公开(公告)号：US20130087376A1

公开(公告)日：2013-04-11

申请号：US13616381

申请日：2012-09-14

Applicant: Yasuo MORIYA

Inventor： Yasuo MORIYA

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/3436 ,  H01L23/145 ,  H01L23/49811 ,  H01L24/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/351 ,  H05K1/0366 ,  H05K3/0014 ,  H05K3/4092 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0311 ,  H05K2201/09118 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00

Abstract: An interposer includes a substrate having first and second opposing surfaces, the substrate having a sheet shape; and a plurality of spring electrodes fixed to the substrate in a certain arrangement, each of the plurality of the spring electrodes including a first pad disposed opposite the first surface of the mesh and extending in a first direction, a second pad disposed opposite the second surface of the mesh and extending in the first direction, and a post extending through the substrate between the first and second surfaces and connecting an end of the first pad to an end of the second pad.

Abstract translation: 内插件包括具有第一和第二相对表面的基板，所述基板具有片状; 以及多个弹簧电极，以一定的布置方式固定到基板上，多个弹簧电极中的每一个包括与网格的第一表面相对设置并沿第一方向延伸的第一垫片，与第二表面相对设置的第二垫片 并且在所述第一表面和所述第二表面之间延伸穿过所述基底的柱，并且将所述第一垫的端部连接到所述第二垫的端部。

公开(公告)号：US08410610B2

公开(公告)日：2013-04-02

申请号：US12734192

申请日：2008-10-16

Applicant: Toshio Kazama ,  Shigeki Ishikawa

Inventor： Toshio Kazama ,  Shigeki Ishikawa

IPC: H01L23/48

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01R12/714 ,  H01R13/2407 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。 为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状， 其表面的至少一部分形成曲面。 每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。 所有端子部分可以在厚度方向的各个尖端部分层叠。

公开(公告)号：US08405198B2

公开(公告)日：2013-03-26

申请号：US12471188

申请日：2009-05-22

Applicant: Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

Inventor： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC: H01L23/52

CPC classification number: H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05599 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81903 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/0311 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2924/01015 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

Abstract translation: 封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂 区域，以及响应于互连区域中的化学活化剂的粘合剂。 封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂 另一方面是垫片芯片或弹簧芯片。 一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂 芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

公开(公告)号：US20130021772A1

公开(公告)日：2013-01-24

申请号：US13206532

申请日：2011-08-10

Applicant: JUN-YI XIAO

Inventor： JUN-YI XIAO

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H01L25/50 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/0715 ,  H05K2203/1316 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate.Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract translation: 封装结构包括基板，在基板上构造和构造的多个电子部件，电连接到基板的多个金属弹性单元以及将多个电子部件和多个弹性单元一起封装的封装体，以及 基质。 离开基板的多个金属弹性单元中的每一个的一部分从包封体的外表面露出。

公开(公告)号：US20120327574A1

公开(公告)日：2012-12-27

申请号：US13528074

申请日：2012-06-20

Applicant: Hideaki SAKAGUCHI ,  Akinori Shiraishi

Inventor： Hideaki SAKAGUCHI ,  Akinori Shiraishi

IPC: H05K7/00

CPC classification number: H05K1/181 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/83385 ,  H05K3/3436 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10674 ,  H05K2201/10962 ,  Y02P70/611

Abstract: At least one embodiment provides an electronic component including: connection electrodes; and flexible electrode terminals connected to the respective connection electrodes so that spaces are formed under the respective flexible electrode terminals, each flexible electrode terminal having a main body and a connection projection provided on a top surface of the main body, each flexible electrode terminal being elastically deformable when receiving pressure.

Abstract translation: 至少一个实施例提供一种电子部件，包括：连接电极; 以及连接到各个连接电极的柔性电极端子，使得在各个柔性电极端子之下形成空间，每个柔性电极端子具有主体和设置在主体的顶表面上的连接突起，每个柔性电极端子弹性地 接收压力时可变形。

公开(公告)号：US20120302095A1

公开(公告)日：2012-11-29

申请号：US13455112

申请日：2012-04-24

Applicant: Erik J. Shahoian

Inventor： Erik J. Shahoian

IPC: H01R13/648 ,  H05K3/00

CPC classification number: H01R13/6594 ,  H01R12/7011 ,  H01R12/716 ,  H01R13/6581 ,  H05K1/0219 ,  H05K3/326 ,  H05K3/34 ,  H05K2201/0311 ,  H05K2201/10356 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/10962 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: High-speed interposer connectors that may be space-efficient, reliable, and may be readily manufactured. One example may provide an interposer connector that may be particularly space-efficient in a vertical direction by using an interposer to form an electrical connection between conductors and a main-logic board or other appropriate substrate. Another example may provide a reliable connection between conductors and a main-logic board by using fasteners to fix an interposer to the main-logic board. Another example may provide connectors that are well-suited to handling high-speed signals by providing a shield to at least partially cover a top of an interposer connector.

Abstract translation: 高速插入器连接器可以节省空间，可靠，并且可以容易地制造。 一个示例可以提供一种插入器连接器，其可以通过使用插入器在导体和主逻辑板或其他适当的衬底之间形成电连接而在垂直方向上特别空间高效。 另一个例子可以通过使用紧固件将插入件固定到主逻辑板来提供导体和主逻辑板之间的可靠连接。 另一个示例可以提供通过提供屏蔽以至少部分地覆盖插入器连接器的顶部而非常适合于处理高速信号的连接器。

公开(公告)号：US08294561B2

公开(公告)日：2012-10-23

申请号：US12598890

申请日：2008-05-07

Applicant: Martin Strahm ,  Michael Geiser ,  Pierre Gandel ,  Guillaume Loussert

Inventor： Martin Strahm ,  Michael Geiser ,  Pierre Gandel ,  Guillaume Loussert

IPC: B60Q1/00

CPC classification number: H01R12/58 ,  H01R12/57 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10659

Abstract: The present invention relates to a dashboard indicator module comprising, in a casing, a rotary motor, an output shaft, mechanical reduction device associated with the motor, at least one electrical supply coil, electrical connection tabs linked to the coils leaving the casing and electrical contact elements, characterized in that the electrical contact elements can be fitted on the connection tabs in order to produce solderless connectors on the printed circuit or even removed from the connection tabs in order to allow the connection tabs of the motor to be soldered directly to the printed circuit.

Abstract translation: 本发明涉及一种仪表板指示器模块，其包括在壳体中的旋转马达，输出轴，与马达相关联的机械减速装置，至少一个供电线圈，连接到离开外壳的线圈的电连接翼片和电气 接触元件，其特征在于，电接触元件可以安装在连接接片上，以便在印刷电路上产生无焊接连接器，或者甚至从连接接线片上移除，以便允许电动机的连接接头直接焊接到 印刷电路

公开(公告)号：US08287285B2

公开(公告)日：2012-10-16

申请号：US12910050

申请日：2010-10-22

Applicant: Steven M. Mainville ,  Sreeniwas Ranganathan ,  Bryan Shafer ,  Scott W. Mee

Inventor： Steven M. Mainville ,  Sreeniwas Ranganathan ,  Bryan Shafer ,  Scott W. Mee

IPC: B60R13/02

CPC classification number: H05K1/0215 ,  B60R13/02 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/2018 ,  Y10T29/49124

Abstract: A vehicle interior assembly includes an electronic sub-assembly and a conductive interior trim component at least partially disposed about the electronic sub-assembly. The conductive interior trim component is electrically coupled to a conductive structure at a reference potential.

Abstract translation: 车辆内部组件包括电子子组件和至少部分地布置在电子子组件周围的导电内部装饰组件。 导电内部装饰部件以参考电位电耦合到导电结构。

公开(公告)号：US08203845B2

公开(公告)日：2012-06-19

申请号：US12351658

申请日：2009-01-09

Applicant: Jean-Luc Croy ,  Robert Arnould ,  Geneviève Gr{dot over (a)}ndjean ,  Benoît Box ,  Jean-Marie Bariller ,  Hervé Mathieu

Inventor： Jean-Luc Croy ,  Robert Arnould ,  Geneviève Gr{dot over (a)}ndjean ,  Benoît Box ,  Jean-Marie Bariller ,  Hervé Mathieu

IPC: H05K7/00

CPC classification number: H05K3/325 ,  H05K3/301 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10598 ,  H05K2201/10969 ,  Y02P70/611

Abstract: The invention relates to an electronics card (1) comprising a printed circuit board (2) and a piece of equipment (3) such as a motor or a loudspeaker fastened to said printed circuit board (2). The piece of equipment (3) is fastened to a face (4) of the printed circuit board (2) by snap-fastening in metal clips (6, 7) that project from said face (4), each clip (6, 7) having a first end (8, 9) fastened to said face (4) of the printed circuit board (2) by soldering, and a second end (11, 12) bearing resiliently on a corresponding portion of the piece of equipment (3) for holding it pressed against said face (4) of the printed circuit board (2). The invention applies in particular to electronics cards for motor vehicles.

Abstract translation: 本发明涉及一种电子卡（1），其包括印刷电路板（2）和固定到所述印刷电路板（2）上的马达或扬声器等设备（3）。 通过卡扣紧固在从所述面（4）突出的金属夹（6,7）中，将所述设备（3）紧固到所述印刷电路板（2）的表面（4），每个夹子 ）具有通过焊接固定到印刷电路板（2）的所述面（4）的第一端（8,9）和弹性地支承在所述设备（3）的相应部分上的第二端（11,12） ），用于将其按压在印刷电路板（2）的所述面（4）上。 本发明特别适用于机动车辆的电子卡片。

公开(公告)号：US08159830B2

公开(公告)日：2012-04-17

申请号：US12426106

申请日：2009-04-17

Applicant: Laurent Sustek ,  Stephane Di Vito

Inventor： Laurent Sustek ,  Stephane Di Vito

IPC: H01L23/02

CPC classification number: H05K3/3442 ,  G06K19/07745 ,  H01L2224/48091 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A device includes a carrier and an integrated circuit chip having a first side supported by the carrier and a second side having contacts. The carrier has multiple carrier contacts supported by the carrier and separated from the integrated circuit chip. Multiple leads are coupled between the contacts on the integrated circuit chip and the multiple carrier contacts. A resin encapsulates the integrated circuit chip leaving the multiple carrier contacts at least partially uncovered for attaching to a card or board.

Abstract translation: 一种器件包括载体和集成电路芯片，其具有由载体支撑的第一侧和具有触点的第二侧。 载体具有由载体支撑并且与集成电路芯片分离的多个载体接触。 多个引线耦合在集成电路芯片上的触点和多个载体触点之间。 树脂将集成电路芯片封装起来，使得多个载体接触件至少部分地不被覆盖以附接到卡或板上。