Abstract:
The invention relates to an apparatus and a method of producing molding materials and coatings on substrates by curing radiation-curable materials under an inert gas atmosphere by exposure to high-energy radiation.
Abstract:
A method and apparatus of coating a polymer solution on a substrate such as a semiconductor wafer. The apparatus includes a coating chamber having a rotatable chuck to support a substrate to be coated with a polymer solution. A dispenser to dispense the polymer solution over the substrate extends into the coating chamber. A vapor distributor having a solvent vapor generator communicable with the coating chamber is included to cause a solvent to be transformed into a solvent vapor. A carrier gas is mixed with the solvent vapor to form a carrier-solvent vapor mixture. The carrier-solvent vapor mixture is flown into the coating chamber to saturate the coating chamber. A solvent remover communicable with the coating chamber is included to remove excess solvent that does not get transformed into the solvent vapor to prevent the excess solvent from dropping on the substrate.
Abstract:
A method of curing free-radically curable compositions under an inert gas atmosphere, where the curing, which proceeds in accordance with a free-radical mechanism, is initiated, or initiated and maintained, in the free-radically curable compositions by radiation and the lateral escape of the inert gas atmosphere is prevented, which involves (1) immersing the free-radically curable compositions in an inert gas atmosphere below a depth from which the inert gas atmosphere constantly exhibits its lowest oxygen concentration, and (2) irradiating the free-radically curable compositions below this depth in the inert gas atmosphere, at least one of the radiation sources being arranged beneath the inert gas/air interface, and then (3) emersing the resultant cured compositions again from the inert gas atmosphere, and apparatus (1) according to FIG. 1 for its implementation.
Abstract:
A re-circulating cooling system can be used with a curing system in order to reduce the exhaust requirements for the system. Further, using a cooling fluid such as nitrogen reduces the production of ozone and the sealing requirements for the system. A simple heat exchanger can be used between return and supply reservoirs in order to remove heat added to the re-circulating fluid during circulation past the curing radiation source. The nitrogen can come from a nitrogen source, or from a membrane or other device operable to split feed gas into its molecular components to provide a source of gas rich in nitrogen. An ozone destruction unit can be used with such a cooling system to reduce the amount of ozone to acceptable levels, and to minimize consumption of the nitrogen. A catalyst can be used to deplete the ozone that does not get consumed during the reaction.
Abstract:
A method of producing an optical film comprising at least two ionizing radiation-curing layers on a transparent substrate, the method comprising: Step 1 of irradiating a layer A, which comprises two or more kinds of polymerization initiators having different absorption ends at a longer wavelength side in wavelength range of sensitivity to which they are sensitive, with an ionizing radiation having a wavelength to which at least one kind (a) of the polymerization initiators is not substantially sensitive and at least one kind (b) of the polymerization initiators is sensitive; and Step 2 of spreading a coating solution for layer B comprising at least one polymerization initiator (c) over the layer A after Step A and then irradiating the coating solution for layer B with an ionizing radiation having a wavelength to which the polymerization initiators (a) and (c) are sensitive.
Abstract:
The present invention provides an automated continuous coating apparatus for coating industrial components such as porcelain, glass, and polymeric insulators. The apparatus consists of a several stage continuous inline operation. The stages are a cleaning operation, followed by drying and heating, coating, and curing.
Abstract:
Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.
Abstract:
A web coating process and apparatus employing a coating applicator, dryer or curing station and web-handling equipment for conveying the web past the coating applicator and through the dryer. The web is enclosed from at least the coating applicator to the dryer or curing station in a close-coupled enclosure or series of close-coupled enclosures supplied with one or more streams of conditioned gas flowing at a rate sufficient to reduce materially the particle count or change materially a physical property of interest in a close-coupled enclosure.
Abstract:
A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.
Abstract:
A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.