公开(公告)号：US11742255B2

公开(公告)日：2023-08-29

申请号：US17128748

申请日：2020-12-21

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/367 ,  H01L31/0203 ,  H01L31/024 ,  H01L23/051 ,  H01L23/043 ,  H01L31/0232 ,  H01L21/48 ,  H01L23/373 ,  H01S5/024 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H01L33/48 ,  H01L33/58 ,  H01L33/64

CPC classification number: H01L23/3672 ,  H01L21/4803 ,  H01L21/4882 ,  H01L23/043 ,  H01L23/051 ,  H01L23/3675 ,  H01L23/3738 ,  H01L31/0203 ,  H01L31/02325 ,  H01S5/02469 ,  H01L31/024 ,  H01L31/02327 ,  H01L33/483 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0075 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

公开(公告)号：US20180301836A1

公开(公告)日：2018-10-18

申请号：US15490252

申请日：2017-04-18

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Michael David Herring

IPC: H01R12/73 ,  H01R12/70 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/117 ,  H01R12/7005 ,  H01R12/714 ,  H01R12/718 ,  H01R13/6275 ,  H01R13/6335 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10121 ,  H05K2201/10189

Abstract: A dual connector system includes a host circuit board, a first electrical connector at a front mounting area of the host circuit board, and a second electrical connector at a rear mounting area of the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has towers having ledges defining a gap between the upper mating surface and the ledges. The housing has biasing members at each tower facing the gap configured to engage the module circuit board to locate the module circuit board between the towers. The housing holds second contacts at the upper mating surface.

公开(公告)号：US20180240723A1

公开(公告)日：2018-08-23

申请号：US15958949

申请日：2018-04-20

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Lin Lu ,  Kai-Chiang Wu ,  Yen-Ping Wang ,  Shih-Wei Liang ,  Ching-Feng Yang

IPC: H01L23/24 ,  H01L21/56 ,  H01L25/10 ,  H01L21/48 ,  H05K1/18 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/24 ,  H01L21/481 ,  H01L21/4885 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H05K1/181 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure.

公开(公告)号：US20180190631A1

公开(公告)日：2018-07-05

申请号：US15798960

申请日：2017-10-31

Applicant: LG Display Co., Ltd.

Inventor： HanSeok Kim ,  JinYeong Kim ,  JaeWoo Park

IPC: H01L25/16 ,  H01L27/12 ,  H05K1/18 ,  H01L33/62 ,  H01L33/58 ,  H01L33/50 ,  H01L27/15 ,  H05K5/00 ,  G06F3/14

CPC classification number: H01L25/167 ,  G02F1/13336 ,  G02F1/13452 ,  G06F3/1446 ,  G09F9/3026 ,  G09F9/33 ,  H01L25/0753 ,  H01L25/162 ,  H01L25/165 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/156 ,  H01L27/3276 ,  H01L27/3293 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K5/0017 ,  H05K5/0021 ,  H05K2201/041 ,  H05K2201/049

Abstract: Disclosed is a display device and a multi-screen display device using the same, which include a minimized bezel area. The display device includes a display substrate including a plurality of subpixels, respectively provided in a plurality of pixel areas defined by a plurality of data lines and a plurality of gate lines, and a data pad part connected to each of the plurality of data lines in a one-to-one relationship and a data routing film adhered to the data pad part, the data routing film including a plurality of data routing lines respectively connected to the plurality of data lines. The data routing film is closely adhered to the display substrate to surround the data pad part, one side of the display substrate, and a rear surface of the display substrate overlapping the data pad part.

公开(公告)号：US09974177B2

公开(公告)日：2018-05-15

申请号：US14781603

申请日：2014-01-30

Applicant: OSRAM GmbH

Inventor： Thomas Preuschl ,  Peter Sachsenweger

IPC: H05K7/00 ,  H05K1/18 ,  F21V15/01 ,  F21V17/10 ,  F21V19/00 ,  F21V23/06 ,  H05K3/32 ,  F21K9/90 ,  F21K9/20 ,  F21V23/00 ,  F21V29/00 ,  F21V29/507 ,  F21Y105/00 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y115/15

CPC classification number: H05K1/18 ,  F21K9/20 ,  F21K9/90 ,  F21V15/01 ,  F21V17/10 ,  F21V17/101 ,  F21V19/0035 ,  F21V23/006 ,  F21V23/06 ,  F21V29/20 ,  F21V29/507 ,  F21V29/70 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  H05K1/182 ,  H05K3/32 ,  H05K2201/0311 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10962

Abstract: Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.

公开(公告)号：US20180035557A1

公开(公告)日：2018-02-01

申请号：US15547429

申请日：2015-12-18

Applicant: SEW-EURODRIVE GMBH & CO. KG

Inventor： Dirk MOMANN ,  Alexander KOLBERT

IPC: H05K5/00 ,  H05K5/02 ,  H05K5/04 ,  H05K1/11

CPC classification number: H05K5/0069 ,  H05K1/0286 ,  H05K1/115 ,  H05K5/0213 ,  H05K5/04 ,  H05K7/1432 ,  H05K2201/049 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10287

Abstract: An electrical device, for example, a converter, includes: a first circuit board, which includes first circuit traces and at least one plated-through hole, a second circuit board, which includes second circuit traces and at least one connection device, a power module, and a plug-connector part. The power module is placed on the first circuit board and is connected in an electrically conductive manner to the plated-through hole with the aid of the first circuit traces, the plug-connector part is placed on the second circuit board and is connected in an electrically conductive manner to the connection device with the aid of the second circuit traces, and the plated-through hole is connected in an electrically conductive manner with the aid of a cable to the connection device.

公开(公告)号：US09742972B2

公开(公告)日：2017-08-22

申请号：US15077829

申请日：2016-03-22

Applicant: Primax Electronics Ltd.

Inventor： Chin-Ding Lai ,  Ta-Sheng Yu ,  Han-Kai Wang

IPC: H04N5/225 ,  H04N5/232 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K1/14 ,  H05K3/36

CPC classification number: H04N5/2257 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23241 ,  H05K1/117 ,  H05K1/141 ,  H05K1/144 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/10121

Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.

公开(公告)号：US09673365B2

公开(公告)日：2017-06-06

申请号：US14771850

申请日：2014-03-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Haushalter ,  David O'Brien

IPC: H01L33/62 ,  H01L33/48 ,  H05K1/18 ,  H05K3/34 ,  F21K9/20 ,  H05K1/14

CPC classification number: H01L33/62 ,  F21K9/20 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/141 ,  H05K1/142 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09954 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.

公开(公告)号：US09671073B2

公开(公告)日：2017-06-06

申请号：US14051293

申请日：2013-10-10

Applicant: Dialight Corporation

Inventor： Klaus Oesterheld ,  Kenneth Jenkins

IPC: B60Q1/00 ,  F21K99/00 ,  H05K1/14 ,  H05K1/18 ,  F21K9/20 ,  H05K3/36 ,  F21W111/00

CPC classification number: F21K9/20 ,  F21W2111/00 ,  H05K1/141 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10106

Abstract: The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one light emitting diode (LED) die, one or more traces and at least one lens, a housing comprising at least one opening on a side along a perimeter of the housing, wherein the PCB is coupled to the housing such that a light output surface of the at least one LED die faces a same direction as the at least one opening and at least one alignment pin coupled to the housing.

公开(公告)号：US20170133240A1

公开(公告)日：2017-05-11

申请号：US15410620

申请日：2017-01-19

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L21/48 ,  H01L23/373 ,  H01S5/024 ,  H01L23/367

CPC classification number: H01L21/4882 ,  H01L21/4803 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3738 ,  H01L31/02327 ,  H01L31/024 ,  H01L33/483 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0075 ,  H01S5/02469 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174 ,  H01L2924/00

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.