2023/4043 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K3/3457 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.

Abstract translation: 在第一步骤中，制备第一衬底。 第一基板具有第一表面，第二表面和它们之间的通孔。 在第二步骤中，制备第二衬底。 第二基板在第二基板的第一表面上具有第一表面，第二表面和焊盘。 在第三步骤中，在第二基板的焊盘上设置焊料。 在第四步骤中，第一基板的通孔位于焊料上。 第一基板的第二表面和第二基板的第一表面彼此面对。 在第五步骤中，焊料被加热以使焊料流入第一衬底的通孔中。 在第六步骤中，可以确认第一基板的第一表面上的焊料的外观，以检测焊料的连接。

公开(公告)号：US5644103A

公开(公告)日：1997-07-01

申请号：US337245

申请日：1994-11-10

Applicant: Stephen R. Pullen ,  Walter R. Hedlund, III

Inventor： Stephen R. Pullen ,  Walter R. Hedlund, III

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K5/00 ,  H05K7/20

CPC classification number: H05K7/20463 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/403 ,  H05K5/0095 ,  H05K7/209 ,  H01L2224/05553 ,  H01L2924/09701 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10666 ,  H05K2203/0455 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/368 ,  H05K3/42 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49211

Abstract: A structure includes a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.

Abstract translation: 一种结构包括基板，平行并邻近基板的电路板和电子部件。 电路板具有边缘形成的扇形边缘，扇形电镀有导电材料。 电子部件包括功率消散表面和用于进行电连接的焊盘。 电子部件安装有功率消散表面与基板接触，并且焊盘电连接到导电材料。