公开(公告)号：US08497429B2

公开(公告)日：2013-07-30

申请号：US12727146

申请日：2010-03-18

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01B5/00 ,  H05K1/11 ,  H01R12/00 ,  H01R4/18 ,  H01R4/02

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

公开(公告)号：US20130003292A1

公开(公告)日：2013-01-03

申请号：US13223224

申请日：2011-08-31

Applicant: Brett W. DEGNER ,  Gregory Tice

Inventor： Brett W. DEGNER ,  Gregory Tice

IPC: G06F1/20 ,  H05K3/00

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract translation: 公开了一种适用于去除在紧凑的计算环境中工作的集成电路产生的多余热量的低轮廓散热系统。

公开(公告)号：US08236377B2

公开(公告)日：2012-08-07

申请号：US12095630

申请日：2006-12-04

Applicant: Erik Christian Nicolaas Puik ,  Edwin Johannes Theodorus Smulders

Inventor： Erik Christian Nicolaas Puik ,  Edwin Johannes Theodorus Smulders

IPC: B05D5/10

CPC classification number: H05K3/321 ,  B81C99/002 ,  B81C2203/032 ,  H01L21/6835 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2924/15312 ,  H05K3/28 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2203/0178 ,  H05K2203/1105 ,  H05K2203/1121 ,  H05K2203/1446

Abstract: Method and system for moving a frozen adhesive particle towards a target body, comprising launching means (13) which are arranged to launch the particle (2) in its frozen form towards the target body (3, 4) via a movement path (14) through a gap (15) between the launching means and the target body. The medium in the gap may have a temperature above the adhesive particle's melting temperature. The launching means may be arranged to launch the particle at a high speed. The launching means and the target body may have a geometry causing that the movement path is substantially vertical or substantially horizontal.

Abstract translation: 用于将冷冻粘合剂颗粒朝向目标体移动的方法和系统，包括发射装置（13），其布置成经由移动路径（14）将颗粒（2）以冷冻形式朝向目标体（3,4）发射， 通过发射装置和目标体之间的间隙（15）。 间隙中的介质可能具有高于粘合剂颗粒的熔融温度的温度。 发射装置可以被布置成以高速度发射颗粒。 发射装置和目标体可以具有导致运动路径基本上垂直或基本水平的几何形状。

公开(公告)号：US07944028B2

公开(公告)日：2011-05-17

申请号：US12154753

申请日：2008-05-27

Applicant: Don Saunders ,  Gabe Cherian

Inventor： Don Saunders ,  Gabe Cherian

IPC: H01L21/60

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

Abstract translation: 描述了两组互连设备和方法。 两者都在电子封装和电路板之间或芯片和衬底之间提供列等。 在第一组中，称为热挠性接触载体（TFCC），将柱元素从平面层压结构中雕刻出来，然后形成。 在第二组中，承载连接元件的载体由可溶或可移除的材料制成，其作为焊接掩模同时作用，以防止焊料沿着元件的芯部芯吸。

公开(公告)号：US20100175248A1

公开(公告)日：2010-07-15

申请号：US12659777

申请日：2010-03-22

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: H05K3/34

CPC classification number: H05K3/3436 ,  H05K1/0271 ,  H05K3/3426 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49171 ,  Y10T29/49176

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract translation: 本发明涉及一种用于将球栅阵列封装弹性地连接并电连接到电路板的柔性引线插入器。 插入器可以包括基板，多个焊盘和多个引脚。 多个焊盘可以基本上位于衬底的顶表面上并且以基本上对应于球栅阵列封装上的焊球图案的预定图案布置。 多个销可以被定位成基本上垂直于衬底并且可以延伸通过衬底和多个衬垫。 插入器可以被配置为将球栅阵列封装附接到电路板，使得球栅阵列封装上的每个焊球接触多个引脚和多个焊盘的至少一部分的至少一部分， 多个引脚中的每一个也连接到电路板上的触点。

公开(公告)号：US20090035454A1

公开(公告)日：2009-02-05

申请号：US12182043

申请日：2008-07-29

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: B05D5/00 ,  H05K7/00

CPC classification number: H05K3/284 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/185 ,  H05K3/321 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2203/1316 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Electrical components 402, 504, 506 are placed on a carrier 508. Then the components are encapsulated in an electrically insulating material 404. The carrier 508 is removed and the leads 414 of the encapsulated components are registered to intermediate connectors 412 in a central bonding, or joining, material 406 and to respective leads 410 of a printed circuit board 408. The components, central bonding material, and printed circuit board are then joined and interconnected.

Abstract translation: 电气部件402,504,506被放置在载体508上。然后将部件封装在电绝缘材料404中。移除载体508，并且封装的部件的引线414以中心粘合方式与中间连接器412配准， 或者将材料406连接到印刷电路板408的各个引线410.然后将部件，中心接合材料和印刷电路板接合并互连。

公开(公告)号：US20090034219A1

公开(公告)日：2009-02-05

申请号：US12184086

申请日：2008-07-31

Applicant: Nader Gamini ,  Joseph C. Fjelstad

Inventor： Nader Gamini ,  Joseph C. Fjelstad

IPC: H05K1/18 ,  H05K7/02

CPC classification number: H05K1/185 ,  H01L25/105 ,  H01L25/16 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H05K1/023 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.

Abstract translation: 公开了一种提高电路组件中的电气部件的密度的装置。 电子部件202,204被堆叠成使得它们彼此重叠并且被封装在电子绝缘材料104中。所得到的子组件可以集成到印刷电路板或反向互连工艺组件中。

公开(公告)号：US07484971B2

公开(公告)日：2009-02-03

申请号：US11604289

申请日：2006-11-27

Applicant: Mark W. Gailus ,  Leon M. Khilchenko

Inventor： Mark W. Gailus ,  Leon M. Khilchenko

IPC: H01R9/09

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

Abstract translation: 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

公开(公告)号：US07454550B2

公开(公告)日：2008-11-18

申请号：US11324918

申请日：2006-01-04

Applicant: James B. Benbow ,  Gary A. Finley ,  Ravi V. C. Chandran ,  Nathan A. Woods ,  Roman Kononov

Inventor： James B. Benbow ,  Gary A. Finley ,  Ravi V. C. Chandran ,  Nathan A. Woods ,  Roman Kononov

IPC: G06F13/36

CPC classification number: H05K1/141 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F15/7864 ,  H05K2201/049 ,  H05K2201/10212 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: Computing systems with conventional CPUs coupled to co-processors or accelerators implemented in FPGAs (Field Programmable Gate Arrays). One embodiment of the systems and methods according to the invention includes a FPGA accelerator implemented in a computer system by providing an adapter board configured to be used in a standard CPU socket.

Abstract translation: 具有耦合到FPGA（现场可编程门阵列）中实现的协处理器或加速器的常规CPU的计算系统。 根据本发明的系统和方法的一个实施例包括通过提供配置成在标准CPU插槽中使用的适配器板在计算机系统中实现的FPGA加速器。

公开(公告)号：US20080225503A1

公开(公告)日：2008-09-18

申请号：US11686827

申请日：2007-03-15

Applicant: Markus Wollmann ,  Abdallah Bacha ,  Andrea Becker ,  Mathias Boettcher ,  Simon Muff ,  Steffen Seifert

Inventor： Markus Wollmann ,  Abdallah Bacha ,  Andrea Becker ,  Mathias Boettcher ,  Simon Muff ,  Steffen Seifert

IPC: H05K7/00 ,  H01S4/00

CPC classification number: H05K1/023 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49002

Abstract: An electronic system with integrated circuit device and passive component is disclosed. One embodiment provides a printed circuit board, a method for fabricating an electronic system, and an electronic system, including at least one integrated circuit device and at least one passive component, wherein the passive component is arranged at least partially underneath the integrated circuit device.

Abstract translation: 公开了一种具有集成电路器件和无源器件的电子系统。 一个实施例提供一种印刷电路板，一种用于制造电子系统的方法以及包括至少一个集成电路装置和至少一个无源部件的电子系统，其中无源组件至少部分地布置在集成电路装置下方。